• 에너지공학
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• 제24권2호
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• pp.84-90
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• 2015

Hydrogen has some remarkably high values of the key properties for transport processes, such as kinematic viscosity, thermal conductivity and diffusion coefficient. Hydrogen, as an energy medium, has some distinct benefits for its high efficiency and convenience in storage, transportation and conversion. Hydrogen has much wider limits of flammability in air than methane, propane or gasoline and the minimum ignition energy is about an order of magnitude lower than for other combustibles. Statistical thermodynamics provides the relationships that we need in order to bridge this gap between the macro and the micro. Our most important application will involve the calculation of the thermodynamic properties of the ideal gas.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권6호
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• pp.293-299
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• 2004

In this paper, thermal and mechanical properties of electric epoxy with water aging were discussed. We made elastic epoxy specimen adding a ratio of 0〔phr〕20〔phr〕, 35〔phr〕 and 53〔phr〕 with modifier to existing epoxy. We studied mechanical property of elastic resin after absorption in water from 0 to 484 hours. As a result, diffusion factor of elastic epoxy showed 20-21${\times}$10$^{-4}$ $\textrm{mm}^2$/s and general epoxy showed 9.5${\times}$10$^{-4}$ $\textrm{mm}^2$/s. Elastic property increased linearly according to addiction and decreased according to water absorption. Tensile strength was reduced according to addition. It was affected by water absorption of micro-void of elastic epoxy. Hardness inclined to decrease after increasing according to absorbed time. In water-absorption state, it was experimented a change of heat flow by temperature of elastic epoxy and change of thermal expansion coefficient. DSC (Differential Scanning Calorimetry) and TMA (Thermomechanical Analysis) equipments were used to measure Tg. A temperature ringe of DSC was from -0($^{\circ}C$) to 200($^{\circ}C$). One of TMA was from -0($^{\circ}C$) to 350($^{\circ}C$). In addition, we investigated structural analysis of water absorbed specimen using SEM (Scanning Electron Microscope).

• 한국재료학회지
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• 제1권4호
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• pp.221-228
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• 1991

본 연구는 computerdisk drive와 VTR head에 사용되어 지고 있는 ferrite head cores의 gap 형성에 적합한 유리의 봉착특성에 관하여 고찰하였다. 유리의 특성측정은 열팽창 계수, 미세경도, 내마모성을 측정하였으며 계면에서의 원소 농도분포는 WDS에 의해 관찰하였고 젖음성은 고온 현미경으로 측정하였다. 그 결과는 다음과 같다. 1. $PbO-B_2O_3$계 봉착용 유리에 있어서 PbO의 함량이 증가함에 따라 열팽창계수와 마모량이 증가하였으며 $B_2O_3$함량이 증가함에 따라서는 열팽창계수와 마모량이 감소하였다. 2. $PbO-B_2O_3$계 유리에 있어서 contact angle은 PbO함량에 주로 영향을 받는다. 3. 열팽창계수의 증가에 따라 봉착온도는 비례적으로 낮아지는 경향을 나타내었다. 4. Mn-Zn single crystal ferrite와 $PbO-B_2O_3$계 봉착용유리의 융착 계면에서의 확산은 ferrite성분이 glass측으로 소량확산이 이루어졌으며 봉착 열처리 시간에 따라서는 거의 영향을 받지 않았다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• 대한기계학회논문집 C: 기술과 교육
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• 제1권2호
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• pp.179-186
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• 2013

혈액순환촉진, 심혈관계치료, 피부질환, 암세포억제 등의 의료분야에 원적외선 치료법이 광범위하게 활용되고 있다. 본 연구에서는 원적외선 치료에 효과적인 패널형 방사체의 발열부에 대한 열적 특성을 실험적으로 분석하였다. 발열선은 정상상태에서 절연피복에 $150mW/m^2$의 열유속으로 열에너지를 공급하여 절연피복은 발열선 온도의 20%에 도달하였다. 단열막 사용은 약 20%의 발열판 표면온도 증가효과가 있었으며 열시상수를 상승시켜 혈액순환촉진에 크게 기여하는 것으로 나타났다. 발열선의 배치간격이 발열부 설계에 중요한 인자이며 열확산의 중첩을 위해 발열판의 열전도계수와 밀도를 고려해야함을 알 수 있었다.

• 센서학회지
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• 제29권1호
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• pp.27-32
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• 2020

This study proposes a pixel-patterning method for organic light-emitting diodes (OLEDs) based on thermal transfer. An infrared lamp was introduced as a heat source, and glass type donor element, which absorbs infrared and generates heat and then transfers the organic layer to the substrate, was designed to selectively sublimate the organic material. A 200 nm-thick layer of molybdenum (Mo) was used as the lightto-heat conversion (LTHC) layer, and a 300 nm-thick layer of patterned silicon dioxide (SiO₂), featuring a low heat-transfer coefficient, was formed on top of the LTHC layer to selectively block heat transfer. To prevent the thermal oxidation and diffusion of the LTHC material, a 100 nm-thick layer of silicon nitride (SiN_x) was coated on the material. The fabricated donor glass exhibited appropriate temperature-increment property until 249 ℃, which is enough to evaporate the organic materials. The alpha-step thickness profiler and X-ray reflection (XRR) analysis revealed that the thickness of the transferred film decreased with increase in film density. In the patterning test, we achieved a 100 ㎛-long line and dot pattern with a high transfer accuracy and a mean deviation of ± 4.49 ㎛. By using the thermal-transfer process, we also fabricated a red phosphorescent device to confirm that the emissive layer was transferred well without the separation of the host and the dopant owing to a difference in their evaporation temperatures. Consequently, its efficiency suffered a minor decline owing to the oxidation of the material caused by the poor vacuum pressure of the process chamber; however, it exhibited an identical color property.

• 한국재료학회지
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• 제11권4호
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• pp.305-311
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• 2001

PDP용 투명유전체 재료로 사용되는 $PbO-B_2O_3-SiO_2-Al_2O_3$계의 소성과정 중에서 투명전극 (ITO)과의 반응성 및 광학적, 열적, 전기적 특성을 조사하였다. 본 연구에서 유전체막.두께는 12$\mu\textrm{m}$으로, 온도는 550-58$0^{\circ}C$에서 소성한 후 여러 물성을 평가하였다 그 결과로, 유전체와 투명전극(ITO)의 반용에서, In 이온이 유전체층으로 확산이동하였으며, Sn 확산은 거의 발생하지 않았다. 선팽창계수, 유전상수, 유리전이온도,광 투과율은 유전체 조성의 PbO 양에 큰 영향을 받았다. PbO양 증가는 선팽창계수와 유전상수를 증가시킨 반면, 유리전이온도와 광 투과율온 저하시켰다. $Al_2O_3/B_2O_3$ 비가 증가함에 따라서는 선팽창계수는 감소, 유전상수는 증가, 광 투과율은 감소하였으며, 유리 전이점 변화는 거의 나타나지 않았다.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.694-699
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• 2002

In autobody assembly, thin-wall, tubular connections have been used for the frame structure. Recent interest in light materials, such as aluminum or magnesium alloys, has been rapidly growing for weight reduction and fuel efficiency. Due to higher thermal expansion coefficient, low stiffness/strength, and low softening temperature of aluminum and magnesium alloys, control of welding-induced distortion in these connections becomes a critical issue. In this study, the material sensitivity to welding distortion was investigated using a T-tubular connection of three types materials; low carbon steel (A500 Gr. A), aluminum alloy (5456-H116) and magnesium alloy (AZ91C-T6). An uncoupled thermal and mechanical finite element analysis scheme using the ABAQUS software program was developed to model and simulate the welding process, welding procedure and material behaviors. The predicted angular distortions were correlated to the cumulative plastic strains. A unique relationship between distortion and plastic strains exists for all three materials studied. The amount of distortion is proportional to the magnitude and distribution of the cumulative plastic strains in the weldment. The magnesium alloy has the highest distortion sensitivity, followed by the other two materials with the steel connection having the least distortion. Results from studies of thin-aluminum plates show that welding distortion can be minimized by reducing the cumulative plastic strains by preventing heat diffusion into the base metal using a strong heat sink placed directly beneath the weld. A rapid cooling method is recommended to reduce welding distortion of magnesium tubular connections.

• 한국결정성장학회지
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• 제31권1호
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• pp.32-36
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• 2021

본 연구는 레이저 침탄된 TiZrN 코팅층의 탄소확산거동 측면과 이에 따른 기계적 특성 변화를 연구·고찰하였다. TiZrN 코팅에 탄소페이스트를 도포한 후, 레이저를 조사하여 침탄시켰다. 침탄 이후에 (111)상에 해당하는 XRD 피크가 저각으로 이동하여, 도핑된 탄소에 의한 격자팽창을 보여주었다. 아울러, 투입된 탄소의 입계 확산에 의한 결정립의 크기가 감소하였다. 침입된 탄소의 결합상태를 확인하기 위한 XPS 분석결과, 레이저의 열에너지를 통해 탄소가 TiZrN내 질소 원자와 치환되어 탄화물(TiC 또는 ZrC)을 보였다. 아울러, sp2와 sp3 혼성화 결합이 혼재하는 상태를 보여 비정질 탄소가 형성된 것을 확인할 수 있었다. 침탄 전후 TiZrN 코팅층의 단면 TEM 이미지와 inverse FFT 분석결과, 격자 중간에 물결형상이 관찰되어 결정립계 내 비정질 상의 형성을 보여주었다. 침탄 후 경도는 34.57 G Pa에서 38.24 G Pa로 증가하였으며, 마찰계수는 83 % 감소하였다. 특히, 외부 하중에 저항하는 지표로 활용되는 H/E는 0.11에서 0.15으로 증가하였고 wear rate는 65 % 개선되는 것을 확인할 수 있었다.