• Proceedings of the Computational Structural Engineering Institute Conference
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• 1996.10a
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• pp.121-128
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• 1996

In this study design and construction technique for joint-less integral abutment for short to mid span bridges was developed. Expansion of superstructure due to thermal effect was absorbed in the flexible pile-type abutment in stead of expansion joint in the conventional bridges. Design method for pile subject to vertical and horizontal force was proposed. Backfill, approach slab and details of its connection joint with pavement was also proposed.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.744-747
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• 2004

An electric precipitator in a thermal electric power plant is essential equipment for preventing air environment pollution. However, it is difficult for the existing control systems to make efficient effects on dust collection. This is because AVC and ERC consist of independent, separate systems in the existing systems. To solve this problem, we developed an intelligent distributed control system, which makes optimal control possible through connection operations between the control systems. In this paper, we analyzed system performance and fly ash reduction effects through the developed system structure, development contents and its actual application to power plant.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1231-1235
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• 2004

The needs of micro scale thermal detecting technique are increasing in biology and chemical industry. For example, Thermal finger print, Micro PCR(polymer chain reaction), ${\mu}TAS$ and so on. To satisfy these needs, we developed a DTSA(Diode Temperature Sensor Array) for detecting and controlling the temperature on small surface. The DTSA is fabricated by using VLSI technique. It consists of 32 ${\times}$ 32 array of diodes (1,024 diodes) for temperature detection and 8 heaters for temperature control on a 8mm ${\times}$ 8mm surface area. The working principle of temperature detection is that the forward voltage drop across a silicon diode is approximately proportional to the inverse of the absolute temperature of diode. And eight heaters ($1K{\Omega}$) made of poly-silicon are added onto a silicon wafer and controlled individually to maintain a uniform temperature distribution across the DTSA. Flip chip packaging used for easy connection of the DTSA. The circuitry for scanning and controlling DTSA are also developed

• Journal of the Korean Graphic Arts Communication Society
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• v.22 no.1
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• pp.1-8
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• 2004

The key points of the CTP board is as follows: Film, brightness, plate exposure is eliminated, the reduction of personal expenses, and the reduction of time consumption. But above all, the accurate reappearance of the highlighting and shadow portion as well as self modification of the dust edge portion stands out as the most impressive improvements. In this paper, using a digital test from 4.0 and a Thermal CTP color printing control, the two parts of the Thermal CTP utilized a 1%-99% dot reappearance. Also, using an opposite line target, the results of the CTP plates and printing were compared. Finally, research was made on the printing quality on the slur development of the plate and the result when there was a lack of weave connection.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.05a
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• pp.399-406
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• 2001

Thermally induced vibration response of composite thin walled beams is investigated. The thin-walled beam model incorporates a number of nonclassical effects of transverse shear, primary and secondary warping, rotary inertia and anisotropy of constituent materials. Thermally induced vibration response characteristics of a composite thin walled beam exhibiting the circumferentially uniform system(CUS) configuration are exploited in connection with the structural bending-torsion coupling resulting from directional properties of fiber reinforced composite materials and from ply stacking sequence. A coupled thermal structure analysis that includes the effects of structural deformations on heating and temperature gradient is investigated.

• Progress in Superconductivity
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• v.9 no.1
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• pp.23-28
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• 2007

In order to have a superconductive connection between the wire-wound pickup coil and input coil, typically Nb terminal blocks with screw holes are used. Since this connection structure occupies large volume, large stray pickup area can be generated which can pickup external noise fields. Thus, SQUID and connection block are shielded inside a superconducting tube, and this SQUID module is located at some distance from the distal coil of the gradiometer to minimize the distortion or imbalance of uniform background field due to the superconducting module. To operate this conventional SQUID module, we need a higher liquid He level, resulting in shorter refill interval. To make the fabrication of gradiometers simpler and refill interval longer, we developed a novel method of connecting the pickup coil into the input coil. Gradiometer coil wound of 0.125-mm diameter NbTi wires were glued close to the input coil pads of SQUID. The superconductive connection was made using an ultrasonic bonding of annealed 0.025-mm diameter Nb wires, bonded directly on the surface of NbTi wires where insulation layer was stripped out. The reliability of the superconductive bonding was good enough to sustain several thermal cycling. The stray pickup area due to this connection structure is about $0.1\;mm^2$, much smaller than the typical stray pickup area using the conventional screw block method. By using this compact connection structure, the position of the SQUID sensor is only about 20-30 mm from the distal coil of the gradiometer. Based on this compact module, we fabricated a magnetocardiography system having 61 first-order axial gradiometers, and measured MCG signals. The gradiometers have a coil diameter of 20 mm, and the baseline is 70 mm. The 61 axial gradiometer bobbins were distributed in a hexagonal lattice structure with a sensor interval of 26 mm, measuring $dB_z/dz$ component of magnetocardiography signals.

• Advances in Energy Research
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• v.5 no.2
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• pp.91-105
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• 2017

Thermal hydraulic (TH) analysis of nuclear power reactors is utmost important. In this way, the numerical codes that preparing TH data in reactor core are essential. In this paper, a subchannel analysis of a Russian pressurized water reactor (WWER1000) core with enhanced numerical code is carried out. For this, in fluid domain, the mass, axial and lateral momentum and energy conservation equations for desired control volume are solved, numerically. In the solid domain, the cylindrical heat transfer equation for calculation of radial temperature profile in fuel, gap and clad with finite difference and finite element solvers are considered. The dependence of material properties to fuel burnup with Calza-Bini fuel-gap model is implemented. This model is coupled with Isotope Generation and Depletion Code (ORIGEN2.1). The possibility of central hole consideration in fuel pellet is another advantage of this work. In addition, subchannel to subchannel and subchannel to rod connection data in hexagonal fuel assembly geometry could be prepared, automatically. For a demonstration of code capability, the steady state TH analysis of a the WWER1000 core is compromised with Thermal-hydraulic analysis code (COBRA-EN). By thermal hydraulic parameters averaging Fuel Assembly-to-Fuel Assembly method, the one sixth (symmetry) of the Boushehr Nuclear Power Plant (BNPP) core with regular subchannels are modeled. Comparison between the results of the work and COBRA-EN demonstrates some advantages of the presented code. Using the code the thermal modeling of the fuel rods with considering the fission gas generation would be possible. In addition, this code is compatible with neutronic codes for coupling. This method is faster and more accurate for symmetrical simulation of the core with acceptable results.

• Journal of Electrical Engineering and Technology
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• v.11 no.3
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• pp.781-789
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• 2016

Busbar has been used as electric conductor within extra high voltage (EHV) gas insulated switchgear (GIS), which makes EHV GIS higher security, smaller size and lower cost. However, the main fault of GIS is overheating of busbar connection parts, circuit breaker and isolating switch contact parts, which has been already restricting development of GIS to a large extent. In this study, a coupled magneto-flow-thermal analysis is used to investigate the thermal properties of GIS busbar in steady-state. A three-dimensional (3-D) finite element model (FEM) is built to calculate multiphysics fields including electromagnetic field, flow field and thermal field in steady-state. The influences of current on the magnetic flux density, flow velocity and heat distribution has been investigated. Temperature differences of inner wall and outer wall are investigated for busbar tank and conducting rod. Considering the end effect in the busbar, temperature rise difference is compared between end sections and the middle section. In order to obtain better heat dissipation effect, diameters of conductor and tank are optimized based on temperature rise simulation results. Temperature rise tests have been done to validate the 3-D simulation model, which is observed a good correlation with the simulation results. This study provides technical support for optimized structure of the EHV GIS busbar.

• Journal of the Korean Wood Science and Technology
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• v.41 no.6
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• pp.515-527
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• 2013

Building energy simulations which are mainly used in Korea have evaluated the building energy performance with the different thermal conductivity of construction materials. In order to evaluate the energy consumption accurately, the difference in thermal conductivity of the wood used in stud for wooden structure was confirmed from the each simulation. In addition, the thermal transmission of building members and the thermal bridge at the conjunction of building members according to thermal conductivity from each simulation programs were researched. The thermal conductivity of pine that has the largest variation among the energy simulations was applied to the thermal properties of studs in wooden structure. The maximum error between the maximum and minimum thermal transmission of roof, wall, and floor slab was $0.023W/m^2{\cdot}K$. Plus, that thermal bridge at Rafter junction on the roof, roof-wall joint, and floor slab-wall joint was $0.025W/m{\cdot}K$. The heat transfer image for changes in temperature and the heat exchange were analyzed by HEAT2 program. The distorted temperature lines were found around the insufficient insulated connection parts. It was predicted that the temperature at the distorted parts in the analyzed image was lower than that of the other portion of the other structures.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.