• The Journal of Advanced Prosthodontics
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• 제4권2호
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• pp.103-108
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• 2012

PURPOSE. Debonding of a composite resin core of the fiber post often occurs at the interface between these two materials. The aim of this study was to evaluate the effects of different surface treatment methods on bond strength between fiber posts and composite core. MATERIALS AND METHODS. Sixty-four fiber posts were picked in two groups (Hetco and Exacto). Each group was further divided into four subgroups using different surface treatments: 1) silanization; 2) sandblasting; 3) Treatment with 24% $H_2O_2$, and 4) no treatment (control group). A cylindrical plexiglass matrix was placed around the post and filled with the core resin composite. Specimens were stored in 5000 thermal cycles between $5^{\circ}C$ and $55^{\circ}C$. Tensile bond strength (TBS) test and evaluation using stereomicroscope were performed on the specimen and the data were analyzed using two-way ANOVA, Post Hoc Scheffe tests and Fisher's Exact Test (${\alpha}$=.05). RESULTS. There was a significant difference between the effect of different surface treatments on TBS ($P$ <.001) but different brands of post ($P$=.743) and interaction between the brand of post and surface treatment ($P$=.922) had no significant effect on TBS. Both silanization and sandblasting improved the bonding strength of fiber posts to composite resin core, but there were not any significant differences between these groups and control group. CONCLUSION. There was not any significant difference between two brands of fiber posts that had been used in this study. Although silanization and sandblasting can improve the TBS, there was not any significant differences between surface treatments used.

• Proceedings of the Materials Research Society of Korea Conference
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.25.1-25.1
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• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

• Journal of the Korea Academia-Industrial cooperation Society
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• 제14권2호
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• pp.511-516
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• 2013

The thickness and deflection of melting parts of the glass edge reach the biggest effect on the intensity and thermal insulation performance. During the sealing process using a hydrogen mixed gas torch, the thickness and the deflection effect of the edge part are affected by process parameters. In order to analyze the correlative relationship of the thickness prediction and the deflection of the edge part according to the process parameters, data was obtained by conducting sealing experiments. The main effects and interaction effects of process parameters for the thickness and the shape of the glass edge parts were analyzed through the design of experiment. A mathematical experiment equation that can predict the thickness and deflection of the edge part according to the process parameters was developed by conducting multiple regression equations.

• Proceedings of the KIEE Conference
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• 대한전기학회 1992년도 하계학술대회 논문집 B
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• pp.843-846
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• 1992

This thesis was investigated on optical-and ion-induced characteristics in positive(a-$Se_{75}Ge_{25}$) and negative (Ag/a-$Se_{75}Ge_{25}$) resists for focused-ion-beam microlithogaphy. The a-$Se_{75}Ge_{25}$ inorganic thin film shows an increase in optical absorption after exposure to$\sim$$10^{16}$ dose(ions/$cm^{2}$) of Ga ions. The observed shift in the absorption edge toward longer wavelengths is consistent with that in films exposed to band-gap photons ($\sim$$10^{20}$ photons/$cm^{2}$). But, ion induced shift is twice as much as that in film exposed to optical radiation. This result may be related with microstructural rearrangements with in the short range of SeGe network. Due to changes in the short range order, the chemical bonding may be affected, which results in increased chemical dissolution in ion-induced film. Also, this resist exhibits good thermal stability because of its high Tg(~220$^{\circ}C$). The composition of deposited film measured by AES is consistent with that of bulk.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.221-221
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• 2013

Striving to replace the well known silicon nanocrystals embedded in oxides with solution-processable charge-trapping materials has been debated because of large scale and cost effective demands. Herein, a silicon quantum dot-polystyrene nanocomposite (SiQD-PS NC) was synthesized by postfunctionalization of hydrogen-terminated silicon quantum dots (H-SiQDs) with styrene using a thermally induced surface-initiated polymerization approach. The NC contains two miscible components: PS and SiQD@PS, which respectively are polystyrene and polystyrene chains-capped SiQDs. Spin-coated films of the nanocomposite on various substrate were thermally annealed at different temperatures and subsequently used to construct metal-insulator-semiconductor (MIS) devices and thin film field effect transistors (TFTs) having a structure p-$S^{++}$/$SiO_2$/NC/pentacene/Au source-drain. C-V curves obtained from the MIS devices exhibit a well-defined counterclockwise hysteresis with negative fat band shifts, which was stable over a wide range of curing temperature ($50{\sim}250^{\circ}C$. The positive charge trapping capability of the NC originates from the spherical potential well structure of the SiQD@PS component while the strong chemical bonding between SiQDs and polystyrene chains accounts for the thermal stability of the charge trapping property. The transfer curve of the transistor was controllably shifted to the negative direction by chaining applied gate voltage. Thereby, this newly synthesized and solution processable SiQD-PS nanocomposite is applicable as charge trapping materials for TFT based memory devices.

• Journal of Energy Engineering
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• 제7권2호
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• pp.163-171
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• 1998

Degradation of polymer additives is enhanced at higher temperature of the test solutions. The degradation of Co-polymer solution was investigated experimentally in a closed loop at the temperature of 6$0^{\circ}C$ and 8$0^{\circ}C$ with various polymer concentrations of 100, 200, 400, 600 ppm in order to see the effect of temperature and polymer concentration with time. The degradation effect were found to be more dependent on temperature than mechanical shear. The friction factor versus Reynolds number curves show that in the range of Reynolds number number 50,000~150,000 the friction was decreased as Reynolds number increased and the friction of solution at low temperature approached to Virk's maximum drag reduction asymptote. For constant flowrates and temperatures the degradation effect was found to be less likely in higher polymer concentration. For constant flowrates and polymer concentrations the degradation rates are affected mainly by temperature. At the temperature of 8$0^{\circ}C$ and polymer concentration of 100 ppm, drag reduction effect was disappeared after 4 hours. However, this thermal degradation could be avoided with additional materials such as surfactants which are supposed to enhance the bonding forces between polymer molecules.

• Current Photovoltaic Research
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• 제2권4호
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• pp.168-172
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• 2014

Under concentrated illuminations, the solar cells show higher efficiencies mainly due to an increase of the open circuit voltage. In this study, InGaP/InGaAs/Ge triple-junction solar cells have been grown by a low pressure metalorganic chemical vapor deposition. Photovoltaic characteristics of the fabricated solar cells are investigated with a class A solar simulator under concentrated illuminations from 1 to 100 suns. Ideally, the open circuit voltage should increase with the current level when maintained at the same temperature. However, the fabricated solar cells show degraded open circuit voltages under high concentrations around 100 suns. This means that the heat sink design is not optimized to keep the cell temperature at $25^{\circ}C$. To demonstrate the thermal degradation, changes of the device performance are investigated with different bonding conditions and heat sink materials.

• Polymer(Korea)
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• 제25권6호
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• pp.774-781
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• 2001

In order to reuse the waste matters, the polyester hybrid composites were fabricated with the waste stone (WSP) and waste tire (WTC). Before mixing, the waste fillers were treated with the silane coupling agent [${\gamma}$-methacryloxy propyl trimethoxy silane(${\gamma}$-MPS)] for enhancing the dispersion of the fillers and interfacial bonding with polymer matrix. Mechanical properties and morphologies of the resulted hybrid composites were investigated with the filler content. The hybrid composites containing surface treated fillers have high initial thermal decomposition temperature and low weight loss compared to the untreated one. The highest mechanical properties of composites were obtained with the ${\gamma}$-MPS (2 wt%) treated fillers. The porosity of composite increased with the content of organic filler which can be reduced by the silane surface treatment of fillers. The pore size distribution of the composites varied with the waste filler content.

• Transactions of Materials Processing
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• 제15권9호
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• pp.667-672
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• 2006

Agglutination is one of the most commonly employed reactions in clinical diagnosis. In this paper, we have designed and fabricated nickel mold insert for injection molding of a microfluidic lab-on-a-chip for the purpose of the efficient detection of agglutination. In the presented microfluidic lab-on-a-chip, two inlets for sample blood and reagent, flow guiding microchannels, improved serpentine laminating micromixer(ISLM) and reaction microwells are fully integrated. The ISLM, recently developed by our group, can highly improve mixing of the sample blood and reagent in the microchannel, thereby enhancing reaction of agglutinogens and agglutinins. The reaction microwell was designed to contain large volume of about $25{\mu}l$ of the mixture of sample blood and reagent. The result of agglutination in the reaction microwell could be determined by means of the level of the light transmission. To achieve the cost-effectiveness, the microfluidic lab-on-a-chip was realized by the injection molding of COC(cyclic olefin copolymer) and thermal bonding of two injection molded COC substrates. To define microfeatures in the microfluidic lab-on-a-chip precisely, the nickel mold inserts of lab-on-a-chip for the injection molding were fabricated by combining the UV photolithography with a negative photoresist SU-8 and the nickel electroplating process. The microfluidic lab-on-a-chip developed in this study could be applied to various clinical diagnosis based on agglutination.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.139-144
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• 2005

A rigorous research is underway in our team, for the design and development of high figure of merits (ZT= 1.5${\sim}$2.0) micro-thermoelectric coolers. This paper discusses the fabrication process that we are using for developing the $Sb_2Te_3-Bi_2Te_3$ micro-thermoelectric cooling modules. It describes how to obtain the mechanical properties of the thin film TEC elements and reports the results of an equation-based multiphysics modeling of the micro-TEC modules. In this study the thermoelectric thin films were deposited on Si substrates using co-sputtering method. The physical mechanical properties of the prepared films were measured by nanoindentation testing method while the thermal and electrical properties required for modeling were obtained from existing literature. A finite element model was developed using an equation-based multiphysics modeling by the commercial finite element code FEMLAB. The model was solved for different operating conditions. The temperature and the stress distributions in the P and N elements of the TEC as well as in the metal connector were obtained. The temperature distributions of the system obtained from simulation results showed good agreement with the analytical results existing in literature. In addition, it was found that the maximum stress in the system occurs at the bonding part of the TEC i.e. between the metal connectors and TE elements of the module.