• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.3
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.8
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• pp.893-897
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• 2004

In this paper, we studied the mechanical and thermal properties on slice XLPE sheet from 22 kV and 154 kV power cables. Interface structures are XLPE/semiconductor and XLPE/water/semiconductor. We evaluated mechanical property, thermal analysis, moisture analysis. Based on mechanical and thermal properties of the 22 kV XLPE sheet, elongation, mechanical strength, and melting point were evaluated to be 485.48 %, 1.74 kgf/$\textrm{mm}^2$ and $102.48^{\circ}C$, respectively. It was also evaluated from the mechanical and thermal properties of 154 kV XLPE sheet that elongation, mechanical strength, and melting point are 507.81 %, 1.8 kgf/$\textrm{mm}^2$, $106.9^{\circ}C$, respectively. A region shows a rapid increase in tension strength, and B region only shows increase in elongation under 1.0 kgf/$\textrm{mm}^2$, C region shows increase in both elongation and tension strength. Difference of melting point came from the chain of XLPE polymer and the difference of crystallization. Moisture density of semiconductor showed 800 ∼ 1200 ppm before extrude, 14000 ∼24000 ppm after extrude. These values were higher than the moisture density of XLPE (300∼560) ppm.

• Proceedings of the Korean Nuclear Society Conference
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• 1996.05b
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• pp.95-101
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• 1996

In this paper, the steady 2-dimensional model for a long horizontal line with different end temperatures undergoing natural convection at very high Rayleigh number is proposed to numerically investigate the heat transfer and flow characteristics. The dimensionless governing equations are solved by using SIMPLE (Semi-Implicit Method for Pressure Linked Equations) algorithm which is developed using control volumes and staggered grids. The numerical results are verified by comparison with the operating PWR test data. The analysis focuses on the effects of variation of the heat transfer rates at the pipe surface, the thermal conductivities of the pipe material and the thickness of the pipe wall on the thermal stratification. The results show that the heat transfer rate at the pipe surface is the controlling parameter. A significant reduction and disappearance of thermal stratification phenomenon is observed at the Biot number of 5.0$\times$10$^{-2}$. The results also show that the increment of the thermal conductivity and thickness of the wall weakens the thermal stratification and somewhat reduces azimuthal temperature gradient in the pipe wall. Those effects are however minor, when compared with those due to the variation of the heat transfer rates at the surface of the pipe wall.

• The Korean Journal of Ceramics
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• v.3 no.2
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• pp.92-95
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• 1997

Because of the novel characteristics such as chemical stability, hardness, electrical resistivity and thermal conductivity, diamond-like carbon (DLC) film is a suitable material for the passivation layers. For this purpose, using the PECVD, DLC films were synthesized at room temperature. The adhesion and the hardness of the DLC films deposited on Si an SiO2 substrate were measured. The resistivity of 5.3$\times$$10^8$$\Omega$.cm was measured by automatic spreading resistance probe analysis method. The thermal conductivities of different DLC films were measured and compared with that of phospho silicate glass (PSG) film which is commonly used as passivation layers. The thermal conductivity of DLC film was improved by increasing hydrogen flow rate up to 90 sccm and was better than that of PSG film. The patterning techniques of the DLC film developed using the RIE and the lift-off method to form 5$\mu\textrm{m}$ line. Finally, the thermal characteristics of the power transistor with the DLC film as passiviation layer was analyzed.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.15 no.3
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• pp.223-231
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• 2011

During spray coating, especially in an air plasma spray (APS), pores, cracks, and splat boundaries are developed and those factors exert influence on thermomechanical properties such as elastic modulus, thermal conductivity, and coefficient of thermal expansion. Moreover, the thermo mechanical properties are crucial elements to determine the thermoelastic characteristics, for instance, temperature distribution, displacements, and stresses. Two types of thermal barrier coating (TBC) model, the dense and porous microstructures, are taken into account for the analysis of microstructural characterizations. $TriplexPro^{TM}$-200 system was applied to prepare TBC samples, and the METECO 204 C-NS powder is adopted for the relatively porous microstructure and METECO 204 NS powder for the dense microstructure in the top coat of TBCs. Governing partial differential equations were derived based on the thermoelastic theory and approximate estimates for the thermoelastic characteristics were obtained using a finite volume method for the governing equations.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.29 no.12
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• pp.645-653
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• 2017

Thermal and flow modeling and fin structure optimization were performed to reduce the weight of an electrical device with a staggered fin. First, a numerical model for thermal and flow characteristics was suggested, and then, the model was verified experimentally. Using the verified model, improvement in cooling performance of the cooling system through the staggered fins was predicted. As a result, 87.5% of total heat generated was dissipated through the cooling fins, and a thermal island was observed in the rotor because of low velocity of the internal air flow through the air gap. In addition, it was confirmed that the staggered fin improves the cooling performance but it also increases the total pressure drop within the cooling system, by maximizing the leading edge effect. Based on this analysis result, the effect of each design parameter on the thermal and flow characteristics was analyzed to select the main optimal design parameters, and multi-objective optimization was performed by considering the cooling performance and the fin weight. In conclusion, the optimized fin structure improved the cooling performance by 7% and reduced the fin weight by 28% without any compromise of the pressure drop.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.25 no.2
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• pp.54-65
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• 2021

In this study, a two-dimensional thermoelastic problem under hyperbolic heat conduction theory with an internal heat source is considered. The general solution for the temperature field, stress components and displacement field are obtained using the reduced differential transform method. The stress and displacement components are obtained using the thermal stress function in the reduced differential transform domain. All the solutions are obtained in the form of power series. The special case with a time-dependent laser heat source has been considered. The problem is considered for homogeneous material with finite rectangular cross-section heated with a non-Gaussian temporal profile. The effect of the heat source on all the characteristics of a material is discussed numerically and graphically for magnesium material taking a pulse duration of 0.2 ps. This study provides a powerful tool for finding the solution to the thermoelastic problem with less computational work as compared to other methods. The result obtained in the study may be useful for the investigation of thermal characteristics in engineering and industrial applications.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.43-51
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• 2014

In 3-dimensional (3D) integrated package, thermal management is one of the critical issues due to the high heat flux generated by stacked multi-functional chips in miniature packages. In this study, we used numerical simulation method to analyze the thermal behaviors, and investigated the thermal issues of 3D package using TSV (through-silicon-via) technology for mobile application. The 3D integrated package consists of up to 8 TSV memory chips and one logic chip with a interposer which has regularly embedded TSVs. Thermal performances and characteristics of glass and silicon interposers were compared. Thermal characteristics of logic and memory chips are also investigated. The effects of numbers of the stacked chip, size of the interposer and TSV via on the thermal behavior of 3D package were investigated. Numerical analysis of the junction temperature, thermal resistance, and heat flux for 3D TSV package was performed under normal operating and high performance operation conditions, respectively. Based on the simulation results, we proposed an effective integration scheme of the memory and logic chips to minimize the temperature rise of the package. The results will be useful of design optimization and provide a thermal design guideline for reliable and high performance 3D TSV package.

• Macromolecular Research
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• v.17 no.10
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• pp.785-790
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• 2009

In this paper, the relaxation behavior of the regenerated silk fibroin (SF) films was investigated using dielectric thermal analysis (DETA), and compared with the dynamic mechanical behavior obtained from dynamic mechanical thermal analysis (DMTA), in order to gain a better understanding of the characteristics of dielectric behavior of SF film and identify the differences between the two analyses. Compared to DMTA, DETA exhibited a higher sensitivity on the molecular relaxation behaviors at low temperature ranges that showed a high $\gamma$-relaxation peak intensity without noise. However, it was not effective to examine the relaxation behaviors at high temperatures such as $\alpha-$ and ${\alpha}_c$-relaxations that showed a shoulder peak shape. On the contrary, DMTA provided more information regarding the relaxation behaviors at high temperatures, by exhibiting the changes in width, intensity and temperature shift of the $\alpha$-relaxation peak according to various crystallinities. Conclusively, DETA and DMTA can be utilized in a complementary manner to study the relaxation behavior of SF over a wide temperature range, due to the different sensitivity of each technique at different temperatures.

• Nuclear Engineering and Technology
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• v.31 no.1
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• pp.17-28
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• 1999

A thermal-hydraulic analysis is conducted on the loss-of-coolant-accident (LOCA) during shutdown operation of YGN Units 3/4. Based on the review of plant-specific characteristics of YGN Units 3/4 in design and operation, a set of analysis cases is determined, and predicted by the RELAP5/MOD3.2 code during LOCA in the hot-standby mode. The evaluated thermal-hydraulic phenomena are blowdown, break flow, inventory distribution, natural circulation, and core thermal response. The difference in thermal-hydraulic behavior of LOCA at shutolown condition from that of LOCA at full power is identified as depressurization rate, the delay in peak natural circulation timing and the loop seal clearing (LSC) timing. In addition, the effect of high pressure safety injection (HPSI) on plant response is also evaluated. The break spectrum analysis shows that the critical break size can be between 1% to 2% of cold leg area, and that the available operator action time for the Sl actuation and the margin in the peak clad temperature (PCT) could be reduced when considering uncertainties of the present RELAP5 calculation.