• 제목/요약/키워드: Thermal Uniformity

검색결과 295건 처리시간 0.028초

히트 파이프를 이용한 열경화성 나노임프린트 장비용 열판의 온도 균일도 향상 (Improvement of Temperature Uniformity in a Hot Plate for Thermal Nanoimprint Lithography by Installing Heat Pipes)

  • 박규진;양진오;이재종;곽호상
    • 반도체디스플레이기술학회지
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    • 제15권2호
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    • pp.74-80
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    • 2016
  • This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

8인치 웨이퍼의 온도균일도향상을 위한 고속열처리공정기의 최적 파라미터에 설게에 관한 연구 (A study on the optimal parameter design of rapid thermal processing to improve wafer temperature uniformity)

  • 최성규;최진영;권욱현
    • 전자공학회논문지D
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    • 제34D권10호
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    • pp.68-76
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    • 1997
  • In this paper, design parameters of rapid thermal processing(RTP) to minimize the wafer temperature uniformity errors are proposed. Lamp ring positions and the wafer height are important parameters for wafer temperature uniformity in RTP. We propose the method to seek lamp ring positions and the wafer gheight for optimal temperature uniformity. The proposed method is applied to seek optimal lamp ring positions and the wafer feight of 8 inch wafer. To seek the optimal lamp ring positions and the wafer height, we vary lamp ring positions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programming problem. Finally, it is shown that the wafer temperature uniformity in RTP designed by optimal problem. Finally, it is hsown that the wafer temperature uniformity is RTP designed by optimal parameters is improved to comparing with RTP designed by the other method.

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최적 반복 학습 제어기법을 이용한 RTP의 웨이퍼 온도균일제어 (Control of Wafer Temperature Uniformity in Rapid Thermal Processing using an Optimal Iterative teaming Control Technique)

  • 이진호;진인식;이광순;최진훈
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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    • pp.358-358
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    • 2000
  • An iterative learning control technique based on a linear quadratic optimal criterion is proposed for temperature uniformity control of a silicon wafer in rapid thermal processing.

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반도체 공정에서 웨이퍼의 온도균일도향상을 위한 고속열처리공정기의 최적 파라미터 설계 (The optimal paremeter design of rapid thermal processing to improve wafer temperature uniformity on the semiconductor manufacturing)

  • 최성규;최진영;권욱현
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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    • pp.1508-1511
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    • 1997
  • In this paper, design parameters of Rapid Thermal Processing(RrW) to minimize the wafer tempera ture uniformity errors are proposed. 1,anip ling positions and the wafer height are important parameters for waf er temperature uniformity in R'I'P. We propose the method to seek lamp ling positions and the wafer height for optimal temperature uniformity. l'he ~~roposed method is applied to seek optimal lamp ling positions and the waf er height of 8 inch wafer. 'I'o seek the optimal lamp ling positions and the wafer height, we var\ulcorner. lamp ling 110s itions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programmi ng problem. Finally, it is shown that the wafer temperature uniformity in RI'I' designed by optimal prarneters is improved to comparing with Ii'l'P designed by the other method.

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Hot Plate 신뢰성 시험.평가장비 개발 (Reliability Evaluation System of Hot Plate for PR Baking)

  • 송준엽;송창규;노승국;박화영
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.566-569
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    • 2001
  • Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

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고속 열처리 시스템에서 웨이퍼 상의 다중점 계측에 의한 온도 분포 추정 기법 연구 (A Prediction Method of Temperature Distribution on the Wafer in a Rapid Thermal Process System with Multipoint Sensing)

  • 심영태;이석주;민병조;조영조;김학배
    • 대한전기학회논문지:시스템및제어부문D
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    • 제49권2호
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    • pp.62-67
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    • 2000
  • The uniformity of temperature on a wafer is one of the most important parameters to control the RTP (Rapid Thermal Process) with proper input signals. Since it is impossible to achieve the uniformity of temperature without exact estimation of temperature at all points on the wafer, the difficulty of understanding internal dynamics and structural complexities of the RTP is a primary obstacle to accurately measure the distributed temperatures on the wafer. Furthermore, it is also hard to accomplish desirable estimation because only few pyrometers have been commonly available in the general equipments. In the paper, a thermal model based on the chamber geometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through certain simulation and experiments. The work can be usefully contributed to building a run-by-run or a real-time controls of the RTP.

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CFD 해석을 통한 하이브리드 공조시스템의 인체 온열감의 불균일성에 관한 연구 (Study on Non-uniform Thermal Comfort in Hybrid Air-Conditioning System with CFD Analysis)

  • 남유진;성민기;송두삼
    • 설비공학논문집
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    • 제23권3호
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    • pp.216-222
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    • 2011
  • Recently, hybrid air-conditioning system has been proposed and applied to achieve building energy saving. One example is a system combining radiation panel with natural wind-induced cross-ventilation. However, few research works have been conducted on the non-uniformity of thermal comfort in such hybrid air-conditioning system. In this paper, both thermal environment and non-uniform thermal comfort of human thermal model under various air-conditioning system, including hybrid system, were evaluated in a typical office room using coupled simulation of computation fluid dynamics, radiation model and a human thermal model. The non-uniformity of thermal comfort was evaluated from the deviation of surface temperature of human thermal model. Flow fields and temperature distribution in each case were represented.

실시간 제어를 위한 고속 열처리 공정에서 웨어퍼 온도 분포 추정 기법 (A Prediction Method of Temperature Distribution on the Wafer for Real-Time Control in a Rapid Thermal Process System)

  • 심영태;이석주;김학배
    • 제어로봇시스템학회논문지
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    • 제6권9호
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    • pp.831-835
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    • 2000
  • The uniformity of themperature on a wafer is a wafer is one the most important parameters to conterol the RTF(Rapid Thermal Process) with proper input signals. It is impossible to achieve the uniformity of temperature without the exact estimation of temperature ar all points on the wafer. There fore, it is difficult to understand the internal dynamics as well as the structural complexities of the RTP, which is aprimary obstacle to measure the distributed temperatures on the wafer accurately. Furthermore, it is also hard to accomplish desirable estimation because only a few pyrometers are available in the general equipments. In the paper, a thermal model based on the chamber grometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through simulation and experiments. The proposed work can be utilized to building a run-by -run or a real-time control of the RTP.

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열해현상 방지를 위한 버스 엔진룸 구조개선 (Reengineering of Bus Engine Room Structure for Preventing Thermal Damages)

  • 맹주성;윤준용;손한규
    • 한국자동차공학회논문집
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    • 제8권3호
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    • pp.46-55
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    • 2000
  • Four types of different flow inlet models were tested to improve the flow uniformity at the inlet of the radiator and to prevent thermal damages of auxiliary units from the hot air in the bus engine room. Measurements and numerical calculations were performed and their results were in a good agreement with each other. Simultaneously temperature measurements were carried out under the conditions of actual bus driving. As designing the new flow inlet at the partition board which seperates the engine space and radiator space, flow circulation can be achieved and fresh air comes into the engine room from the bottom. It was proved that new inlet makes the one air temperature cooling down in the engine room, the other uniformity improvement.

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TEC-less 비냉각 열영상 검출기용 소형카메라 모듈 개발 (Small Camera Module for TEC-less Uncooled Thermal Image)

  • 김종호
    • 대한임베디드공학회논문지
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    • 제12권2호
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    • pp.97-103
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    • 2017
  • Thermal imaging is mainly used in military equipment required for night observation. In particular, technologies of uncooled thermal imaging detectors are being developed as applied to low-cost night observation system. Many system integrators require different specifications of the uncooled thermal imaging camera but their development time is short. In this approach, EOSYSTEM has developed a small size, TEC-less uncooled thermal imaging camera module with $32{\times}32mm$ size and low power consumption. Both domestic detector and import detector are applied to the EOSYSTEM's thermal imaging camera module. The camera module contains efficient infrared image processing algorithms including : Temperature compensation non-uniformity correction, Bad/Dead pixel replacement, Column noise removal, Contrast/Edge enhancement algorithms providing stable and low residual non-uniformity infrared image.