• Journal of the Semiconductor & Display Technology
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• v.15 no.2
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• pp.74-80
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• 2016

This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.10
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• pp.68-76
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• 1997

In this paper, design parameters of rapid thermal processing(RTP) to minimize the wafer temperature uniformity errors are proposed. Lamp ring positions and the wafer height are important parameters for wafer temperature uniformity in RTP. We propose the method to seek lamp ring positions and the wafer gheight for optimal temperature uniformity. The proposed method is applied to seek optimal lamp ring positions and the wafer feight of 8 inch wafer. To seek the optimal lamp ring positions and the wafer height, we vary lamp ring positions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programming problem. Finally, it is shown that the wafer temperature uniformity in RTP designed by optimal problem. Finally, it is hsown that the wafer temperature uniformity is RTP designed by optimal parameters is improved to comparing with RTP designed by the other method.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.358-358
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• 2000

An iterative learning control technique based on a linear quadratic optimal criterion is proposed for temperature uniformity control of a silicon wafer in rapid thermal processing.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1508-1511
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• 1997

In this paper, design parameters of Rapid Thermal Processing(RrW) to minimize the wafer tempera ture uniformity errors are proposed. 1,anip ling positions and the wafer height are important parameters for waf er temperature uniformity in R'I'P. We propose the method to seek lamp ling positions and the wafer height for optimal temperature uniformity. l'he ~~roposed method is applied to seek optimal lamp ling positions and the waf er height of 8 inch wafer. 'I'o seek the optimal lamp ling positions and the wafer height, we var\ulcorner. lamp ling 110s itions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programmi ng problem. Finally, it is shown that the wafer temperature uniformity in RI'I' designed by optimal prarneters is improved to comparing with Ii'l'P designed by the other method.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.566-569
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• 2001

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.49 no.2
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• pp.62-67
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• 2000

The uniformity of temperature on a wafer is one of the most important parameters to control the RTP (Rapid Thermal Process) with proper input signals. Since it is impossible to achieve the uniformity of temperature without exact estimation of temperature at all points on the wafer, the difficulty of understanding internal dynamics and structural complexities of the RTP is a primary obstacle to accurately measure the distributed temperatures on the wafer. Furthermore, it is also hard to accomplish desirable estimation because only few pyrometers have been commonly available in the general equipments. In the paper, a thermal model based on the chamber geometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through certain simulation and experiments. The work can be usefully contributed to building a run-by-run or a real-time controls of the RTP.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.3
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• pp.216-222
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• 2011

Recently, hybrid air-conditioning system has been proposed and applied to achieve building energy saving. One example is a system combining radiation panel with natural wind-induced cross-ventilation. However, few research works have been conducted on the non-uniformity of thermal comfort in such hybrid air-conditioning system. In this paper, both thermal environment and non-uniform thermal comfort of human thermal model under various air-conditioning system, including hybrid system, were evaluated in a typical office room using coupled simulation of computation fluid dynamics, radiation model and a human thermal model. The non-uniformity of thermal comfort was evaluated from the deviation of surface temperature of human thermal model. Flow fields and temperature distribution in each case were represented.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.9
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• pp.831-835
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• 2000

The uniformity of themperature on a wafer is a wafer is one the most important parameters to conterol the RTF(Rapid Thermal Process) with proper input signals. It is impossible to achieve the uniformity of temperature without the exact estimation of temperature ar all points on the wafer. There fore, it is difficult to understand the internal dynamics as well as the structural complexities of the RTP, which is aprimary obstacle to measure the distributed temperatures on the wafer accurately. Furthermore, it is also hard to accomplish desirable estimation because only a few pyrometers are available in the general equipments. In the paper, a thermal model based on the chamber grometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through simulation and experiments. The proposed work can be utilized to building a run-by -run or a real-time control of the RTP.

• Transactions of the Korean Society of Automotive Engineers
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• v.8 no.3
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• pp.46-55
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• 2000

Four types of different flow inlet models were tested to improve the flow uniformity at the inlet of the radiator and to prevent thermal damages of auxiliary units from the hot air in the bus engine room. Measurements and numerical calculations were performed and their results were in a good agreement with each other. Simultaneously temperature measurements were carried out under the conditions of actual bus driving. As designing the new flow inlet at the partition board which seperates the engine space and radiator space, flow circulation can be achieved and fresh air comes into the engine room from the bottom. It was proved that new inlet makes the one air temperature cooling down in the engine room, the other uniformity improvement.

• IEMEK Journal of Embedded Systems and Applications
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• v.12 no.2
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• pp.97-103
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• 2017

Thermal imaging is mainly used in military equipment required for night observation. In particular, technologies of uncooled thermal imaging detectors are being developed as applied to low-cost night observation system. Many system integrators require different specifications of the uncooled thermal imaging camera but their development time is short. In this approach, EOSYSTEM has developed a small size, TEC-less uncooled thermal imaging camera module with $32{\times}32mm$ size and low power consumption. Both domestic detector and import detector are applied to the EOSYSTEM's thermal imaging camera module. The camera module contains efficient infrared image processing algorithms including : Temperature compensation non-uniformity correction, Bad/Dead pixel replacement, Column noise removal, Contrast/Edge enhancement algorithms providing stable and low residual non-uniformity infrared image.