• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.1
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• pp.16-22
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• 1998

This paper addresses a method which can be used for analyzing thermal stresses of a functionally graded material(FGM) using semi-analytical approach. FGM is a nonhomogeneous material whose composition is changed continuously from a metal surface to a ceramic surface. An infinite one dimensional FGM plate is considered. The temperature distribution in the FGM is obtained by approximate Green's function solution. To expedite the convergence of the solutions, alternative Green's function solution is derived and shows good agreement with results from finite difference method. Thermal stresses are calculated using temperature distribution of the plate.

• Journal of the Society of Naval Architects of Korea
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• v.41 no.6
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• pp.84-90
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• 2004

For the precise assessment of the effect of welding residual stresses on structural strength and fatigue crack growth behavior, new FE analysis algorithms for the estimation of residual stress relaxation due to external load and redistribution due to fatigue crack propagation were proposed in this paper. Initial welding residual stress field was obtained by thermal elasto-plastic analysis considering temperature dependent material properties, and the amount of residual stress relaxation and redistribution were assessed by subsequent elasto-plastic analysis In the analysis of fatigue crack propagation, the applied SIF(Stress Intensity Factor) range was evaluated by $\frac{1}{4}$-point displacement extrapolation method, and the effect of welding residual stresses on crack propagation was considered by introducing the effective SIF concept. The test results of crack propagations were compared with the predicted data obtained by the analysis.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.11a
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• pp.641-646
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• 2001

In early-age concrete, volumetric deformations due to thermal expansion and moisture transfer are restrained by various boundary conditions, and then restraint stresses occur in proportion to developed stiffness. With increase of the age, these stresses are gradually relieved by significant relaxation behavior of early-age concrete. Therefore, it is necessary to consider the stress relaxation in order to analyze the behavior of early-age concrete more accurately. In this paper, we propose a unified algorithm which combines a relaxation model with hydration model, heat conduction model, micropore structure formation model, moisture diffusion model and mechanical properties development model and develop a finite element program based on the algorithm. The program is applied to evaluate stress development if a temperature-stress test machine (TSTM) specimen and a massive concrete structure, and then validity of the program is discussed and evaluated.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.04b
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• pp.11-11
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• 2002

Plastic deformation was observed by TEM around the intragranular SiC particles in the $Al_2O_3$ matrix for $Al_2O_3/SiC$ nanocomposite system. The dislocations are generated at selected planes and there is a tendency for the dislocations to form a subgrain boundary structure with low-angel grain boundaries and networks. In this study, dislocation generated in the $Al_2O_3$ matrix during cooling down from sintering temperatures by the highly localized thermal stresses within and/or around SiC particles caused from the thermal expansion mismatch between $Al_2O_3$ matrix and SiC particle was observed. In monolithic $Al_2O_3$ and $Al_2O_3/SiC$ microcomposite system. These phenomena is closely related to the plastic relaxation of the elastic stress and strain energy associated with both thermal misfitting inclusions and creep behaviors. The plastic relaxation behavior was explained by combination of yield stress and internal stress.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.9
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• pp.1441-1451
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• 1997

This paper addresses method which can be used for analyzing thermal stresses of a functionally graded material(FGM) using semi-analytical approach. FGM is a nonhomogeneous material whose composition changes continuously from a metal surface to a ceramic surface. An infinite one dimensional FGM plate is considered. The temperature distribution in the FGM is obtained by approximate Green's function solution. To expedite the convergence of the solutions, alternative Green's function solution is derived and shows good agreement with results from finite difference method. Thermal stresses are calculated using temperature distribution of the plate.

• Steel and Composite Structures
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• v.21 no.4
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• pp.791-803
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• 2016

In this article, the problem of a two-dimensional thermoelastic half-space are studied using mathematical methods under the purview of the generalized thermoelastic theory with one relaxation time is studied. The surface of the half-space is taken to be thermally insulated and traction free. Accordingly, the variations of physical quantities due to by laser pulse given by the heat input. The nonhomogeneous governing equations have been written in the form of a vector-matrix differential equation, which is then solved by the eigenvalue approach. The analytical solutions are obtained for the temperature, the components of displacement and stresses. The resulting quantities are depicted graphically for different values of thermal relaxation time. The result provides a motivation to investigate the effect of the thermal relaxation time on the physical quantities.

• Honam Mathematical Journal
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• v.38 no.3
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• pp.435-454
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• 2016

This paper investigates the effect of dual-phase-lags on a thermoviscoelastic orthotropic solid with a cylindrical cavity. The cylindrical cavity is subjected to a thermal shock varying heat and its material is taken to be of Kelvin-Voigt type. The phase-lag thermoelastic model, Lord and Shulman's model and the coupled thermoelasticity model are employed to study the thermomechanical coupling, thermal and mechanical relaxation (viscous) effects. Numerical solutions for temperature, displacement and thermal stresses are obtained by using the method of Laplace transforms. Numerical results are plotted to illustrate the effect phase-lags, viscoelasticity, and the variability thermal conductivity parameter on the studied fields. The variations of all field quantities in the context of dual-phase-lags and coupled thermoelasticity models follow similar trends while the Lord and Shulman's model may be different. The influence of viscosity parameter and variability of thermal conductivity is very pronounced on temperature and thermal stresses of the thermoviscoelastic solids.

• Progress in Superconductivity
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• v.11 no.1
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• pp.52-56
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• 2009

Temperature distributions and thermal stresses were calculated and analyzed to investigate the effect of the artificial holes to the transient behaviors of the superconductors which was cooled in liquid nitrogen. Three dimensional finite element method was used to calculated the transient temperature and thermal stresses in the superconductors. The cooling speed of the superconductors with holes is faster than those without holes. Because the thermal stresses calculated in the superconductors can be relaxed by the distributed holes, the volume of the peak tensile stress decreases during the cooling in liquid nitrogen. If optimal metal, which can maintain the relaxation of thermal stresses, is used to fill and reinforce the artificial holes, the probability of failure of the superconductors may be decreased by the decrease of volume of peak tensile stress.

• Structural Engineering and Mechanics
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• v.82 no.4
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• pp.469-476
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• 2022

A mathematical model of Lord-Shulman photo-thermal theorem induced by pulse heat flux is presented to study the propagations waves for plasma, thermal and elastic in two-dimensional semiconductor materials. The medium is assumed initially quiescent. By using Laplace-Fourier transforms with the eigenvalue method, the variables are obtained analytically. A semiconductor medium such as silicon is investigated. The displacements, stresses, the carrier density and temperature distributions are calculated numerically and clarified graphically. The outcomes show that thermal relaxation time has varying degrees of effects on the studying fields.