• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.4
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• pp.612-618
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• 1998

Monolithic SiC and SiC/C FGM layers were deposited on the graphite substrates by the CVD method and their thermal properties of the two specimens were investigated by thermal shock test for comparison. Temperature profiles and thermal stress distributions on thermal shock test were calculated by a commercially used computer program to see the thermal stress differences inside of two specimens. The specimens coated with FGM were expected to show a efficient relaxation of thermal stresses at the interface and they were not cracked under the actual $\Delta$T=1600 K experimental condition. This result proved that the experimental results were well accorded with the expectation from the theoretical calculations.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.1-7
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• 2007

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing of thin polymer films into nanocavities during the thermal NIL has been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality. The simulations have been performed within the viscoelastic plateau region and the stress relaxation effect has been taken into account.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.273-276
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• 2008

Thermoplastic resin takes place stress relaxation and creep according to temperature and time. In room temperature, time dependent deformation (TDD) of polymer was carried out at previous study. In this study, it evaluates time dependent deformation to relate temperature. Nanoscale indents can be used as cells for molecular electronics and drug delivery, slots for integration into nanodevices, and defects for tailoring the structure and properties. Therefore, it is important to control pattern depth for change of indent depth by creep when using Nanoindenter. For evaluating TDD at high temperature, it is occurred thermal-nanoindentation test by changing hold time at maximum load. Temperature is putted at $90^{\circ}C$, hold time at maximum loads are putted at 1, 10, 50, 100, 200, 300 and 500s.

• Journal of Electrical Engineering and Technology
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• v.12 no.1
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• pp.302-309
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• 2017

The ageing of XLPE cable insulation will lead to the accelerating accumulation of space charge, which will greatly affect the safe operation of the HVDC cable. In order to investigate the influence of different ageing modes on the space charge distribution of the HVDC cable, thermal stressed, electrical stressed and electro-thermal stressed endurance tests were carried out on the XLPE peelings. The tested XLPE peelings were obtained from 160kV HVDC cable insulation. The endurance tests were carried at thermal stress of 363K, electrical stress of 20kV/mm DC and a combination of both. The Pulsed Electro-Acoustic (PEA) method was used to measure the space charge distribution of the samples. The influences of ageing on the trap energy distribution were analyzed based on the isothermal relaxation theory and the decay characteristics of the space charge. The results showed that thermal ageing would help to improve the crystalline morphologies of the XLPE at the early stage. The total amount of space charge decreased compared to the ones before thermal ageing. The long term of electrical stress would result in the cleavage of polymer molecule chains which would intensify the accumulation of space charge and increase the density and depth of electron traps. With a combination of electrical and thermal stress, the injection and migration of space charge were more significant. Besides, the depth and density of electron traps increased rapidly with the increase of endurance time.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.2
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• pp.240-244
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• 1999

Monolithic SiC and SiC/C functionally gradient material (FGM) layers were deposited on graphite substrates by CVD method. Temperature a profiles and thermal stress distributions in the deposited layers under the thermal shock were calculated by a commercially available software package. The designed FGM specimens were found to show an efficient relaxation of thermal stresses at the interfaces, and the specimens were intact even under a thermal shock of $\Delta$T=1600 K.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.334-339
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• 2003

The welding residual stress has on important effect on welding deformation, fatigue fracture, buckling strength, brittle fracture, etc. For the purpose of relaxation of welding residual stress, post welding heat treatment is widely used. In this paper, residual stresses were calculated by two dimensional thermal elasto-plastic analysis using finite element method. Heat transfer analysis are performed by transient analysis. Also structure analysis are carried out by of thermal-mechanical coupled analysis. Numerical analysis are used by ANSYS 5.7.

• Corrosion Science and Technology
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• v.14 no.4
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• pp.161-165
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• 2015

This paper presents an analysis of thermal stress induced along the interface between a polymeric coating layer and a steel substrate as a result of uniform temperature change. The epoxy layer is assumed to be a linear viscoelastic material and to be theromorheologically simple. The viscoelastic boundary element method is employed to investigate the behavior of interface stresses. The numerical results exhibit relaxation of interface stresses and large stress gradients, which are observed in the vicinity of the free surface. Since the exceedingly large stresses cannot be borne by the polymeric coating layer, local cracking or delamination can occur at the interface corner.

• Journal of Industrial Convergence
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• v.22 no.9
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• pp.169-177
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• 2024

This study investigated the effects of a spinal thermal massage device on physical and mental relaxation in office workers. Fifteen participants in their 30s and 40s used the device at home for 40 minutes, five times a week, for one month. Subjective measures, including fatigue, stress, muscle pain, blood circulation, indigestion, and insomnia, were assessed using the Visual Analog Scale (VAS) before and after the intervention. Objective measures included blood pressure (diastolic/systolic) and pulse pressure. The results showed significant reductions in fatigue (-51.5%), muscle pain (-49.6%), blood circulation difficulties (-23.1%), and stress (-20.9%), with trends suggesting reductions in insomnia (-20%) and indigestion (-7.4%). Systolic blood pressure significantly decreased, with tendencies for reductions in diastolic blood pressure and pulse pressure. In conclusion, the spinal thermal massage device appeared to promote physical and mental relaxation by combining thermotherapy and massage, likely activating the parasympathetic nervous system.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.9
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• pp.1441-1451
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• 1997

This paper addresses method which can be used for analyzing thermal stresses of a functionally graded material(FGM) using semi-analytical approach. FGM is a nonhomogeneous material whose composition changes continuously from a metal surface to a ceramic surface. An infinite one dimensional FGM plate is considered. The temperature distribution in the FGM is obtained by approximate Green's function solution. To expedite the convergence of the solutions, alternative Green's function solution is derived and shows good agreement with results from finite difference method. Thermal stresses are calculated using temperature distribution of the plate.