• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.2004-2006
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• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.38 no.1
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• pp.1-10
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• 2018

It is difficult to predict the early-age cracks of strain restrained concrete members due to environmentally sensitive parameters. A new method is proposed to predict the cracks by test of autogenous deformation and self-induced restrained stress of specimens which simulates early-age crack state by hydration heat of the'Wall-On-Foundation'members. For this purpose, thermal analysis of entire structure considering the environmental condition is performed at first, and the specimens are set up where hydration heat was electronically controlled according to the analysis results. By measuring free deformation and force to compensate the autogenous strain including relaxation, feasibility of cracks can be estimated. The proposed method can predict the occurrence of cracks better than the material test of the early age concrete which has large variance. The method of this study is particularly useful when it is used as a preliminary experiments to predict the crack more precisely before full-scale concrete placement in construction of large structures.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.23-27
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• 2024

In this study, the time-dependent warpage behavior caused by the viscoelastic properties of prepreg in a printed circuit board (PCB) was analyzed by finite element method (FEM). The accurate viscoelastic properties of the prepreg were measured by stress relaxation test, which were then incorporated into constructed warpage analysis model. When the PCB was subjected to repeated thermal cycles, the warpage of the PCB was restored to its initial state when only the elastic properties of the prepreg were considered, but when the viscoelastic properties were also considered, the warpage was not restored and permanent warpage change occurred. The warpage analysis for three different types of prepreg was conducted to compare their mechanical reliability, and the results showed that materials with elastic properties dominating over viscoelastic properties experienced less warpage, resulting in better mechanical reliability.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Elastomers and Composites
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• v.45 no.4
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• pp.263-271
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• 2010

Intermittent CSR testing was used to investigate the degradation of an FKM O-ring, also the prediction of its life-time. An intermittent CSR jig was designed taking into consideration the O-ring's environment under use. The testing allowed observation of the effects of friction, heat loss, and stress relaxation by the Mullins effect. Degradation of O-rings by thermal aging was observed between 60 and $160^{\circ}C$. In the high temperature of range ($100-160^{\circ}C$) O-rings showed linear degradation behavior and satisfied the Arrhenius relationship. The activation energy was about 60.2 kJ/mol. From Arrhenius plots, predicted life-times were 43.3 years and 69.9 years for 50% and 40% failure conditions, respectively. Based on TTS (time-temperature superposition) principle, degradation was observed at $60^{\circ}C$, and could save testing time. Between 60 and $100^{\circ}C$ the activation energy decreased to 48.3 kJ/mol. WLF(William-Landel-Ferry) plot confirmed that O-rings show non-linear degradation behavior under $80^{\circ}C$. The life-time of O-rings predicted by TTS principle was 19.1 years and 25.2 years for each failure condition. The life-time predicted by TTS principle is more conservative than that from the Arrhenius relationship.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.4
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• pp.1838-1843
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• 2014

Nanoimprint lithography (NIL) fabrication process is regarded as the main alternative to existing expensive photo-lithography in areas such as micro- and nano-electronics including optical components and sensors, as well as the solar cell and display device industries. Functional patterns, including anti-reflective moth-eye pattern, photonic crystal pattern, fabricated by NIL can improve the overall efficiency of such devices. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. In this paper, a cavity-filling process of the moth-eye pattern during the thermal-NIL within the temperature range, where the polymer resist shows the viscoelastic behaviors with consideration of stress relaxation effect of the polymer, were investigated with three-dimensional finite element analysis. The effects of initial thickness of polymer resist and imprinting pressure on cavity-filling process has been discussed. From the analysis results it was found that the cavity filling can be completed within 100 s, under the pressure of more than 4 MPa.

• Journal of the Korean Society of Propulsion Engineers
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• v.23 no.1
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• pp.46-51
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• 2019

Intermittent CSR testing was used to investigate the degradation of a NBR O-ring, and also the prediction of its life-time. An intermittent CSR jig was designed taking into consideration the O-ring's environment under use. Degradation of O-rings by thermal aging was observed between $40^{\circ}C$ and $120^{\circ}C$. O-rings showed non-linear degradation behavior under $80^{\circ}C$. At 20% of failure condition, predicted life-times were 32.5 years by Arrhenius plot and 22.6 years by WLF plot.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.51-57
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• 2021

This paper analyzed the effects of the concentration of nano-silica particles contained in epoxy resin on the thermomechanical properties of the composite materials. The 12nm sized nanoparticles were mixed with epoxy polymer by 5 different weight ratios for the test samples. The glass transition temperature, stress relaxation, and thermal expansion behaviors were measured using dymanic mechanical analyzer (DMA) and thermomechanical analyzer (TMA). It was shown that the nano particle mixing ratios had significant influences on the viscoelastic behaviors of the materials. As the content of the silica particles was increased, the elastic modulus was also increased, while the glass transition temperatures were decreased. Fourier Transform Infrared Spectroscopy (FTIR) results played an important role in determining the causes of the property changes by the filler contents in terms of the molecular structures, enabling the interpretations on the material behaviors based on the chemical structure changes.