• Journal of Ocean Engineering and Technology
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• v.27 no.5
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• pp.22-27
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• 2013

The present work dealt with the high temperature thermal shock properties of 316 stainless steels, in conjunction with a detailed analysis of their microstructures. In particular, the effects of the thermal shock temperature difference and thermal shock cycle number on the properties of 316 stainless steels were investigated. A thermal shock test for 316 stainless steel was carried out at thermal shock temperature differences from $300^{\circ}C$ to $1000^{\circ}C$. The cyclic thermal shock test for the 316 stainless steel was performed at a thermal shock temperature difference of $700^{\circ}C$ up to 100 cycles. The characterization of 316 stainless steels was evaluated using an optical microscope and a three-point bending test. Both the microstructure and flexural strength of 316 stainless steels were affected by the high-temperature thermal shock. The flexural strength of 316 stainless steels gradually increased with an increase in the thermal shock temperature difference, accompanied by a growth in the grain size of the microstructure. However, a thermal shock temperature difference of $800^{\circ}C$ produced a decrease in the flexural strength of the 316 stainless steel because of damage to the material surface. The properties of 316 stainless steels greatly depended on the thermal shock cycle number. In other words, the flexural strength of 316 stainless steels decreased with an increase in the thermal shock cycle number, accompanied by a linear growth in the grain size of the microstructure. In particular, the 316 stainless steel had a flexural strength of about 500 MPa at 100 thermal-shock cycles, which corresponded to about 80% of the strength of the as-received materials.

• International Journal of Automotive Technology
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• v.5 no.4
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• pp.297-302
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• 2004

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermo-mechanical cyclic loading. As a failure of the exhaust manifold is mainly caused by geometric constraints of the less expanded inlet flange and cylinder head, the analysis is based on the exhaust system model with three-dimensional temperature distribution and temperature dependent material properties. The result show that large compressive plastic deformations are generated at an elevated temperature of the exhaust manifold and tensile stresses are remained in several critical zones at a cold condition. From the repetition of these thermal shock cycles, maximum plastic strain range (0.454%) could be estimated by the stabilized stress-strain hysteresis loops. It is used to predict the low cycle thermal fatigue life of the exhaust manifold for the thermal shock test.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.5
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• pp.96-103
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• 2005

One of the major problems limiting the accuracy of piezoelectric transducers fur cylinder pressure measurements in an internal combustion (IC) engine is the thermal shock. Thermal shock is generated from the temperature variation during the cycle. This temperature variation results in contraction and expansion of the diaphragm and consequently changes the force acting on the quartz in the pressure transducer An empirical equation for compensation of the thermal shock error was derived from consideration of the diaphragm thermal deformation and actual pressure data. The result indicate that the thermal shock equation provides reliable correction based on known surface temperature swing.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.1
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• pp.139-145
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• 2007

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermomechanical cyclic loadings. The analysis includes the FE model of the exhaust system, temperature dependent material properties, and thermal loadings. The result shows that at an elevated temperature, large compressive plastic deformations are generated, and at a cold condition, tensile stresses are remained in several critical zones of the exhaust manifold. From the repetitions of thermal shock cycles, plastic strain ranges could be estimated by the stabilized stress-strain hysteresis loops. The method was applied to assess the low cycle thermal fatigue for the engine exhaust manifold. It shows a good agreement between numerical and experimental results.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.31-33
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• 2005

In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.79-82
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• 2005

In this study, mechanical properties of carbon fabrics composite under the thermal shock cycling were evaluated. Due to the interactions between fiber and polymer matrix, it is reasonable to conclude that both thermal cycles of thermal shock result in improvement of interlaminar shear strength(ILSS) for the longer conditioning time duration. The rise in ILSS may be attributed to the improved adhesion by cryogenic compressive stress and also by the post-curing strengthening effect. However, the flexural and tensile strength were decreased with increasing conditioning time of thermal cycle.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1312-1314
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• 1998

SOFC system is often subject to thermal cycle condition during normal start/stop, shutdown, and emergence state. Under the thermal cycle condition of heating and cooling, the SOFC components expand or shrink, which produces thermal stress and thermal shock. The SOFC performance is degraded by the thermal factors. To protect SOFC system from the thermal degradation, the optimum thermal condition must be clarified. In this study, to examine the thermal cycle characteristics, we fabricated single cells of planar SOFC with an area of $5{\times}5cm$. The electrolyte and PEN were tested under thermal cycle conditions in the range of$ 2-8^{\circ}C/min$. After thermal cycle test. crack creation of the components were examined using ultraviolet apparatus. No crack in the electrolyte and PEN were observed. The single cell system with alumina frame were also tested under thermal cycle conditions of 2, 3, $4^{\circ}C/min$. The single cell was fractured at the thermal cycle of 3 and $4^{\circ}C/min$ and the optimum condition of the thermal cycle to be found below $2^{\circ}C/min$.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

• Journal of the Korean Ceramic Society
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• v.42 no.8 s.279
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• pp.532-536
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• 2005

Thermal shock resistance of structural ceramics is a property that is difficult to quantity, and as such is usually expressed in terms of a number of empirical resistance parameters. These are dependant on the conditions imposed, but one method that can be used is the examination of density, Young's modulus and thermal expansion retention after quenching. For high temperature applications, long-annealing thermal durability, cycle thermal stability and residual mechanical properties are very important if these materials are to be used between $1000^{\circ}C$ and $1300^{\circ}C$. In this study, an excellent thermal shock-resistant material based on $Al_2TiO_5-mullite$ composites of various compositions was fabricated by sintering reaction from the individual oxides and adjusting the composition of $Al_2O_3TiO_2/SiO_2$ ratios. The characterization of the damage induced by thermal shock was done by measuring the evolution of the Young's modulus using ultrasonic analysis, density and thermal expansion coefficients.