• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.201-201
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• 2012

Using materials with high thermal conductivity is a matter of great concern in the field of thermal management. In this study, we present our experimental results on an important physical property of carbon nanotube (CNT) films, two-dimensional thermal conductivity obtained by using an optical method based on Raman spectroscopy. We prepared four kinds of CNT films to investigate the effect of CNT type on heat spreading performance of films. This first comparative study using the optical method shows that the arc-discharge single-walled carbon nanotubes yield the best heat spreading film. And we observed thermal conductivity values of CNT films with various transmittances and found that the Raman method works as long as the sample is a transparent film. This study provides useful information on characterization of thermal conduction in transparent CNT films and could be an important step toward high-performance carbon-based heat spreading films.

• Journal of Biosystems Engineering
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• v.22 no.1
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• pp.59-67
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• 1997

An experimental apparatus was developed for the rapid determination of thermal conductivity by transient probe method. The theoretical basis for transient probe method has been investigated. The mathematical model for this method is the Carslaw and Jaeger model which is used perfect line source theory. The small needle probe which is equipped with thermocouple and heating element is constructed. A software that performs data analysis and acquisition is programmed. The influence of the power dissipated per unit length of the probe has been assessed for glycerin. The result showed no significant correlation between thermal conductivity and power input. Determination made with this experimental apparatus were found to agree well with the recommended thermal conductivity data.

• Ceramist
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• v.22 no.4
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• pp.393-401
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• 2019

Thermal analysis means the analysis of a change in a property of a sample, which is related to an imposed temperature alteration. Measurements are usually made with increasing temperature, but isothermal measurements or measurements made with decreasing temperatures are also possible. In fact, any measuring technique can be made into a thermal analysis technique by adding thermal control. Simultaneous use of multiple techniques increases the power of thermal analysis, and modern instrumentation has permitted extensive growth of application. The basic theories of thermal analysis are well developed and some of them are explained in this paper.

• Journal of the Korean Ceramic Society
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• v.55 no.5
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• pp.452-460
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• 2018

This study investigate changes in mechanical behaviors such as indentation load-displacement and hardness of thermal barrier coatings (TBCs) using cycling of thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/super alloy are prepared using different starting granules, 204C-NS and 204NS commercial powers, and the effect of double layers of 204C-NS on 204NS and 204NS on 204C-NS are investigated. The highest temperature applied during thermal shock test is $1100^{\circ}C$ and the maximum number of cycles is 1,200. The results indicate that bilayered TBC showed a relatively mechanically resistant property during thermal shock cycles and that the mechanical behavior is influenced by the microstructure of TBCs by exposure to high temperature during tests or different starting granules.

• The Korean Journal of Food And Nutrition
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• v.25 no.4
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• pp.1068-1074
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• 2012

Ohmic heating uses electric resistance heat which occurs equally and rapidly inside of food when electrical current is flown into. In other study, we researched about soybean protein's characteristic changes by ohmic heating. Nevertheless treated same temperature, denaturation of soybean protein were accelerated by ohmic heating than conventional heating. In this time, we studied thermal property change of potato starch by ohmic heating besides conventional heating. For this purpose, potato starch was heated at same subgelatinization temperature by ohmic and conventional heating. And thermal properties were tested using DSC. Annealing of starch is heat treatment method that heated at 3~4% below the gelatinization point. DSC analysis results of this study, the $T_o$, $T_p$, $T_c$ of potato starch levels were increased, whereas $T_c{\sim}T_o$ was narrowed. This thermal property changes appear similar to annealing's result. It is thought the results shown in this study, because the heating from below the gelatinization point. 6, 12, 24, 72, and 120 hours heating at $55^{\circ}C$ for potato starch, $T_o$, $T_p$, $T_c$ values continue to increased with heating time increase. The gelatinization temperature of raw potato starch was $65.9^{\circ}C$ and the treated starch by conventional heating at $55^{\circ}C$ for 120 hr was $72^{\circ}C$, ohmic was $76^{\circ}C$. The gelatinization range of conventional (72 hr) was $10^{\circ}C$, ohmic was $8^{\circ}C$. In case of 24 hours heating at 45, 50, 55, 60, $65^{\circ}C$ for potato starch, the result was similar to before. $T_o$, $T_p$, $T_c$ values continue to increased and gelatinization range narrowed with heating temperature increase. In case of conventional heating at $60^{\circ}C$, the results of gelatinization temperature and range were $70.1^{\circ}C$ and $9.1^{\circ}C$. And ohmic were $74.4^{\circ}C$ and $7.5^{\circ}C$. When viewed through the results of the above, the internal structure of starch heated by ohmic heating was found that the shift to a more stable form and to increase the homology of the starch internal structure.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.11 s.242
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• pp.1503-1508
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• 2005

Scanning Thermal Microscope (STU) has been known for its superior resolution for local temperature and thermal property measurement. However, commercially available STU probe which is the key component of SThM does not provide resolution enough to explore nanoscale thermal phenomena. Here, we developed a SThM probe fabrication process that can achieve spatial resolution around 50 m. The batch-fabricated probe has a thermocouple junction located at the end of the tip. The size of the thermocouple junction is around 200 m and the distance of the junction from the very end of the tip is 150 m. The probe is currently being used for nanoscale thermal probing of nano-material and nano device.

• Journal of Industrial Technology
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• v.24 no.A
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• pp.9-15
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• 2004

The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.79-82
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• 2005

In this study, mechanical properties of carbon fabrics composite under the thermal shock cycling were evaluated. Due to the interactions between fiber and polymer matrix, it is reasonable to conclude that both thermal cycles of thermal shock result in improvement of interlaminar shear strength(ILSS) for the longer conditioning time duration. The rise in ILSS may be attributed to the improved adhesion by cryogenic compressive stress and also by the post-curing strengthening effect. However, the flexural and tensile strength were decreased with increasing conditioning time of thermal cycle.

• Journal of the Korean Society of Clothing and Textiles
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• v.22 no.7
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• pp.816-825
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• 1998

This study surveys the thermal property and air permeability to the weight reduction rate of PET fabrics. For this purpose, 12 kinds of satin and 18 kinds of plain weave fabrics are prepared with change of the physical properties such as weft yarn count, t.p.m. and density. The weight reduction rate was 0%, 12%, 25% and 30%. The warm/cool feeling(Qmax), thermal insulating value(T.I.V.) and thermal conductivity(K) were measured by KES-F7 System and discussed in relation with the weight reduction rate, weft yarn linear density, t.p.m., weft density of fabric and weave structure.