• Journal of the Korean Society for Precision Engineering
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• v.34 no.4
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• pp.253-258
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• 2017

This paper presents a numerical study on the thermal characteristics of a milling process of titanium alloy with nanofluid minimum-quantity lubrication (MQL). The computational fluid dynamics (CFD) approach is introduced for establishing the numerical model for the nanofluid MQL milling process, and estimated temperatures for pure MQL and for nanofluid MQL using both hexagonal boron nitride (hBN) and nanodiamond particles are compared with the temperatures measured by thermocouples in the titanium alloy workpiece. The estimated workpiece temperatures are similar to experimental ones, and the model is validated.

• Journal of the Korean Ceramic Society
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• v.53 no.3
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• pp.295-300
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• 2016

To investigate the thermal conductivity and the structural properties of naturally cooled excimer-laser annealed Si, molecular-dynamics (MD) simulations have been performed. The thermal conductivity of crystalline Si (c-Si) was measured by direct method at 1000 K. Steady-state heat flow was measured using a stationary temperature profile; significant deviations from Fourier's law were not observed. Reliable processes for measuring the thermal conductivity of c-Si were presented. A natural cooling process to admit heat flow from molten Si (l-Si) to c-Si was performed using an MD cell with a size of $48.9{\times}48.9{\times}97.8{\AA}^3$. During the cooling process, the temperature of the bottom $10{\AA}$ of the MD cell was controlled at 300 K. The results suggest that the natural cooling system described the static structural property of amorphous Si (a-Si) well.

• Advances in nano research
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• v.1 no.4
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• pp.193-202
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• 2013

In this article, we present the effects of Ag doping and after-growth thermal annealing on the photoluminescence (PL) and thermoluminescence (TL) behaviors of $SnO_2$ nanoparticles. $SnO_2$ nanoparticles of 4-7 nm size range containing different Ag contents were synthesized by hydrothermal process. It has been observed that the after-growth thermal annealing process enhances the crystallite size and stabilizes the TL emissions of $SnO_2$ nanostructures. Incorporated Ag probably occupies the interstitial sites of the $SnO_2$ lattice, affecting drastically their emission behaviors on thermal annealing. Both the TL response and dose-linearity of the $SnO_2$ nanoparticles improve on 1.0% Ag doping, and subsequent thermal annealing. However, a higher Ag content causes the formation of Ag clusters, reducing both the TL and PL responses of the nanoparticles.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.1
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• pp.62-66
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• 2011

In this study, the thermal performance of disk can be compared with disk and disk with holes through numerical analysis. The capacity of thermal emission on general disk becomes more than on disk with holes at the distribution of temperature at first and the magnitude of equivalent stress on general disk becomes less than on disk with holes at the distribution of stress. The capacity of thermal emission or the magnitude of thermal deformation on disk with holes becomes less than that on general disk 30 minutes later. The disk with holes is worn less and more durable than general disk. The performance of cooling and braking force at disk and pad can be improved by installing the disk with holes.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 1996.10b
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• pp.171-175
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• 1996

thermal diode is a device which allows heat to be transferred in one direction by convection due to difference of density of fluid. Vertical plate for heat collection and radiation are of utility for design of thermal diode. It was considered the transient process of air filled thermal diode with guide vane which combined rectangular and parallelogrammic shape enclosures. Gr was kept constantly on 1.60$\times$1010 and error range was $\pm$2% during the experiment. Nu was examined when inclined angle are 15$^{\circ}$and 45$^{\circ}$and, also the experiments was carried out with and without guide vane as well. Specially, The effect of guide vane was sensitive. Developed region inclined angle, which is characteristic of system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.5
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• pp.113-119
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• 2015

The technical development of electric vehicles has been actively proceeding because of the reduction of oil resources and need for eco-friendly vehicle technology. In particular, an electronic control unit is an important element in the technology of electric vehicles due to the motor drive system. This paper concerns an experimental study on the thermal analysis of the steering control ECU structure for an electric vehicle. The ECU unit is designed for eight heat sinks for the thermal analysis of the ECU structure. The thermal analysis characteristics of the ECU structure are evaluated by the temperature distribution, heat flow, von Mises stress, total translation, and external surface temperature measurement of the ECU unit.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.8 no.1
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• pp.18-23
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• 2009

This study analyzes the thermal stress at automotive radiators on steady and transient states. The maximum displacement is shown at the lower corner of upper tank with the value of 0.51mm. The displacement becomes smaller at the center of radiator and it becomes larger at this edge. The maximum thermal stress with the value of 62 MPa is shown at the contact between upper tank and cooling plate. Thermal maximum stress with the transient state at the elapsed time of 10 second is lower than that at steady state as much as 0.7%.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.3
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• pp.82-87
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• 2017

This study investigates thermal deformation due to fan shape of a hair dryer. In this study, thermal analysis showed that the shape of an electric fan results in lower temperature than that of a sieve frame. Among the shapes of electric fans, the temperature change decreases as the number of wings decreases. As a result of thermal deformation, model 4 (sieve frame shape) showed increased change of deformation compared to models 1, 2, and 3 (with electric fan shapes). Thus, the model 1 dryer with the sieve frame shape is shown to have the least durability among models 1, 2, 3, and 4. It is thought that the analysis results of this study can be applied to durability improvement and safer design of hair dryers.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.1
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• pp.42-48
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• 2010

Exhaust system of car is studied by thermal analysis. Temperature is uniformly distributed from $22{^{\circ}C}$ to $200{^{\circ}C}$ on exhaust system due to heat transfer. The largest deformation of 2.6919mm is shown at the left end of muffler. The inner face combined with exhaust manifold is applied by the largest thermal equivalent stress of 914.61MPa. After the elapsed time of 360 second, the end of muffler is shown to have the largest deformation of 2.5538mm and the bolt combined with this muffler is applied by the largest equivalent stress of 887.79MPa. By reinforcing material at the end of muffler or fastened bolt shown with highest thermal deformation or stress, the durability at this system can be improved.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.10
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• pp.9-18
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• 2021

The cutting force in a cutting simulation is determined by the cutting conditions, such as cutting speed, feed rate, and depth of cut. The cutting force changes, depending on the material and cutting conditions, and is affected by the heat generated during cutting. The physical properties for predicting the cutting force use constitutive equations as functions of the hardening term, rate-hardening term, and thermal-softening term. To accurately predict the thermal properties, it is necessary to accurately predict the thermal-softening coefficient. In this study, the thermal-softening coefficient was determined, and the cutting force was predicted, using the response-surface method with the cutting conditions and the thermal-softening coefficient as factors.