• Title/Summary/Keyword: Thermal Process

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The Study on Prediction of Hot Water Extraction in a Thermal Energy Storage System (축열시스템의 온수이용 예측에 관한 연구)

  • Cho, W.;Pak, E.T.
    • Solar Energy
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    • v.18 no.3
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    • pp.71-80
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    • 1998
  • In thermal energy storage system, energy collected from many types of heat source is stored in a storage tank and then supply to load for demand. Lately, practical use of thermal energy storage system and attention to essential use of energy have been increased. From this point of view, especially, a study about the energy extraction process from a storage tank is necessary. So in this study, useful rate of hot water and hot water extraction efficiency was analysed respect to dynamic and geometric parameters dominating the hot water extraction process.

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Finite Element Analysis of Thermal Deformations for Microaccelerometer Sensors using SOI Wafers (SOI웨이퍼의 마이크로가속도계 센서에 대한 열변형 유한요소해석)

  • 김옥삼;구본권;김일수;김인권;박우철
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.4
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    • pp.12-18
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    • 2002
  • Silicon on insulator(SOI) wafer is used in a variety of microsensor applications in which thermal deformations and other mechanical effects may dominate device Performance. One of major Problems associated with the manufacturing Processes of the microaccelerometer based on the tunneling current concept is thermal deformations and thermal stresses. This paper deals with finite element analysis(FEA) of residual thermal deformations causing popping up, which are induced in micrormaching processes of a microaccelerometer. The reason for this Popping up phenomenon in manufacturing processes of microaccelerometer may be the bending of the whole wafer or it may come from the way the underetching occurs. We want to seek after the real cause of this popping up phenomenon and diminish this by changing manufacturing processes of mic개accelerometer. In microaccelerometer manufacturing process, this paper intend to find thermal deformation change of the temperature distribution by tunnel gap and additional beams. The thermal behaviors analysis intend to use ANSYS V5.5.3.

Molding and Evaluation of Ultra-Precision Chalcogenide-Glass Lens for Thermal Imaging Camera Using Thermal Deformation Compensation (열변형 보정을 통한 열화상카메라용 초정밀 칼코지나이드 유리렌즈 몰드성형 및 특성 평가)

  • Cha, Du Hwan;Kim, Jeong-Ho;Kim, Hye-Jeong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.2
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    • pp.91-96
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    • 2014
  • Aspheric lenses used in the thermal imaging are typically fabricated using expensive single-crystal materials (Ge and ZnS, etc.) by the costly single point diamond turning (SPDT) process. As a potential solution to reduce cost, compression molding method using chalcogenide glass has been attracted to fabricate IR optic. Thermal deformation of a molded lens should be compensated to fabricate chalcogenide aspheric lens with form accuracy of the submicron-order. The thermal deformation phenomenon of molded lens was analyzed ant then compensation using mold iteration process is followed to fabricate the high accuracy optic. Consequently, it is obvious that compensation of thermal deformation is critical and useful enough to be adopted to fabricate the lens by molding method.

Performance Evaluation of Heat Radiant for 50W LED by the CNT Thermal Interface Material (CNT 열전달 물질에 의한 50W LED의 방열 성능평가)

  • Cho, Young-Tae;Lee, Choong-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.6
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    • pp.23-29
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    • 2014
  • In this study, cooling and heat-transfer tests are performed to compare and evaluate the thermal conductivity in a prepared CNT TIM (thermal interface material). A polymerized CNT heat-transfer resin and commercial thermal grease (Shinetsu G-747) were applied for a comparison test in both cases. Cooling experiments with an aluminum foil specimen were performed in order to measure the temperature distribution using an infrared camera, and in heat radiation experiments, performance testing of the thermal conductivity was conducted using high-power LEDs. Carbon resin with the polymerization of graphite and carbon black, and CNT-polymerized CNT resin with graphite and carbon black were tested and compared with using G-747. It was found that the cooling performance and the heat transfer ability in both the carbon resin and the CNT-polymerized CNT resin were greater than those of G-747 because the temperature by 5. $0^{\circ}C$ in both cases appeared lower than that of the G-747.

Thermal Flow Characteristics of Gas Circuit Breakers near Current Zero Period (가스차단기 전류영점영역에서의 열유동특성에 관한 연구)

  • Lee, Jong-Chul
    • Proceedings of the KIEE Conference
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    • 2004.07c
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    • pp.1772-1774
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    • 2004
  • Because the physics occurring during an interruption process is not well known, it is not easy to analyze the characteristics of a self-blast circuit breaker neither theoretically nor experimentally. Fortunately the available computational power and the numerical method improved recently make it possible to predict an interruption process as precisely and fast as possible. Therefore many researches using computational methods have been done for the interruption process of interrupters and applied to extend the information such as thermal and dielectric reignition. In this paper, we have simulated the interruption process of SF6 self-blast circuit breakers with the arc plasma during the fault interruption of a 10 kA current. The CFD program used here is coupled with the electromagnetic field analysis, the radiation model and the effects of turbulence. Through this work, we have get further information about the thermal performance as well as the behavior of the arc. The results have been compared with the measured arc voltage.

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Optimization for Thermal spray Process by Taguchi Method (다구찌 기법을 이용한 용사코팅의 공정 최적화)

  • Kim, K.T.;Kim, Y.S.
    • Journal of Power System Engineering
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    • v.16 no.2
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    • pp.54-59
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    • 2012
  • In the present study, process optimization for thermal-sprayed Ni-based alloy coating has been performed using Taguchi method and analysis of variance(ANOVA). Ni-based alloy coatings were fabricated by flame spray process on steel substrate, and the hardness test and wear test were performed. Experiments were designed as per Taguchi's L9 orthogonal array and tests were conducted with different Oxygen gas flow, Acetylene gas flow, Powder feed rate and Spray distance. Multi response signal to noise ratio (MRSN) was calculated for the response variables and the optimum combination level of factors was obtained simultaneously using Taguchi's parametric design.

Development of New Polymer Powders for the Industrial SFF system by using SLS Process (SLS 공정을 이용한 산업용 SFF 시스템용 신소재 고분자분말 개발)

  • Bang, Young-Kil;Choi, Ki-Seop;Park, Chang-Hyun;Kim, Hyung-Il;Lim, Byung-Seok;Kim, Dong-Soo
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1404-1409
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    • 2007
  • Polymers for laser sintering were needed in order to fabricate the articles with the three-dimensional duplication equipment of SLS (selective laser sintering) process. The thermal properties, particle size, distribution, and shape of polymer powder had a close relation with the processibility of laser sintering. In this study, we prepared new polymer powders with uniform size and higher bulk density by wet process. Wet process consists of several finely-controlled steps such as dissolution, nucleation, propagation and crystallization. Several additives were added to improve the thermal, rheological, and flow properties.

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Numerical study on heat transfer and densification for SiC composites during thermal gradient chemical vapour infiltration process

  • Ramadan, Zaher;Im, Ik-Tae
    • Carbon letters
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    • v.25
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    • pp.25-32
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    • 2018
  • In this study, a thermal-gradient chemical vapor infiltration (TG-CVI) process was numerically studied in order to enhance the deposition uniformity within the preform. The computational fluid dynamics technique was used to solve the governing equations for heat transfer and gas flow during the TG-CVI process for two- and three-dimensional (2-D and 3-D) models. The temperature profiles in the 2-D and 3-D models showed good agreement with each other and with the experimental results. The densification process was investigated in a 2-D axisymmetric model. Computation results showed the distribution of the SiC deposition rate within the preform. The results also showed that using two-zone heater gave better deposition uniformity.

Finite Element Analysis for Drying Process of Ceramic Electric Insulator Considering Heat and Moisture Transfer (열 및 습도전달을 고려한 세라믹 애자 건조공정의 유한요소 해석)

  • Geum, Yeong-Tak;Jeong, Jun-Ho;Kim, Jun-Han
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.25 no.1
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    • pp.36-46
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    • 2001
  • Finite element analyses of the ceramic drying process are performed. The heat and moisture movements in green ceramics caused by temperature gradient, moisture gradient, conduction, convection and evaporation are considered. The finite element formulation for solving the temperature and moisture distributions which not only change the volume but also induce the hygro-thermal stress is carried out. In order to verify the formulation, the drying process of a ceramic electric insulator is simulated. Temperature distribution, moisture distribution, and hygro-thermal stress are compared with those of other researcher. Good agreements are achieved.

A study on MicroCantilever Deflection for the Infrared Image Sensor using Bimetal Structure (바이메탈형 적외선 이미지 센서 제작과 칸틸레버 변위에 관한 고찰)

  • Kang, Jung-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.4 no.4
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    • pp.34-38
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    • 2005
  • This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

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