• KIEAE Journal
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• v.5 no.1
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• pp.27-33
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• 2005

Global efforts have made to reduce energy consumption and $CO_2$ gas emission. One of the weakest parts for energy loss through the whole building components is building envelopes. Lots of technologies to increase the thermal performance of building envelopes have been introduced in recent year. Transparent Insulation Wall(TIW) is a new technology for building insulation and has been function both solar transmittance and thermal insulation. A mathematical model of a Transparent Insulation Wall equipped with south wall was proposed in order to predict thermal performance under varying climates(summer and winter). Unsteady state heat transfer equations were set up using an energy balance equation and solved using Gauss-Seidel iteration solution procedure. The thermal performance of the TIW determined from a wall surface and air layer temperature, non-airconditioned room temperature and air conditioning load. As a result, this numerical study shows that the TIW is effective in an air conditioning load reduction. Further experimental study is required to establish complete TIW system.

• KIEAE Journal
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• v.4 no.3
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• pp.121-128
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• 2004

One of the most weak parts for energy loss through the whole building components are building envelopes. Lots of technbologies to increase the thermal performance of building envelopes have been introduced in recent years. Transparent insulation is a new technology for building insulation and has function both solar transmittance and thermal insulation. This study has been carried out to develope the transparent insulation panels and TI-wall system and to analyze the thermal performance of TI-wall system by experiments using test-cell and dynamic energy simulation program ESP-r 9.0. This system is regarded as a efficient building envelope system suitable for to reduce the heating and cooling load of the buildings in our country.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.9 no.3
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• pp.300-311
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• 1997

A theoretical method was developed to analyze the effect of low-$\varepsilon$ coatings which have influence on thermal performance of vacuum windwo glazing and double pane glazing. The overall heat transfer coefficient(U) value and thermal performance were analyzed by theroretical method on various kins of windows. TRNSYS program was used to analyze total heating and cooling energy consumption on the model building which has various windows. As the result, better thermal insulation can be achieved on the vacuum window glazing than double pane glazing when low-$\varepsilon$ coating was done on the surface of glass. Total heating and cooling energy consumption was almost same on the double pane window glazing but was lessened on the vacuum window glazing when the window size of south direction increased. Therefore, low-$\varepsilon$ coating was very necessary for vacuum window glazing in order to improve thermal insulation performance and efficient energy conservation can be achieved by vacuum window glazing at the real building which has large window.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.792-797
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• 2009

The excess heat that is generated from PV modules can be removed and converted into useful thermal energy. A photovoltaic-thermal(PVT) module is a combination of photovoltaic module with a solar thermal collector, forming one device that receives solar radiation and produces electricity and heat simultaneously. In general, two types of PVT can be classified: glass-covered PVT module, which produces high-temperature heat but has a slightly lower electrical yield, and uncovered PVT module, which produces relatively lower temperature heat but has a somewhat higher electrical performance. In this paper, the experimental performance of two types of the PVT combined module(water type), glazed(glass-covered) and unglazed, was analyzed. The electrical and thermal performance of the PVT combined modules were measured in outdoor conditions, and the results were compared.

• Journal of Korean Society of Water and Wastewater
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• v.31 no.4
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• pp.339-346
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• 2017

In this study, thermal performance test of VMD module was performed, prior to the construction of the demonstration plant using the vacuum membrane distillation (VMD) module of the capacity of $400m^3/day$ and to the commercialization of the VMD module. For the thermal performance test, the experimental equipment of capacity of $2m^3/day$ was constructed. The permeate flux test and thermal performance test according to feed water conditions such as temperature and flow rate were conducted. The VMD module used in the study was manufactured by ECONITY Co., LTD with PVDF hollow fiber membrane. As a result, the Performance Ratio (PR) of the VMD module showed the maximum value of 0.904 under the condition of feed water temperature of $75^{\circ}C$ and flow rate of $8m^3/h$. PR value of the VMD module using PVDF hollow fiber membrane showed linearly increasing relationship with feed water temperature and flow rate. Also, The permeate flux of the VMD module was analyzed to have maximum value of 18.25 LMH and the salt rejection was 99.99%.

• Journal of the Korean Solar Energy Society
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• v.28 no.2
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• pp.28-33
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• 2008

The purpose of this study was experimentally to investigate thermal performance of heat pipe for evacuated tubular solar collector. Two sets of evacuated tubular solar collector with different condenser shape of heat pipe were prepared. The experiments were performed under the same operating condition with an indoor testing apparatus. Also, the experiments were carried out various testing conditions including inclination, flow rate, and incident heat flux. The results of thermal performance of collector with enlarged condenser showed that $F_R({\tau}{\alpha})$ was 0.6572 and $F_RU_L$ was -2.0086 at $40^{\circ}$. And the results of thermal performance of collector with straight condenser showed that $F_R({\tau}{\alpha})$ was 0.6233 and $F_RU_L$ was -1.4996 at the same inclined angle.

• Journal of the Korea Institute of Military Science and Technology
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• v.16 no.6
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• pp.847-856
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• 2013

In this study, thermal performance of recuperators with plain and offset strip fins is investigated to enhance the thermal efficiency of a micro gas turbine. Thermal cycle analysis is conducted to determine major design parameters of a single-pass counterflow recuperator. In order to evaluate the performance of the recuperator, the effectiveness and the pressure drop in the recuperators are chosen as the objective function and the design constraint, respectively. The optimized geometries for internal structure of the recuperators with plain and offset strip fins are obtained with varying the fin spacing and height. From the result, the recuperator with offset strip fins has better thermal performance when the fin spacing, s, is smaller than 1.45mm and the thermal performance of the recuperator with plain rectangular fins is higher than that with offset strip fins in the region of $s{\geq}1.45mm$. In addition, it is found that the entrance region effect and the longitudinal wall heat conduction effect should be taken into account for accurately predicting the thermal performance of the recuperators with both plain and offset strip fins.

• Transactions of the Korean Society of Automotive Engineers
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• v.17 no.5
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• pp.1-6
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• 2009

The temperature of exhaust gas was raised by increasing of engine movement on developing engine. Thermal of high temperature and pressure reverse in bellows, because of increasing of engine movement and the thermal performance of converter in combustion. As a result, thermal loss is increased and thermal efficiency is decreased rapidly in bellows, it can occur to damage in mechanical structure. In this study, it was necessary to analyze back pressure performance and thermal characteristic on driving condition in exhaust system. It was adapted braid type bellows and straight type exhaust pipe. It was compared with curve type exhaust pipe for lay-out on considering to design of exhaust system. It was necessary to improve thermal characteristic and back pressure performance so that expansion cavity pipe(ECP) was installed between bellows and catalyst convert. Not only decreasing back pressure was solved but also thermal characteristic problems in exhaust pipe because of increasing capacity. According to this study, the basis of data is presented when new exhaust system is designed.

• 한국태양에너지학회:학술대회논문집
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• 2008.11a
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• pp.184-189
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• 2008

The excess heat that is generated from PV modules can be removed and converted into useful thermal energy. A photovoltaic/thermal(PVT) module is a combination of photovoltaic module with a solar thermal collector, forming one device that converts solar radiation into electricity and heat simultaneously In general, two types of PVT can be distinguished: glass-covered PVT module, which produces high-temperature heat but has a slightly lower electrical yield, and uncovered PVT module, which produces relatively low-temperature heat but has a somewhat higher electrical performance. In this paper, the experimental performance of water type unglazed PVT combined module, analyzed. The electrical and thermal performance of the module were measured in outdoor conditions, and the results are analyzed. The results showed that the thermal efficiency of the PVT module was 27.05% average and its PV efficiency was about 11.85% average, both depending on solar radiation, inlet water temperature and ambient temperature.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.121-145
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• 2001

Chip Size Packages (CSP) are now widely used in high speed DRAM. The major driving farce of CSP development is its superior electrical performance than that of conventional package. However, the power dissipation of high speed DRAM like DDR or RAMBUS DRAM chip reaches up to near 2W. This fact makes the thermal management methods in DRAM package be more carefully considered. In this study, the thermal performances of 3 type CSPs named $\mu-BGA$^{TM}$$ $UltraCSP^{TM}$ and OmegaCSP$^{TM}$ were measured under the JEDEC specifications and their thermal characteristics were of a simulation model utilizing CFD and FEM code. The results show that there is a good agreement between the simulation and measurement within Max. 10% of $\circledM_{ja}$. And they show the wafer level CSPs have a superior thermal performance than that of $\mu-BGA.$ Especially the analysis results show that the thermal performance of wafer level CSPs are excellent fur modulo level in real operational mode without any heat sink.