Thermal Performance of TI-wall System

투과형단열재 부착 건물외피구조체의 열성능

  • Published : 2004.09.10

Abstract

One of the most weak parts for energy loss through the whole building components are building envelopes. Lots of technbologies to increase the thermal performance of building envelopes have been introduced in recent years. Transparent insulation is a new technology for building insulation and has function both solar transmittance and thermal insulation. This study has been carried out to develope the transparent insulation panels and TI-wall system and to analyze the thermal performance of TI-wall system by experiments using test-cell and dynamic energy simulation program ESP-r 9.0. This system is regarded as a efficient building envelope system suitable for to reduce the heating and cooling load of the buildings in our country.

Keywords

References

  1. J.A. Chattha, Influence of parametric variation on radiative and conductive losses through transparent honeycomb insulation(THI), 7th International Meetings on Transparent Insulation Technology, 1994
  2. The PASSYS Services, summary report, EC, 1994
  3. A.Kerschberger, W.Platzer, B.Weidlich, Transparente Waermedaemmung, Bauverlag, 1998
  4. Alexandra Raicu, Helen Rose Wilson, Peter Nitz, "Thermotropic systems-Recent results on Component Characterization and simulation of Building Integration, in proceeding of EuroSun'98, 1998
  5. Liisa Rautiainen, 'Transparent Thermal Insulations(TIM)-Performance properties-' Technical Research Center of Finland(VTT) Building Material Laboratory, 1992., pp8-15
  6. 윤종호, '대전지역 직달일사량 실측치 통계분석을 통한 국내일사량자료의 신뢰성 검증연구', 공기조화냉동공학회 대전충청지부 학술강연회, 1999
  7. 유승호, 윤용진, '투과형 단열시스템의 투과 및 단열특성 평가' 대한건축학회계획계논문집 18권4호, 2002. 4