• Tribology and Lubricants
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• 제16권2호
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• pp.99-105
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• 2000

Using a coupled thermal-mechanical analysis, the dynamic distortion of the ventilated disk brakes has been presented for a high-speed train. The offset ratio between the maximum and minimum values of the thermal distortions has been analyzed as a function of a braking number. The computed FEM results show that the offset ratios in radial direction are much greater than those of circumferentially distorted components. This means that the axial distortions in radial direction may dominantly produce thermally caused wears and cracks at the rubbing surfaces.

• Tribology and Lubricants
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• 제18권6호
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• pp.384-388
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• 2002

The adequate design of a passenger car braking system, which is directly related to the safety of a car, is very important since the safety is an essential design parameter of a car to keep men and car from the damage. The thermal behaviors of the ventilated disk has been investigated based on the air cooling effects during repeat braking operations. In this study, the thermal behavior of ventilated disk brake system was investigated by numerical method. The 3-Dimensional unsteady model was simulated by using a general purpose software package “FLUENT” to obtain the temperature distributions of disk and pad. The model includes the more realistic braking method, which repeats braking and release. The effects of aspect ratio of ventilated hole on the heat dissipation was investigated.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• 한국자동차공학회논문집
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• 제11권1호
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• pp.137-142
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• 2003

In automotive brake systems, the frictional heat generated can cause high temperature at the interface of rotor and pad which may deteriorate the material properties of the sliding parts and can result in brake fade. Conventionally, a pie-shaped 3-dimentional model is adopted to calculate temperature of ventilated disk using finite element method. To overcome the difficulties in preparing 3D finite element model and reduce the computational time required, the ventilated rotor is to be analyzed, in this study, as an axisymmetric finite element model in which, taking into considerations the effects of cooling passages, a homogenization technique is used to obtain the equivalent thermal properties and boundary conditions for the elements placed at the vent holes. Numerical tests show the proposed procedure can be successfully applied in practice, replacing 3-dimensional thermal analysis of ventilated disk.

• Korean Journal of Acupuncture
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• 제40권4호
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• pp.156-168
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• 2023

Objectives : This study aimed to determine the status of thermal stimulation devices approved in Korea for medical applications over the past 10 years, and based on this, to obtain insight for future thermal treatment in Korean medical institutions. Methods : We searched the item classification list entitled "Regulations on Medical Device Items and Rating by Item" from the Ministry of Food and Drug Safety Notice No. 2021-24, 2021 (Enforced March 19, 2021; www.mfds.go.kr) for individually licensed heaters using the terms "heat" and "heating". Results : We identified 17 items of thermal stimulation product group, of which 1,308 devices were licensed by February 4, 2022, and 53.2% of them (n=696) were devices with valid permits for distribution in Korea. Among the licensed devices, heating pad systems under/overlay (electric, home use) were approved the most, but combinational stimulator (for medical use, home use; Grade 2) accounted for the highest percentage among the current valid permission. Moxibustion apparatuses were licensed separately for electrical use and non-electrical use, and occupied a low percentage of the total devices. We analyzed 307 devices that were accompanied by technical documents and found that the heat sources were wires in 145 (47.2%), infrared rays in 44 (14.3%) and ultrasonic waves in 42 (13.7%) devices. Most (83.1%) devices were used for pain relief, while other applications included beauty, cancer treatment, maintenance of infant body temperature, and healing fractures. Conclusions : Thermal stimulation devices accounted for about 0.9% of all medical devices, and among them, combinational stimulators and heating pad systems under/overlay had the most valid permits. Thermal stimulation devices using heating wires and infrared rays were the most prevalent, and most were used to relieve pain. In order to develop a range of thermal stimulation devices that can be utilized in Korean medical institutions, it is imperative that they have potential applications beyond pain management, addressing various medical purposes. To achieve this, foundational research is necessary to effectively apply diverse heat sources based on medical objectives.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.55-65
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• 2020

반도체 패키지에서 언더필의 사용은 패키지의 응력 완화 및 습기 방지에 중요할 뿐만 아니라, 충격, 진동 시에 패키지의 신뢰성을 향상시키는 중요한 소재이다. 그러나 최근 패키지의 크기가 커지고, 매우 얇아짐에 따라서 언더필의 사용이 오히려 패키지의 신뢰성을 저하하는 현상이 발견되고 있다. 이러한 이슈를 해결하기 위하여 본 연구에서는 언더필을 대신 할 소재로서 solid epoxy를 이용한 패키지를 개발하여 신뢰성을 향상시키고자 하였다. 개발된 solid epoxy를 스마트 폰의 AP 패키지에 적용하여 열사이클링 신뢰성 시험과 수치해석을 통하여 패키지의 신뢰성을 평가하였다. 신뢰성 향상을 위한 최적의 solid epoxy 소재 및 공정 조건을 찾기 위하여 solid epoxy 의 사용 개수, PCB 패드 타입 및 solid epoxy의 물성 등, 3 개의 인자가 패키지의 신뢰성에 미치는 영향을 고찰하였다. Solid epoxy를 AP 패키지에 적용한 결과 solid epoxy가 없는 경우 보다, solid epoxy를 적용한 경우가 신뢰성이 향상되었다. 또한 solid epoxy를 패키지의 외곽 4곳에 적용한 경우 보다는 6 곳에 적용한 경우가 더 신뢰성이 좋음을 알 수 있었다. 이는 solid epoxy가 패키지의 열팽창에 따른 응력을 완화 시키는 역할을 하여 패키지의 신뢰성이 향상되었음을 의미한다. 또한 PCB 패드 타입에 대한 신뢰성을 평가한 결과 NSMD (non-solder mask defined) 패드를 사용할 경우가 SMD (solder mask defined) 패드 보다 신뢰성이 더 향상됨을 알 수 있었다. NSMD 패드의 경우 솔더와 패드가 접합하는 면적이 더 크기 때문에 구조적으로 안정하여 신뢰성 측면에서 더 유리하기 때문이다. 또한 열팽창계수가 다른 solid epoxy를 적용하여 신뢰성 평가를 한 결과, 열팽창계수가 낮은 solid epoxy를 사용한 경우가 신뢰성이 더 향상됨을 알 수 있었다.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2002년도 춘계학술대회 논문집
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• pp.207-212
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• 2002

The actual buckling of the railroad track structure is suspected to be a complex interaction between the vertical, lateral and torsional modes. To make the analysis tractable, however, most studies restrict themselves to either the vertical or the horizontal plane. Based on a comprehensive and realistic three-dimensional track model developed in the previous study, three dimensional buckling analysis of CWR track subjected to temperature load was performed. Using the study on buckling temperature and mode, sensitivity of track components such as tie spacing, ballast resistance, stiffness of pad-fastening system and rail size were investigated.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권2호
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• pp.204-209
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• 2016

The analyses on self-heating effect in 7 nm node non-rectangular Bulk FinFET device were performed using 3D device simulation with consideration to contact via and pad. From self-heating effect simulation, the position where the maximum lattice temperature occurs in Bulk FinFET device was investigated. Through the comparison of thermal resistance at each node, main heat transfer path in Bulk FinFET device can be determined. Self-heating effect with device parameter and operation temperature was also analyzed and compared. In addition, the impact of interconnects which are connected between the device on self-heating effect was investigated.

• 동력기계공학회지
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• 제5권3호
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• pp.48-55
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• 2001

In many applications. rubber components undergo dynamic stresses or deformations of fairly large magnitude. Since rubbers are not fully elastic, a part of the mechanical energy is converted into heat due to the hysteresis loss. Heat generation without adequate heat dissipation leads to heat build up. i. e. internal temperature rise. The purpose of this paper is to predict temperature rise caused by the hysteresis loss, in a rubber pad subjected to complex dynamic deformation. In this unsteady thermal analysis, the temperature distributions of track components are displayed in contour shapes and the temperature variations of some important nodes are represented graphically with respect to the running time of the tank.