• Title/Summary/Keyword: Thermal Node Analysis

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Spacecraft Radiator Design Optimization Approach of Combining Optimization Algorithm with Thermal Analysis (최적화알고리즘과 열해석을 통합한 위성방열판 설계의 최적화 방법에 관한 연구)

  • Kim, Hui-Kyung
    • Aerospace Engineering and Technology
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    • v.12 no.2
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    • pp.24-29
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    • 2013
  • A spacecraft radiator is a thermal control method to eject internally dissipated heat into the space generated from operation of unit boxes. The efficiency of thermal design may be improved by optimizing radiator design. In this paper, the optimization approach method of node-based radiator design was suggested which is to combine numerical thermal analysis with optimization algorithm. This method has meaning that it can be used practically to implement the spacecraft radiator design regardless of thermal analysis and optimization algorithm software and maintain the same basic concept of an ordinary radiator design approach based on node division of a thermal model. The overall analysis framework with thermal analysis and optimization algorithm would be presented.

Study on Methodology of Trade-Off for Space-borne FPA Thermal Design by Simplified Thermal Node Analysis (단순화 된 열 저항 해석을 이용한 우주용 FPA 열제어 설계 방안 연구)

  • Chang, Jin-Soo;Yang, Seung-Uk;Kim, Jong-Un;Kim, Ee-Eul
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.43 no.2
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    • pp.179-185
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    • 2015
  • The main objective of thermal design for a space-borne FPA(Focal Plane Assembly) is to provide stable thermal environment during imaging operation and thus maintain the image quality. An FPA must be maintained within its operating temperature range and cooled down to its initial temperature soon enough for the next imaging operation. This paper describes the study result on performing trade-off studies for FPA thermal design by using simplified thermal node analysis about FPA preliminary design. It also describes the verification results of the study by comparing thermal analysis results and trade-off study results. According to results, we can conclude that this approach is useful for simple and quick trade-off studies without thermal analysis based on thermal math models.

C0-type Reddy's theory for composite beams using FEM under thermal loads

  • Fan, Xiaoyan;Wu, Zhen
    • Structural Engineering and Mechanics
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    • v.57 no.3
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    • pp.457-471
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    • 2016
  • To analyze laminated composite and sandwich beams under temperature loads, a $C^0$-type Reddy's beam theory considering transverse normal strain is proposed in this paper. Although transverse normal strain is taken into account, the number of unknowns is not increased. Moreover, the first derivatives of transverse displacement have been taken out from the in-plane displacement fields, so that the $C^0$ interpolation functions are only required for the finite element implementation. Based on the proposed model, a three-node beam element is presented for analysis of thermal responses. Numerical results show that the proposed model can accurately and efficiently analyze the thermoelastic problems of laminated composites.

Comparison on Thermal Analysis Methods for Multi-Layer Insulation (다층박막단열재 열해석 방법 비교 연구)

  • Hyun, Bum-Seok;Kim, Hui-Kyung;Choi, Joon-Min
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.290-295
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    • 2003
  • Among the thermal analysis methods for Multi-Layer Insulation(MLI), effective emittance, diffusion MLI node and arithmetic MLI node methods are compared. The methods have been applied to the aluminum panel under the low earth orbit environment. TRASYS program is used for geometrical math modeling and SINDA program for thermal math modeling and temperature calculation. Test cases are selected according to MLI area on the panel. Temperature results are calculated and compared under the ratio of absorptivity and emissivity.

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A STUDY ON THERMAL MODEL REDUCTION AND DYNAMIC RESPONSE (열해석 모델 간략화 및 동적특성에 관한 연구)

  • Jun, Hyoung Yoll;Kim, Jung-Hoon
    • Journal of computational fluids engineering
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    • v.19 no.4
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    • pp.37-44
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    • 2014
  • A detailed satellite panel thermal model composed of more than thousands nodes can not be directly integrated into a spacecraft thermal model due to its node size and the limitation of commercial satellite thermal analysis programs. For the integration of the panel into the satellite thermal model, a reduced thermal model having proper accuracy is required. A thermal model reduction method was developed and validated by using a geostationary satellite panel. The temperature differences of main components between the detailed and the reduced thermal model were less than $1^{\circ}C$ in steady state analysis. Also, the dynamic responses of the detailed and the reduced thermal model show very similar trends. Thus, the developed reduction method can be applicable to actual satellite thermal design and analysis with resonable accuracy and convenience.

Analysis on Self-Heating Effect in 7 nm Node Bulk FinFET Device

  • Yoo, Sung-Won;Kim, Hyunsuk;Kang, Myounggon;Shin, Hyungcheol
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.2
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    • pp.204-209
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    • 2016
  • The analyses on self-heating effect in 7 nm node non-rectangular Bulk FinFET device were performed using 3D device simulation with consideration to contact via and pad. From self-heating effect simulation, the position where the maximum lattice temperature occurs in Bulk FinFET device was investigated. Through the comparison of thermal resistance at each node, main heat transfer path in Bulk FinFET device can be determined. Self-heating effect with device parameter and operation temperature was also analyzed and compared. In addition, the impact of interconnects which are connected between the device on self-heating effect was investigated.

A Study of High-Power Dissipation Parts Modeling for Spacecraft PCB Thermal Analysis (위성 PCB 열해석을 위한 고 전력소산 소자의 모델링 연구)

  • 이미현;장영근;김동운
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.34 no.6
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    • pp.42-50
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    • 2006
  • This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

ASSESSMENT OF MARS FOR DIRECT CONTACT CONDENSATION IN THE CORE MAKE-UP TANK (노심보충수탱크의 직접접촉응축에 대한 MARS의 계산능력평가)

  • Park, Keun Tae;Park, Ik Kyu;Lee, Seung Wook;Park, Hyun Sik
    • Journal of computational fluids engineering
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    • v.19 no.1
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    • pp.64-72
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    • 2014
  • This study aimed at assessing the analysis capability of thermal-hydraulic computer code, MARS for the behaviors of the core make-up tank (CMT). The sensitivity study on the nodalization to simulate the CMT was conducted, and the MARS calculations were compared with KAIST experimental data and RELAP5/MOD3.3 calculations. The 12-node model was fixed through a nodalization study to investigate the effect of the number of nodes in the CMT (2-, 4-, 8-, 12-, 16-node). The sensitivity studies on various parameters, such as water subcooling of the CMT, steam pressure, and natural circulation flow were done. MARS calculations were reasonable in the injection time and the effects of several parameters on the CMT behaviors even though the mesh-dependency should be properly treated for reactor applications.

DEVELOPMENT OF THERMAL ANALYSIS PROGRAM FOR HEAT PIPE INSTALLED PANEL OF GEOSTATIONARY SATELLITE (히트 파이프가 장착된 정지궤도 위성 패널 열해석 프로그램 개발)

  • Jun, Hyoung-Yoll;Kim, Jung-Hoon;Han, Cho-Young;Chae, Jong-Won
    • 한국전산유체공학회:학술대회논문집
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    • 2010.05a
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    • pp.416-421
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    • 2010
  • The north and south panel of a geostationary satellite are used for radiator panels to reject internal heat dissipation of electronics units and utilize several heat pipe networks to control the temperatures of units and the satellite within proper ranges. The design of these panels is very important and essential at the conceptual design and preliminary design stage so several thousands of nodes of more are utilized in order to perform thermal analysis of panel. Generating a large number of nodes(meshes) of the panel takes time and is tedious work because the mesh can be easily changed and updated by locations of units and heat pipes. Also the detailed panel model can not be integrated into spacecraft thermal model due to its node size and limitation of commercial satellite thermal analysis program. Thus development of a program was required in order to generate detailed panel model, to perform thermal analysis and to make a reduced panel model for the integration to the satellite thermal model. This paper describes the development and the verification of panel thermal analysis program with ist main modules and its main functions.

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