• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.2
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• pp.144-153
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• 2009

It is widely known that no-slip assumptions are often violated on regular basis in micrometer- or nanometer-scale fluid flow. In the case of cavity-filling process of nanoimprint lithography(NIL), slip phenomena take place naturally at the solid-to-liquid boundaries, that is, at the mold-to-polymer or polymer-to-substrate boundaries. If the slip or partial slip phenomena are promoted at the boundaries, the processing time of NIL, especially of thermal-NIL which consumes more tact time than that of UV-NIL, can be significantly improved. In this paper it is aimed to elucidate how the cavity-filling process of NIL can be influenced by the slip phenomena at boundaries and to what degree those phenomena increase the process rate. To do so, computational fluid dynamics(CFD) analysis of cavity filling process has been carried out. Also, the effect of mold pattern shape and initial thickness of polymer resist were considered in the analysis, as well.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.236.2-236.2
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• 2005

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.343-348
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• 2007

Molecular dynamics study of thermal NIL (Nano Imprint Lithography) process is performed to examine stamp-resist interactions. A layered structure consists of Ni stamp, poly-(methylmethacrylate) thin film resist and Si substrate was constructed for isothermal ensemble simulations. Imposing confined periodicity to the layered unit-cell, sequential movement of stamp followed by NVT simulation was implemented in accordance with the real NIL process. Both vdW and electrostatic potentials were considered in all non-bond interactions and resultant interaction energy between stamp and PMMA resist was monitored during stamping and releasing procedures. As a result, the stamp-resist interaction energy shows repulsive and adhesive characteristics in indentation and release respectively and irregular atomic concentration near the patterned layer were observed. Also, the spring back and rearrangement of PMMA molecules were analyzed in releasing process.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.239-244
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• 2011

Nano Imprint Lithography(NIL) is technique for copying a pattern from stamp with nano size pattern in order to replicated the materials. It is very important to demold in order to make NIL process effectively. Self Assembled Monolayers(SAM) coater is manufactured by means of decreasing surface energy with the stamp surface treatment to improve release characteristics. Manufactured device contains tilting and rotation option for increasing process life time by coating on the sidewall of the pattern in stamp. The stamp coated with optimized tilting angle $30^{\circ}$ and rotation speed of 10rpm has more imprinting cycles than the stamping coated without tilting and rotation. Effective SAM coating on the sidewall of the pattern in stamp will improve by 50% of process life time.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.1-7
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• 2007

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing of thin polymer films into nanocavities during the thermal NIL has been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality. The simulations have been performed within the viscoelastic plateau region and the stress relaxation effect has been taken into account.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.341-342
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• 2012

• Journal of the Korean Society for Precision Engineering
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• v.28 no.4
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• pp.513-520
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• 2011

The NIL processes have been studied to implement low cost, high throughput and high resolution application. A RNIL(roller NIL) is an alternative approach to flat nanoimprint lithography. RNIL process is necessary to transfer patterns on flexible substrates. Compared with flat NIL, RNIL has the advantages of better uniformity, less pressing force, and the ability to repeat the patterning process continuously on a large substrate. This paper studies the design, construction and verification of a thermal RNIL system. The proposed RNIL system can easily adopt the flat shaped hot plate which is one of the most important technologies for NIL. The NIL system can be used to transfer patterns from a flexible stamp to a flexible substrate, from a flexible stamp to a Si substrate, and from a roller stamp to a flexible substrate, etc. Patterning on flexible substrates is one of the key technologies to produce bendable displays, solar cells and other applications.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.364-367
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• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.441-446
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• 2001

In the integral type reactor, SMART, all the major components such as steam generators, pressurizer and pumps are located inside the single reactor pressure vessel. The objective of this study is to evaluate the structural integrity for RPV of SMART under the postulated pressurized thermal shock by applying the finite element analysis. Input data for the finite element analysis were generated using the commercial code I-DEAS, and the fracture mechanics analysis was performed using the ABAQUS. The crack configurations, the crack aspect ratio and the clad thickness were considered in the parametric study. The effects of these parameters on the reference nil-ductility transition temperature were also investigated.

• Computational Structural Engineering
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• v.11 no.1
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• pp.153-160
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• 1998

A small break loss of coolant accident is postulated as a pressurized thermal shock accident in this study. From the temperature and pressure histories of coolant, distributions of the temperature and stress in a vessel wall are analytically calculated. The stress intensity factor and fracture toughness of the vessel wall are determined at the crack tip using the ASME code method and they are compared to check if cracking is expected to occur during the transient postulated. The maximum allowable reference nil-ductility transition temperatures are determined for various crack sizes and the results are discussed.