• Journal of the Korean Society of Industry Convergence
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• v.26 no.6_2
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• pp.1073-1082
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• 2023

Thermal sensors, also called thermal infrared wavelength sensors, measure temperature based on the intensity of infrared signals that reach the sensor. The infrared signals recognized by the sensor include infrared wavelength(0.7~3.0㎛) and radiant infrared wavelength(3.0~100㎛). Infrared(IR) wavelengths are divided into five bands: near infrared(NIR), shortwave infrared(SWIR), midwave infrared(MWIR), longwave infrared(LWIR), and far infrared(FIR). Most thermal sensors use the LWIR to capture images. Thermal sensors measure the temperature of the target in a non-contact manner, and the data can be affected by the sensor's viewing angle between the target and the sensor, the amount of atmospheric water vapor (humidity), air temperature, and ground conditions. In this study, the characteristics of three thermal imaging sensor models that are widely used for observation using unmanned aerial vehicles were evaluated, and the optimal application field was determined.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.711-714
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• 2002

Thermal infrared camera have poor image qualities compared to commercial CCD cameras, as in contrast, brightness, and. resolution. To compensate the poor Image quality problems associated with the thermal infrared camera, the technique of superimposing thermal infrared image into real ccd image is proposed. The mobile robot KAEROT/m2, loaded with sensor head system at the mast, is entered to monitor leakage of heavy water and thermal abnormality of the calandria reactor area in overhaul period. The sensor head system is composed of thermal infrared camera and cod camera In parallel. When thermal abnormality on observation points and areas of calandria reactor area is occurred, unusual hot image taken from thermal infrared camera is superimposed on real CCD image. In this inspection experiment, more accurate positions of thermal abnormalities on calandria reactor area can be estimated by using technique of mapping thermal infrared image into CCD image, which include characters arranged in MPOQ order.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.5
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• pp.396-403
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• 2000

A thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main part of the system is a thermal camera in which a focal plane array typed sensor is introduced. The sensor detects the mid-range infrared spectrum of target objects and then it outputs a generic video signal which should be processed to form a frame thermal image. Here, a digital signal processor(DSP) is applied for the high speed processing of the sensor signals. The DSP controls analog-to-digital converter, performs correction algorithms and outputs the frame thermal data to frame buffers. With the frame buffers can be generated a NTSC signal and transferred the frame data to personal computer(PC) for the analysis and a monitoring of the thermal scenes. By performing the signal processing functions in the DSP the overall system achieves a simple configuration. Several experimental results indicate the performance of the overall system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.4
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• pp.34-38
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• 2005

This is a widespread requirement for low cost lightweight thermal imaging sensors for both military and civilian applications. Today, a large number of uncooled infrared detector developments are under progress due to the availability of silicon technology that enables realization of low cost IR sensor. System prices are continuing to drop, and swelling production volume will soon drive process substantially lower. The feasibility of micromechanical optical and infrared (IR) detection using microcantilevers is demonstrated. Microcantilevers provide a simple Structurefor developing single- and multi-element sensors for visible and infrared radiation that are smaller, more sensitive and lower in cost than quantum or thermal detectors. Microcantilevers coated with a heat absorbing layer undergo bending due to the differential stress originating from the bimetallic effect. This paper reports a micromachined silicon uncooled thermal imager intended for applications in automated process control. This paper presents the design, fabrication, and the behavior of cantilever for thermomechanical sensing.

• Journal of Sensor Science and Technology
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• v.30 no.6
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• pp.456-460
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• 2021

In this study, a Non-Dispersive Infrared (NDIR) Carbon Dioxide (CO₂) sensor with an externally exposed optical cavity is proposed for improving sensitivity. NDIR CO₂ sensors with high performance must use a lamp-type infrared (IR) source with a strong IR intensity. However, a lamp-type IR source generates high thermal energy that induces thermal noise, interfering with the accuracy of the CO₂ concentration measure. To solve this problem, the optical cavity of the NDIR CO₂ sensor is exposed to quickly dissipate heat. As a result, the proposed NDIR CO₂ sensor has a shorter warm-up time and a higher sensitivity compared to the conventional NDIR CO₂ sensor.

• Journal of Sensor Science and Technology
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• v.20 no.2
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• pp.114-117
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• 2011

A thick 25 ${\mu}m$ thickness poled P(VDF/TrFE) film pyroelectric infrared ray sensor has been fabricated and then thin 1.6 ${\mu}m$ thickness P(VDF/TrFE) film pyroelectric infrared ray sensor has been fabricated also. These thick and thin P(VDF/TrFE) film pyroelectric infrared ray sensor was mounted in TO-5 housing to detect infrared light of 5.5 ~ 14 ${\mu}m$ wavelength for human body detecting with each other. The noise output voltage of the thick P(VDF/TrFE) film pyroelectric infrared ray sensor were 380 mV and NEP(noise equivalent power) is $3.95{\times}10^{-7}$ W which is the similar value with the commercial pyroelectric infrared ray sensor using ceramic materials as a sensing material. The NEP and specific detectivity $D^*$ of the thin P(VDF/TrFE) film pyroelectric infrared ray sensor were $2.13{\times}10^{-8}$ W and $9.37{\times}106$ cm/W under emission energy of 13 ${\mu}W/cm^2$ respectively. These result caused by lower thermal diffusion coefficient of a thin 1.6 ${\mu}m$ thickness PVDF/TrFE film than the thick 25 ${\mu}m$ thickness poled P(VDF/TrFE) film pyroelectric infrared ray sensor.

• Journal of Sensor Science and Technology
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• v.15 no.3
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• pp.179-185
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• 2006

We have developed a noncontact temperature sensor using a silver halides infrared optical fiber. An infrared radiation from a heat source is transferred by a silver halides infrared optical fiber and measured by infrared sensors such as a thermopile and a thermal optical power-meter. The relationships between the temperature of a heat source and the output voltage of the thermopile and the optical power of a thermal optical power-meter are determined. The measurable temperature range using a thermopile and a thermal optical power-meter are from 100 to $750^{\circ}C$ and from 30 to $750^{\circ}C$ respectively. It is expected that a noncontact temperature sensor using infrared optical fiber can be developed for medical and industrial usages based on the results of this study.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1503-1508
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• 2009

This study applied image processing techniques, constructed to real-time, to thermal infrared camera image. Thermal infrared image data was utilized for hot mapping, cool mapping, and rainbow mapping according to changing temperature. It was histogram image processing techniques so that detected shade contrast function of the thermal infrared image, and the thermal infrared image's edge was extracted to classification of object. Moreover, extraction of temperature from image was measured by using the image information program.

• Journal of Biomedical Engineering Research
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• v.16 no.1
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• pp.43-48
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• 1995

A high speed optic scanner capable of 16 frames/sec imaging has been developed for the realization of the infrared thermal Imaging system with a single element infrared sensor. The high speed optic scanner is composed of a rotating polygon mirror for horizontal scanning, a flat mirror mounted on a galvanometer for vertical scanning, and a spherical mirror. It has been experimentally found that the optic scanner is capable of 16 framesllsec imaging with the frame matrix size of 256 x 64.