• 제목/요약/키워드: Thermal Fatigue

검색결과 572건 처리시간 0.027초

열처리 공정에서 가열 영역에 따른 평기어의 열변형 해석에 관한 연구 (A Study on the Thermal Deformation Simulation of Spur Gear According to the Heat Zones in Heat Treatment Process)

  • 김진록;윤성호;정윤철;서창희;권태하
    • 한국기계가공학회지
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    • 제19권7호
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    • pp.60-66
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    • 2020
  • In order to improve fatigue life of transmission gear carburizing is normally used. Carburizing is a very good process to achieve low cost and high performance. The machined gears are heated up to carburizing temperature and then cooled rapidly in an oil bath to produce high surface hardness. The gears may undergo excessive thermal distortion during heating and rapid cooling. In order to predict the distortion during heating and rapid cooling, a coupled thermo-mechanical simulation is needed. In the current research, the simulation of heating and cooling was performed. The results show that the thermal distortion and the residual stresses are well predicted by the coupled simulation. In addition, induction heating and rapid cooling simulation is carried out to predict the thermal distortion. The amount of distortion is compared. It is shown that induction heating is very effective to reduce thermal distortion.

수면시 온열환경에 따른 피부온도 및 신체움직임 분석 (Analysis of Skin Temperature and Body Movements depend on the Thermal Environment during sleep)

  • 임은숙;금종수;이기섭;조관식;배동석;김동규;최광환;최호선
    • 한국감성과학회:학술대회논문집
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    • 한국감성과학회 1999년도 추계학술대회 논문집
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    • pp.3-6
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    • 1999
  • There are numerous studies on relations between sleep and environmental factors such as noise, illumination and thermal conditions. Sleep is affected by the thermal environment. This study describes influence of thermal environment on skin temperature, sleep patterns and body movements using physiological and psychological measurements. The results are as follows: 1) The fluctuations of room temperature during sleep appeared skin temperature variations. The more room temperature is high, the more skin temperature is high in 22$^{\circ}C$, 26$^{\circ}C$, 30$^{\circ}C$. 2) A significant relation between body movement and skin temperature was found within room temperature. Under room temperature conditions of 22$^{\circ}C$, 26$^{\circ}C$, 30$^{\circ}C$, there were significantly higher rates of body movement in the room temperature(30$^{\circ}C$). 3) Uncomfortable after sleep in thermal environment is mostly under high temperature(30$^{\circ}C$), and they are about fatigue due to not enough sleeping. 4) The degree of indoor thermal temperature with sufficient sleeping is in 22.8 ∼ 27.8$^{\circ}C$.

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기계적 및 열적 피로가 교정용 접착제의 결합강도에 미치는 영향 (THE EFFECTS OF MECHANICAL AND THERMAL FATIGUE ON THE SHEAR BOND STRENGTH OF ORTHODONTIC ADHESIVES)

  • 신완철;김종성;김정기
    • 대한치과교정학회지
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    • 제26권2호
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    • pp.175-186
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    • 1996
  • 본 연구의 목적은 기계적 및 열적피로가 전단결합강도에 미치는 영향을 알아보기위한 것이다. 3종의 비반죽형 접착제(Ortho-one, $MonoLok^2,\;System\;1^+$)로 mesh형의 금속 브라켓(Ormesh)을 교정목적으로 발거된 소구치의 법랑질면을 평탄하게 한 후 부착하고 100만회의 반복비틀림과 1,000회의 thermocycling을 가하였다. 그 후 Instron을 이용하여 전단결합강도를 측정하여 다음과 같은 결과를 얻었다. 1. 접착제의 Knoop 경도치는 thermocycling 전에는 $Monolok^2$$64.03kg/mm^2$으로 가장 크고, $System\;1^+$$31.60kg/mm^2$으로 가장 작았으며, thermocycling 후에도 $Monolok^2$$38.08kg/mm^2$로 가장 크고 $System\;1^+$$20.87kg/mm^2$로 가장 작았다. thermocycling 전후 비교시 Ortho-one, $Monolok^2,\;System\;1^+$ 모두에서 유의한 감소를 보였다(P<0.01). 2. 정적 시험군의 전단결합강도는 세 군 간에 유의한 차를 보이지 않았다(P>0.01). 3. 1,000회의 thermocycling 후의 전단결합강도는 $Monolok^2$ 군이 19.34MPa로 가장크고 Ortho-one 군이 13.66MPa로 가장 작게 나타났으며, thermocycling 전과 비교시 Ortho-one 군(P<0.01), $System\;1^+$군(P<0.05) 에서 유의 한 감소를 보였다. 4. 100만회의 반복 비틀림을 가한 후의 전단결합강도는 세 군에서 유사하였으며, 피로시험전과 비교시 세 군 모두 유의한 감소를 보이지 않았다(P>0.01). 5. 접착계면의 파절양상은 모든 군에서 실험조건에 관계없이 주로 브라켓/레진 계면에서 나타났다.

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플립 칩 전자 패키지의 피로 균열이 미치는 열적 기계적 거동 분석 (Effect analysis of thermal-mechanical behavior on fatigue crack of flip-chip electronic package)

  • 박진형;이순복
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회A
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    • pp.1673-1678
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    • 2007
  • The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

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제철용 고로의 유한요소해석 (Finite Element Analysis for Iron-Making Furnace)

  • 이만승;백점기;이제명
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 2004년도 가을 학술발표회 논문집
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    • pp.245-253
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    • 2004
  • There has been recent demand for extending the life of age-degraded structures and equipment by such techniques as diagnosis, maintenance, safety assessment, and estimating residual life on iron-making plants and hydraulic, thermal, and nuclear power plants. These techniques take into account comprehensive scenarios that may cause malfunction and structural damage and allow an assessment of risk based on the likely scenarios. In particular the safety assessment and residual life estimation of age-degraded ships and equipment facilities require consideration of various factors such as mechanical and thermal stresses, corrosion, hardness, load variation due to changes of operating condition, crack generation and strength reduction of material by fatigue. In this study, a detail thermal stress analysis, one of useful techniques of safety assessment and maintenance, is performed on a blast furnace by using general FEM code (MSC/NASTRAN).

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유한요소법을 이용한 용접 잔류응력과 열처리 해석 (Analysis of Welding Residual Stresses and Heat Treatment used by Finete Element Method)

  • 이봉열;조종래;문영훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.334-339
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    • 2003
  • The welding residual stress has on important effect on welding deformation, fatigue fracture, buckling strength, brittle fracture, etc. For the purpose of relaxation of welding residual stress, post welding heat treatment is widely used. In this paper, residual stresses were calculated by two dimensional thermal elasto-plastic analysis using finite element method. Heat transfer analysis are performed by transient analysis. Also structure analysis are carried out by of thermal-mechanical coupled analysis. Numerical analysis are used by ANSYS 5.7.

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2.25Cr-1Mo 강의 응력 시효에 의한 기계적 특성 변화에 대한 연구 (A Study on the Mechanical Properties Change by Stress Aging of 2.25Cr-1Mo Steel)

  • 양현태;김상태
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.517-522
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    • 2001
  • The purpose of this study is to investigate the thermal embrittlement and the mechanical properties of 2.25Cr-1Mo steel aged at high temperature and stress for 250 hours. Original, aged artificially material were tested to obtain the hardness and impact absorbed energy. Hardness and impact absorbed energy decreased with the increasing aging time. The carbide morphology with the thermal embrittlement was found to contribute to the mechanical property change by X-Ray diffraction method.

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열탄소성 해석에 의한 원주용접 원통관의 잔류응력 예측과 그 영향에 대한 연구 (The Studies on the Prediction of Residual Stresses by Thermal Elasto-Plastic Analysis and its Effect for Circumferential Welded Cylinder)

  • 류기열;엄동석
    • Journal of Welding and Joining
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    • 제15권5호
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    • pp.115-123
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    • 1997
  • The buckling strength, fatigue strength, stress corrosion cracking are considerably effected on one of initial imperfections, the residual stresses produced by a circumferential weld between axisymmetric cylinders. Therefore, we study the residual stresses, plastic strain and temperature distribution with using thermal elasto-plastic analysis which are generated by a circumferential weld between axisymmetric cylinders. It is investigated that welding residual stresses have an effect on the strength of cylinder for inner and outer shell under external pressure.

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Analyses of Influence of Frictional Heat on the Contact Stress of High-speed Micro-gears

  • Kim, Cheol;Kim, Hyeong-Seok
    • Composites Research
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    • 제28권4호
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    • pp.244-248
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    • 2015
  • When a small gear rotates at a very high speed over 40,000 rpm, frictional heat is generated on the gear surfaces. Thermal deformations and stresses arising from frictional heat may lower the efficiency and fatigue life of the high-speed gear. Especially, such frictional heat has much stronger effects on the performance of millimeter-sized high-speed gears used for surgical and dental hand-pieces, due to a small surface area. An analytical equation was derived to calculate frictional temperature on a mating gear surface and conduction heat transfer analysis was performed. Thermal deformation and contact stresses were then calculated using FEM for gears used for medical hand-pieces. The contact stresses of the meshed gear and pinion increase by 19.4% and 16.4%, respectively, when the frictional thermal deformations are considered.

$\mu$BGA 솔더접합부의 형상과 수명평가 (Optimal Shape of $\mu$BGA Solder Joints and Thermal Fatigue Life)

  • 신영의;황성진;김종민
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.117-120
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    • 2002
  • In this paper, several methods to predict the solder joint shape are studied. Although there are various methods to predict the solder joint shape, such as truncated sphere method, force-bal tranced analytical solution, and energy-based methods like surface evolver developed by Ken Brakke, we calculate solder joint shape of $\mu$BGA by two solder joint shape prediction methods(truncated sphere method and surface evolver) and then compare results of each method. The results in dicate that two methods can accurately predict the solder joint shape in an accurate range. After that, we calculate reliability solder joint shape under thermal cycle test by FEA program ANSYS. As a result, it could be found that optimal solder joint shape calculated by solder joint prediction method has best reliability in thermal cycle test.

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