• 한국철도학회:학술대회논문집
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• 한국철도학회 2010년도 춘계학술대회 논문집
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• pp.615-620
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• 2010

During braking of railway vehicles the repetitive thermal shock leads to thermal cracks on disc surface, and the lifetime of brake disc is dependent on the number of trimming works for removing these thermal cracks. Many tries for development of high heat resistant brake disc to extend the disc life and to warrant reliable braking performance has been continued. In present study, we carry out the computational fatigue analysis for thermal fatigue test in three candidate materials which were made to develop new high heat resistant material. Using FEM, we simulate thermal fatigue test in three candidate materials and conventional disc material. We then estimate the number of cycle to thermal crack initiation based on data from mechanical fatigue tests, and the results are compared with each material. For each material, the correction factor for $N_{f-40}$ which is the number of cycles when crack over $40{\mu}m$ was observed in thermal fatigue test is decided. From this study, we can verify the performance of thermal fatigue test system and suggest a qualitatively comparative method for heat resistance by FEM analysis of thermal shocking phenomenon.

• Journal of Welding and Joining
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• 제22권6호
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• pp.36-42
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• 2004

Experimental and numerical approaches on the thermal fatigue for the solder joint of flip chip package are discussed. However, it is one of the most difficult problems to choose the proper fatigue model. It was found that viscoplstic FE model with Darveaux method was very desirable and useful to predict the thermal fatigue life of solder joint for flip chip package under $208{\~}423K$ thermal cycling condition such as steep slope of temperature(JEDEC standard condition C). Thermal fatigue life was 1075 cycles as a result of viscoplatic model. It was a good agreement compared to the experimental. And also, it was found from the experimental that probability of the thermal fatigue life was $60{\%}$ at 1500 cycles.

• Journal of Welding and Joining
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• 제19권4호
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• 한국압력기기공학회 논문집
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• 제16권1호
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• pp.22-29
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• 2020

In nuclear power plants, there is a risk of thermal fatigue in equipment and piping affecting system soundness because the temperature change of the system accompanies in every operation and shutdown. Therefore, in order to prevent the excess of the fatigue limit during the lifetime of plants, the fatigue limit of each piping material is determined in the designing stage. However, there are many cases where equipment or piping is locally subjected to thermal fatigue that is not considered in the design, resulting in damage to the equipment and piping, and failure during operation. Currently, local thermal fatigue generation mechanisms that are not taken into account in the design stage are gradually being identified. In this paper, the effects of the fluid temperature fluctuations on the piping soundness due to the mixing of hot and cold water, one of the local thermal fatigue generating mechanisms, were evaluated.

• Journal of Welding and Joining
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• 제17권6호
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• 한국세라믹학회지
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• 제35권10호
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• pp.1094-1100
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• 1998

The thermal fatigue behavior of alumina ceramics was investigated by water quenching method. Single-quench thermal shock tests were performed to decide the critical thermal shock temperature difference ($\Delta$Tc) which was found to be 225$^{\circ}C$ Cyclic thermal shock fatigue tests were performed at temperature diff-erences of 175$^{\circ}C$, 187$^{\circ}C$ and 200$^{\circ}C$ respectively. After cyclic thermal shock fatigue test the distributions of retained strength and crack were observed. Retained strength was measured by four point bending method and crack observation method bydye penetration. In terms of the retained strength distribution the critical number of thermal shock cycles(Nc) were 7 for $\Delta$T=200$^{\circ}C$, 35 for $\Delta$T=187$^{\circ}C$ and 180for $\Delta$T=175$^{\circ}C$ respec-tively. In terms of the crack observation the critical number of thermal shock cycles were 5 for $\Delta$T==200$^{\circ}C$ 20 for $\Delta$T==187$^{\circ}C$ and 150 for $\Delta$T=175$^{\circ}C$ respectively. The difference of Nc investigated by two different methods is due to the formation of the longitudinal cracks which had no effect on the four point bending strength. Therefore the thermal fatigue behavior of alumina ceramics could be more accurately described by the crack observation method than the retained strength measurement method.

• 한국압력기기공학회 논문집
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• 제7권4호
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• pp.44-50
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• 2011

Turbulent mixing of hot and cold coolants is one of the possible causes of high cycle thermal fatigue in piping systems of nuclear power plants. A typical situation for such mixing appears in turbulent flow through a T-junction. Since the high cycle thermal fatigue caused by thermal striping was not considered in the piping fatigue design in several nuclear power plants, it is very important to evaluate the effect of thermal striping on the integrity of mixing tees. In the present work, before conducting detailed evaluation, three thermal striping evaluation methodology suggested by EPRI, JSME and NESC are analyzed. Then, a by-pass pipe connected to the shutdown cooling system heat exchanger is investigated by using these evaluation methodology. Consequently, the resulting thermal stresses and the fatigue life of the mixing tee are reviewed and compared to each other. Futhermore, the limitation of each methodology are also presented in this paper.

• 대한금속재료학회지
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• 제46권6호
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• pp.363-369
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• 2008

Effects of top coat morphology and thickness on thermal fatigue behavior of thermal barrier coatings (TBC) were investigated in this study. Thermal fatigue tests were conducted on three coating specimens with different top coat morphology and thickness, and then the test data were compared via microstructures, cycles to failure, and fracture surfaces. In the air plasma spray specimens (APS1, APS2), top coat were 200 and $300{\mu}m$ respectively. The thickness of top coat was about $700{\mu}m$ in the perpendicular cracked specimen (PCS). Under thermal fatigue condition at $1,100^{\circ}C$, the cycles to top coat failure of APS1, APS2, and PCS were 350, 560 and 480 cycles, respectively. The cracks were initiated at the interface of top coat and thermally grown oxide (TGO) and propagated into TGO or top coat as the number of thermal fatigue cycles increased. For the PCS specimen, additive cracks were initiated and propagated at the starting points of perpendicular cracks in the top coat. Also, the thickness of TGO and the decrease of aluminium concentration in bond coat do not affect the cycles to failure.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 한국정밀공학회지
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• 제26권2호
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• pp.7-15
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• 2009