• Title/Summary/Keyword: Thermal Fatigue

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Development of Reliability Design Technique and Life Prediction Model for Electronic Components (취성/연성 파괴에 대한 수명예측 모델 및 신뢰성 설계)

  • Kim, Il-Ho;Lee, Soon-Bok
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1740-1743
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    • 2007
  • In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the micro-bending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.0Ag0.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb). In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

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The Effect of Degradation on the Fretting fatigue for 1Cr-0.5Mo Steel (1Cr-0.5Mo 강의 재질열화가 프레팅 피로거동에 미치는 영향)

  • Kwon, Jae-Do;Choi, Sung-Jong;Kim, Kyung-Soo;Bae, Yong-Tak
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.11
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    • pp.1979-1985
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    • 2003
  • Fretting is a kind of surface degradation mechanism observed in mechanical components and structures. The fretting damage decreases in 50-70% of the plain fatigue strength. This may be observed in the fossil power plant and the nuclear power plant used in special environments and various loading conditions. The thermal degradation of material is observed when the heat resisting steel is exposed for long period time at the high temperature. In the present study, the degraded 1Cr-0.5Mo steel used for long period time at high temperature (about 515$^{\circ}C$) and artificially reheat-treated materials are prepared. These materials are used for evaluating an effect of thermal aging on the fretting fatigue behavior. Through the experiment, it is found that the fretting fatigue endurance limit of the reheat-treated 1Cr-0.5Mo steel decreased about 46% from the non-fretting fatigue endurance limit, while the fretting fatigue endurance limit of the degraded 1Cr-0.5Mo steel decreased about 53% from the non-fretting fatigue endurance limit. The maximum value of fatigue endurance limit difference is observed as 57%(244 MPa) between the fretting fatigue of degraded material and non-fretting fatigue of reheat-treated material. These results can be a basic data to a structural integrity evaluation of heat resisting steel considered to thermal degradation effect.

Assessment of Fatigue and Fracture on a Tee-Junction of LMFBR Piping Under Thermal Striping Phenomenon

  • Lee, Hyeong-Yeon;Kim, Jong-Bum;Bong Yoo
    • Nuclear Engineering and Technology
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    • v.31 no.3
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    • pp.267-275
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    • 1999
  • This paper deals with the industrial problem of thermal striping damage on the French prototype fast breeder reactor, Phenix and it was studied in coordination with the research program of IAEA. The thermomechanical and fracture mechanics evaluation procedure of thermal striping damage on the tee-junction of the secondary piping using Green's function method and standard FEM is presented. The thermohydraulic(T/H) loading condition used in the present analysis is the random type thermal loads computed by T/H analysis on the turbulent mixing of the two flows with different temperatures. The thermomechanical fatigue damage was evaluated according to ASME code section 111 subsection NH. The results of the fatigue analysis showed that fatigue failure would occur at the welded joint within 90,000 hours of operation. The assessment for the fracture behavior of the welded joint showed that the crack would be initiated at an early stage in the operation. It took 42,698.9 hours for the crack to propagate up to 5 mm along the thickness direction. After then, however, the instability analysis, using tearing modulus, showed that the crack would be arrested, which was in agreement with the actual observation of the crack. An efficient analysis procedure using Green's function approach for the crack propagation problem under random type load was proposed in this study. The analysis results showed good agreement with those of the practical observations.

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Development of the Phased Array Ultrasonic Test Technique for the Weld Inspection of Reactor Coolant System 3" Branch Connection Lines in Nuclear Power Plants (원자로냉각재계통 3" 분기관 용접부 위상배열초음파탐상검사(PAUT)기법 개발)

  • Lee, Seung-Pyo;Moon, Yong-Sig;Jung, Nam-Du;Cho, Yong-Bae;Kim, Chang-Soo
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.4 no.2
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    • pp.40-45
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    • 2008
  • There exist many types of pipe and component fatigue through vibrations, thermal fatigues or shifting. In some cases of thermal stratification/thermal fatigue, pipes & components are receiving thermal stress by means of material expansion and shrinkage by continuous thermal repetitive variation. Small cracks initially occur on the inside surface by thermal stress. These cracks grow in depth the pipe wall and finally come to a rupture. Pipe parts of susceptibility to thermal stratification and thermal fatigue are now being examined by conventional UT(ultrasonic test) as volumetric examination. It is difficult to fully satisfy the code & standards requirements because 3" weldolet weldments of RCS 16" pipe to 3" branch connection lines have complex structural shape. To solve the problems of conventional UT examination, we made a realistic mock-up and UT calibration block. We performed a simulation of phased array UT utilizing CIVA as NDE(Non-Destructive Examination) simulation software. Also we designed phased array UT transducer and wedge, optimal frequency by using simulation data. We performed phased array UT experiment through mock-up including artificial flaws(notch). The phased array UT technique is finally developed to improve the reliability of ultrasonic test at RCS 16" pipe to 3" branch connection weld.

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High Temperature Creep-Fatigue Behavior of 25Cr-13Ni Stainless Steel (25Cr-13Ni 스테인리스강의 고온 크리프-피로거동에 관한 연구)

  • Song, Jeon-Young;Ahn, Yong-Sik
    • Journal of the Korean Society for Heat Treatment
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    • v.28 no.2
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    • pp.68-74
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    • 2015
  • The low cycle fatigue (LCF) and creep-fatigue (hold time tension fatigue, HTTF) tests were performed on the modified 25Cr-13Ni cast stainless steel, which was selected as a candidate material for exhaust manifold in automotive engine. The exhaust manifold is subjected to an environment in which heating and cooling cycle occur due to the running pattern of automotive engine. Several types of fatigue behaviour such as thermal fatigue, thermal mechanical fatigue and creep-fatigue are belong to the main failure mechanisms. High temperature tensile test was firstly carried out to compare the sample with the traditional cast steel for the component. The low cycle fatigue and HTTF tests were carried out under the strain controlled condition with the total strain amplitude from ${\pm}0.6%$ to ${\pm}0.7%$ at $800^{\circ}C$. The hysteresis loops of HTTF tests showed significant stress relaxation during tension hold time. With the increase of tension hold time, the fatigue life was remarkably deceased which caused from the formation of intercrystalline crack by the creep failure mechanism.

Thermal Ratchetting of the Conductive Adhesives Joints Subjected to the Thermal Cycles (전도성 접착제의 열경화 응력에 대한 해석)

  • 박주혁;서승호
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.208-213
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    • 2002
  • When a thermoset conductive adhesive joints are subjected to the thermal cycles, the thermal stresses are developed around the joints. Most of in-plane, hi-axial components of these residual stresses induces large tensile peel stresses and weakens adhesive joints. Also these stresses vary with thermal cycles, and result in thermal fatigue loading and debonding propagation. In this study, the thermal ratchetting effect in conductive adhesive joints are evaluated by the finite element analysis with the viscoelastic material model. In order to Investigate the relationship between thermal ratchetting and glass transition temperature, the mathematical material model has been developed experimentally by dynamic mechanical analysis. These material models are implemented to the finite element analysis with thermal loading cycles. And the stress profiles around the conductive adhesive joints are calculated. It has been observed that the thermal ratchetting occurs when the maximum temperature of thermal cycles is above the glass transition temperature. The peel and shear stress components increase as the thermal loading time increases. This will contributes to thermal fatigue fracture of the joints.

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Thermal Cycling Analysis of Flip-Chip BGA Solder Joints (플립 칩 BGA 솔더 접합부의 열사이클링 해석)

  • 유정희;김경섭
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.1
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    • pp.45-50
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    • 2003
  • Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from $-65^{\circ}C$ to $150^{\circ}C$. It was increased about 3.5 times in comparison with that from $0^{\circ}C$ to $100^{\circ}C$. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

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Thermal Design of IGBT Module with Respect to Stability (IGBT소자의 열적 안정성을 고려한 방열설계)

  • Lee Joon-Yeob;Song Seok-Hyun
    • Proceedings of the KIPE Conference
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    • 2002.11a
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    • pp.205-208
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    • 2002
  • Thermal design is required with considering thermal stability to verify the reliability of electric power device with using IGBT. Numerical analysis is performed to analyzed the change in thermal resistance with respect to the various thermal density of heating element. Correlations between thermal resistance and heat generation density are established. With using these correlations, performance curve is composed with respect to the change in thermal resistance of cooling conditions for natural convection and forced convection. Thermal fatigue is occurred at the Inside and outside of IGBT by repeated heat load. The crack is occurred between base plate and ceramic substrate for the inside. When the crack length is 4mm, the failure is occurred. Therefore, Thermal design method considering thermal density, thermal fatigue resistance is presented on this study and it is expected to thermal design with considering life prediction.

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Thermal Fatigue Life of Underfilled $\mu\textrm$ BGA Solder Joint

  • Kim, H.H.;Han, S.W.;Kim, H.I.;Choi, M.;Shin, Y.E.
    • International Journal of Korean Welding Society
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    • v.4 no.1
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    • pp.61-66
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    • 2004
  • In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

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Torsional Fatigue Characteristics of Aluminum/Composite Co-Cured Shafts with Axial Compressive Preload (축예하중을 가한 알루미늄/복합재료 동시경화 샤프트의 비틀림 피로 특성)

  • Kim, Jong-Woon;Hwang, Hui-Yun;Lee, Dai-Gil
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2003.10a
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    • pp.183-186
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    • 2003
  • Long shafts for power transmission should transmit torsional load with vibrational stability. Hybrid shafts made of unidirectional fiber-reinforced composite and metal have high fundamental bending natural frequency as well as high torque transmission capability. However, thermal residual stresses due to the coefficient difference of thermal expansion of the composite and metal are developed so that the high residual stresses decrease fatigue resistance of the hybrid shafts, especially at low operating temperatures. In this work, axial compressive preload was given to the shaft in order to change the residual stresses. Static and fatigue torsional tests were performed and correlated with stress analyses with respect to the preload and service temperature.

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