• 동력기계공학회지
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• 제15권6호
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• pp.5-10
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• 2011

A turbocharger is subjected to rapid temperature changes during thermal cyclic loads. In order to predict the thermo-mechanical failures, it's very important to estimate temperature distributions under the thermal shock test. This paper suggest the finite element techniques with the temperature histories, a constitutive material model and the mechanical constraints to calculate the thermal stresses and plastic strain distributions for the turbine housing. The first step was to develop a simple coupon approach to represent the failure mechanism of the classical design shapes and secondly applied the actual turbocharger to predict and validate the weak locations under the physical engine test.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2005년도 봄학술 발표회 논문집(II)
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• pp.461-464
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• 2005

As the research on the development of the lightweight concrete block by the hydro-thermal synthetic reaction mixed with the calcareous material and bottom ash that is used less among siliceous material, we studied on the physical and chemical characteristics in the changes of hydro-thermal synthetic reaction of lightweight concrete block compounded with the PP fiber to increase flexural toughness and to prevent fragility failure. The results of the experiment are as follow. According to the increase of hydro-thermal synthetic reaction and the fiber content, compressive and flexural strength increased. Despite the changes of the hydro-thermal synthetic reaction time, tobermorite was produced on each of the specimens similarly. However, the phase of tobermorite was changed in accordance with the changes of time. Also, $CaCo_{3}$ appeared on the surface of the 9 hour hardened specimen.

• 한국표면공학회지
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• 제39권4호
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• pp.147-152
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• 2006

Failure mechanisms of electron beam physical vapor deposited thermal barrier coatings(EB-PVD TBCs) that occur during thermal cyclic oxidation were investigated. The investigations include microstructural degradation of NiCrAIY bond coat, thermally grown oxides(TGOs) along the ceramic top coat-substrate interface and fracture path within TBCs. The microstructural degradation of the bond coat during cyclic oxidation created Al depleted zones, resulting in reduction of NiAl and ${\gamma}$-Ni solid solution phase. It was observed that the fracture took placed primarily within the TGOs or at the interfaces between TGOs and bond coat.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• 항공우주시스템공학회지
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• 제10권2호
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

• Composites Research
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• 제27권3호
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• pp.83-89
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• 2014

본 연구는 엔지니어링 플라스틱인 Polybutylene terephthalate(PBT)에 첨가물을 넣어 강도와 열전도성, 열충격내구성을 개선시키는 것을 목적으로 한다. 그에 따라 PBT에 유리섬유(Glass Fiber)와 Boron nitride(BN)을 복합적으로 첨가하여, 각각의 조성비에 따른 기계적 특성과 열전도 특성변화를 실험적으로 분석하였다. 시험 결과 BN의 함유량이 증가함에 따라 열전도도는 증가하였고, 기계적 강도는 작아졌다. 열충격싸이클을 가한 결과, 비충전 PBT는 파단 신장률이 작아졌으나 충전 PBT는 강도와 열전도율이 별다른 성질변화가 거의 없었다. BN의 첨가에 따라 PBT 복합재의 열전도도도는 크게 향상되었다.

• 한국신뢰성학회지:신뢰성응용연구
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• 제16권4호
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• pp.263-271
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• 2016

Purpose: A slurry pump for flue gas desulfurization system performs a role that discharges the slurry of a plaster shape in a thermal power plant. Since a slurry pump transfers the slurry by the centrifugal force, it has the friction wear in the impeller and liner because of the slurry. Methods: In this study, failure analysis and test evaluation on the slurry pump have been proposed and the process that reliability of the product improves through design improvement has been presented. And failure cause of typical failure case has been investigated and improvement design has been presented. Results: Reliability improvement is established by analysis of the test results of before and after acceleration test. Conclusion: This study can be provided to improve the product reliability through failure analysis of a slurry pump.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2011년도 정기 학술대회
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• pp.539-543
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• 2011

LNG cargo containment system (CCS) has the primary function of ensuring adequate thermal insulation with keeping natural gas below its boiling point. From the viewpoint of structural design, this LNG CCS can be treated as a laminated composite structure showing complex structural responses under the sloshing load which can be defined as a violent behavior of the liquid contents in cargo tanks due to external forced motions. As LNG CCS type, Mark III containment system from TGZ is considered in this paper and then its structural strength assessment is performed based on a simple higher-order shear deformation theory and maximum stress, maximum strain, Tsai-Wu failure criteria developed for laminated composite plates. The assessment is performed to the initial failure of the Mark III CS plate by investigating failure locations and loads.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1996년도 특별강연 및 추계학술발표 개요집
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• pp.19-34
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• 1996

A review was made of fatigue failures of nuclear power plant components in Japan, which were experienced in service and during periodical inspection. No case has been recently reported of a service fatigue failure of a reactor pressure vessel itself, excluding nozzle corner cracks, that occurred many years ago. But, service fatigue failures have been occasionally experienced in piping systems, pumps, and valves, on which fatigue design seems to have been inadequately applied. The causes of fatigue failures can be divided into two categories: mechanical-vibration-induced fatigue and thermal-fluctuation-induced fatigue. Vibration-induced fatigue failure occurs more frequently than is generally thought. The lesson gleaned from the present survey is a recognition that a service fatigue failure may occur due to any one or a combination of the following factors: (1) lack of communication between designers and fabrication engineers, (2) lack of knowledge about a possibility of fatigue failure and poor consideration about the effects of residual stresses, (3) lack of consideration on possible vibration in the design and fabrication stages, and (4) lack of fusion or poor penetration in a welded joint.

• 한국공작기계학회논문집
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• 제16권6호
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• pp.181-186
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• 2007

UBM (Under Bump Metallurgy) of flip chip assemblies consists of several layers such as the solder wetting, the diffusion barrier, and the adhesion layers. In addition, IMC layers are formed between the solder wetting layers (e.g. Cu, Ni) and the solder. The primary failure mechanism of the solder joints in flip chips is widely known as the fatigue failure caused by thermal fatigues or electromigration damages. Sometimes, the premature brittle failure occurs in the IMC layers. However, these phenomena have thus far been viewed from only experimental investigations. In this sense, this paper presents a method for solid modeling of IMC layers in flip chip assemblies, thus providing a pre-processing tool for finite element analysis to simulate the IMC failure mechanism. The proposed modeling method is CSG-based and can also be applied to the modeling of UBM structure in flip chip assemblies. This is done by performing Boolean operations according to the actual sequences of fabrication processes