• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.1269-1271
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• 2009

We had proposed fast thermal stress estimation methodology for the components on system board when the system is stationary within specific ambient air temperature. Now, we will propose one efficient thermal stress estimation methodology, block adaptive filtering methodology, for the FPD electronic system board which is enclosed by mechanical cover.

• 대한전기학회논문지:시스템및제어부문D
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• 제49권2호
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• pp.62-67
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• 2000

The uniformity of temperature on a wafer is one of the most important parameters to control the RTP (Rapid Thermal Process) with proper input signals. Since it is impossible to achieve the uniformity of temperature without exact estimation of temperature at all points on the wafer, the difficulty of understanding internal dynamics and structural complexities of the RTP is a primary obstacle to accurately measure the distributed temperatures on the wafer. Furthermore, it is also hard to accomplish desirable estimation because only few pyrometers have been commonly available in the general equipments. In the paper, a thermal model based on the chamber geometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through certain simulation and experiments. The work can be usefully contributed to building a run-by-run or a real-time controls of the RTP.

• 대한기계학회논문집B
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• 제25권5호
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• pp.673-679
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• 2001

The objective of this work is to estimate the temperature dependent thermal properties of the APC-2 composite using a inverse parameter estimation technique. The present inverse method features the estimation of the thermal conductivity and the volumetric heat capacity, which are dependent on the temperature inside the composite. Furthermore, the thermal conductivity is directionally dependent because of the aniosotropy of the composite. An on-line temperature measurement system with a suitable method of heating is built. A composite slab is fabricated using thermoplastic prepreg for the investigation. The corresponding computer code for evaluating the thermal properties inversely using the temperature reading transmitted from the measurement system is developed. The parameterized form is used for the rapid and stable estimation. The modified Newtons method is adopted for the solution technique of the inverse analysis. The estimated results are compared with the measured data from a previous study for the verification.

• 대한기계학회논문집
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• 제14권6호
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• pp.1679-1688
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• 1990

본 연구에서는 역산법으로 열확산계수를 추정하기 위하여 비선형 매개변수 추 정법을 사용하며, 실험데이터의 통계적 처리방법, 추정이론을 정리하여 이 추정법에 적합한 알고리즘을 만들었다. 수정된 Gauss법을 컴퓨터에 사용할 수 있도록 프로그 램을 개발하였으며, 이 방법의 정확성을 증명하기 위하여 일정열유법과 동일한 실험장 치를 사용하되 경계조건이나 초기조건을 시간의 변화에 따라 이산적으로 측정하여, 매 개변수인 열확산계수를 온도의 함수로 찾고자 하였으며, 통계적인 개념보다는 역산적 인 면에 더 치중하였다.

• 제어로봇시스템학회논문지
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• 제6권9호
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• pp.831-835
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• 2000

The uniformity of themperature on a wafer is a wafer is one the most important parameters to conterol the RTF(Rapid Thermal Process) with proper input signals. It is impossible to achieve the uniformity of temperature without the exact estimation of temperature ar all points on the wafer. There fore, it is difficult to understand the internal dynamics as well as the structural complexities of the RTP, which is aprimary obstacle to measure the distributed temperatures on the wafer accurately. Furthermore, it is also hard to accomplish desirable estimation because only a few pyrometers are available in the general equipments. In the paper, a thermal model based on the chamber grometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through simulation and experiments. The proposed work can be utilized to building a run-by -run or a real-time control of the RTP.

• 제어로봇시스템학회논문지
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• 제5권4호
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• pp.481-488
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• 1999

A thermal model based on the chamber geometry of the industry-standard AST SHS200MA rapid thermal processing system has been developed for the study of thermal uniformity and process repeatability thermal model combines radiation energy transfer directly from the tungsten-halogen lamps and the steady-state thermal conducting equations. Because of the difficulties of solving partial differential equation, calculation of wafer temperature was performed by using finite-difference approximation. The proposed thermal model was verified via titanium silicidation experiments. As a result, we can conclude that the thermal model show good estimation of wafer surface temperature distribution.

• 대한기계학회논문집A
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• 제32권12호
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• pp.1123-1131
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• 2008

This paper provides V-factor estimation under combined mechanical and thermal load for circumferential cracks. Results are based on finite element analyses and effect of types and magnitudes of the thermal stress, crack geometry, the loading mode and plastic strain hardening on variations of the V-factor are investigated. The results of finite element analyses are compared with R6 values. As a result, it is shown that R6 gives generally conservative results. The conservatism is especially increased for the combination of large mechanical and thermal load. As a result, new estimation method which uses failure assessment line in R6 is proposed for V-factor and gives less conservative results.

• 한국광학회지
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• 제2권4호
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• pp.219-226
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• 1991

널리 쓰이는 금속들인 스테인레스강 304, 브라스, 알루미늄, 구리등의 얇은판을 기판에 붙여서, 광흡수를 무시할 수 있은 물질인 plexglass로 만든 광음향셀에 장착한 후 시료에 입사되는 광의 chopping 주파수를 변화시키며 시료에서 발생되는 광음향신호의 크기와 위상을 측정하고 Rosencwaig-Gersho(R-G) 이론에서 발전된 2층(two-layer)모델을 바탕으로한 파라메터 추정(parameter estimation)법을 이용하여 구조적으로 분석하여 열확산도(thermal diffusivity)와 열발산도(thermal effusivity)를 구하였다.

• 한국기계가공학회지
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• 제12권2호
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• pp.107-113
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• 2013

When the main spindle of high precision machine tools are run many hours, heat is generated in bearing parts of the inside of the spindle. Also, headstock is appeared distortion by inside and outside temperature difference of a machine. This paper studies method to measure behavior of machine tool about these thermal effects. In addition, it estimates measurement uncertainty factors which can be appeared in thermal effects measurement. Finding the factor of thermal affect measurement is important for estimation of measurement uncertainty. This paper measures thermal effects of high precision machine tools and evaluates the important factors of uncertainty.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 추계학술대회 논문집
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• pp.550-554
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• 2007

A one-dimensional heat transfer model coupled with parameter estimation is developed in this study to predict the effective thermal conductivities of soil formation and borehole resistances from in situ field test data. In this application a new method of using initial ignoring time(IIT) obtained from error estimation is tried and turned out to be successful in determining soil thermal conductivities. The validity of this model is accomplished through comparison of the predicted temperature profiles of the model with the data from laboratory scale experimental setting. Eleven test boreholes were constructed in Ochang, Chungcheong Buk Do, and thermal response test was carried out with each borehole. The results of the in situ tests were analyzed with our 1-D numerical model and compared with the results of line source method. The comparison shows that the thermal properties from line source method is a little lower (${\sim}95%$)than those from numerical method. The reason of such result seems to be the lower thermal conductivity of grout material, which is not counted in line source method.