• The KSFM Journal of Fluid Machinery
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• v.16 no.5
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• pp.18-23
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• 2013

Thermal aging test is performed to qualify the life time of equipment in thermally aged condition. Due to long life time more than 10 years like as in power plant, the equipment is subjected to the accelerated thermal aging condition which is able to shorten the long aging test period by increasing aging temperature. Normally, conservatism of thermal aging test causes to impose unbalanced and excessive thermal load on components of the equipment, and deformation and damage problems of the components. Additionally, temperature rise of each component through heat generation of the electric equipment leads to long-term problem of the test period. Multi-phase accelerating aging test is to perform thermal aging test in multiple aging conditions after dividing into groups with various components of equipment. The groups might be classified considering various factors such as activation energy, temperature rise, glass transition temperature and melting temperature. In this study, we verify that the multi-phase accelerating aging test method can reduce and equalize the thermal over load of the components and shorten aging test time.

• KIEAE Journal
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• v.4 no.3
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• pp.87-94
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• 2004

The purpose of this study is to improve thermal environment of telecommunication equipment rooms that hold TDX-10, TDX-100, 5ESS-2000, PCM of the latest telecommunication equipment. Analysis program is used the commercial CFD code, Star-CD and DOE-2.1E. The result has been compared by the energy consumption and the temperature contour at the 1 m height of room for each case. Different methods such as the relocation of the existing air-conditioner, the inflow of the ambient air into room, the installation of the forced fan and the cooling system equipment of the duct-connection type have been used to test for improvement of thermal environment. The analysis shows that most efficient method is the inflow of the ambient air into room but auxiliary equipment should be needed to prevent the local thermal spot.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.1051-1053
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• 1999

In this work, thermal phenomena and temperature rise due to thermal source in electric switchboard were investigated using analytical measures. Electric switchboards are assemblies of panels on which are mounted switches, circuit breakers, high current busbars, meter, fuses and terminals essential to the operation of electric equipment. It is very difficult to predict the temperature rise in switchboard due to the existence of several heat sources. To overcome this situations, we focused on the eddy current distribution on the panel of switchboard caused by high current busbars as a fundamental basis. And thermal sources including busbar and switchgear have been considered. Furthermore, thermal transfer phenomena in switchboard was considered theoretically. Finally, three-dimensional thermal model for eddy current analysis has been adopted and FEM analysis was conducted. As a result, three-dimensional numerical analysis found to be applicable to the analysis of thermal phenomena in switchboard.

• Journal of Aerospace System Engineering
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• v.10 no.2
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

• 한국전산유체공학회:학술대회논문집
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• 2006.05a
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• pp.35-40
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• 2006

The insatiable desire of consumers to want more and more performance from computer equipment has driven the powers of this equipment to levels that are putting a strain on the thermal management of data centers housing this equipment. Equipment powers have been rising steadily over the past 10 years at a rapid rate. When the industry switched from bipolar to CMOS back in the early 90's industry experts had thought that the low power CMOS technology would resolve all problems associated with power and heat. Little did they know that now the problems associated with the CMOS equipment has surpassed anything installed with the bipolar technologies 10 to 15 years ago. Data centers are being designed with 15 to 20 years life spans and customers we asking how to plan for the power and cooling within these data centers. This paper addresses some of the current issues with cooling of equipment in data centers and describes some of the on-going efforts to under the thermal environment. To set the stage far describing the data center thermal management issues the power trends from the microprocessor to the rack will be described.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.4 s.235
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• Nuclear Engineering and Technology
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• v.50 no.5
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• pp.683-689
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• 2018

To evaluate equipment survivability of the polymer Viton, used in sealing materials, the effects of its thermal degradation were investigated in severe accident (SA) environment in a nuclear power plant. Viton specimens were prepared and thermally degraded at different SA temperature profiles. Changes in mechanical properties at different temperature profiles in different SA states were investigated. The thermal lag analysis was performed at calculated convective heat transfer conditions to predict the exposure temperature of the polymer inside the safety-related equipment. The polymer that was thermally degraded at postaccident states exhibited the highest change in its mechanical properties, such as tensile strength and elongation.

• Journal of computational fluids engineering
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• v.11 no.3 s.34
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• pp.8-13
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• 2006

The north panel of a geostationary satellite is used as one of the main radiators, on which communication equipment or bus equipment are installed. The thermal control of panel is designed by using embedded heat pipes and surface heat pipes (or external heat pipes) to spread out heat dissipated from equipment all over the radiator evenly and finally to reject the heat to the space through the radiator efficiently. This panel is also divided by several areas based on the operating temperature and dissipation of equipment in order to increase heat rejection capability of radiator. The thermal analysis is carried out for the hot case, Winter Solsitce EOL (End Of Life), in order to validate thermal design of the panel utilized 6 surface heat pipes and 8 embedded heat pipes. The sensitivity studies for the heat pipe failure case and no heat pipe case are performed and compared to its normal state. The heat transport capability of heat pipe is also obtained from these calculations.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.12 s.189
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• pp.64-71
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• 2006

In this study, to design aluminum scrap recycling equipment, fluid flow and thermal analysis considering electromagnetic phenomenon were carried out by using ANSYS program. The magnetic flux generated by electromagnetic pump has influence on fluid velocity of Al liquid metal with molten metal motion and thermal generation. To investigate the effect of the number of phase on fluid flow and thermal generation, electromagnetic force and magnetic flux were obtained by computer simulation. In addition, the results obtained by fluid flow and thermal analysis, recycling equipment of aluminum scrap with the cooling technology of electromagnetic coil, the most suitable phase and current were proposed.

• 한국전산유체공학회:학술대회논문집
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• 2005.04a
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.