• Title/Summary/Keyword: Thermal Deformation Analysis

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Analysis of Pressure Plate Behavior of a Clutch Including Thermal and Mechanical Material Properties (기계적 및 열적 물성을 고려한 클러치 압력판의 거동해석)

  • Hur, Man-Dae;Lee, Sang-Uk;Kim, Gug-Yong;Kang, Sung-Su
    • Journal of Advanced Marine Engineering and Technology
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    • v.33 no.4
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    • pp.524-532
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    • 2009
  • In the mechanical clutches, the pressure plate is one of the important parts for transferring the power and reducing the vibration. Instead of gray and ductile irons, CGI(Compacted Graphite Cast Iron) is concerned to be the replacement recently. A thermo-mechanical coupled analysis was performed to investigate the behavior of the pressure plate for manual clutches. Thermal and mechanical properties of three kinds of cast irons were obtained from the mechanical experiments and referred other technical reports. The results of FEM analysis, were well match with the experimental ones. In this designated FEM method, temperature distribution, stress distribution and thermal deformation were successfully gained and these results will help to design the pressure plate which was made by cast irons including CGI.

Finite Element Analysis of Thermal Deformations for Microaccelerometer Sensors using SOI Wafers (SOI웨이퍼의 마이크로가속도계 센서에 대한 열변형 유한요소해석)

  • 김옥삼;구본권;김일수;김인권;박우철
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.4
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    • pp.12-18
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    • 2002
  • Silicon on insulator(SOI) wafer is used in a variety of microsensor applications in which thermal deformations and other mechanical effects may dominate device Performance. One of major Problems associated with the manufacturing Processes of the microaccelerometer based on the tunneling current concept is thermal deformations and thermal stresses. This paper deals with finite element analysis(FEA) of residual thermal deformations causing popping up, which are induced in micrormaching processes of a microaccelerometer. The reason for this Popping up phenomenon in manufacturing processes of microaccelerometer may be the bending of the whole wafer or it may come from the way the underetching occurs. We want to seek after the real cause of this popping up phenomenon and diminish this by changing manufacturing processes of mic개accelerometer. In microaccelerometer manufacturing process, this paper intend to find thermal deformation change of the temperature distribution by tunnel gap and additional beams. The thermal behaviors analysis intend to use ANSYS V5.5.3.

A Convergent Investigation on the thermal and stress analyses of CPU Cooler (CPU 쿨러의 열 및 응력 해석에 관한 융합 연구)

  • Choi, Kye-Kwang;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.11 no.8
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    • pp.153-158
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    • 2020
  • In this study, the thermal and stress analyses were performed by applying a temperature condition of 100℃ at CPU cooler model. The value of heat flux value is shown to be the most at the lower rod area. The upper part becomes, the smaller the heat flow rate. The highest temperature is shown at the bottom of the CPU cooler model. Overall, the upper part becomes, the smaller the temperature becomes. Based on the temperature analysis, the thermal deformation caused by expansion, the deformation becomes smaller as the upper part of the overlapping plates. The great deformation happens at the bent area of the small rod as the lower part of model and the least deformation is shown at the lowest floor of model. In addition, the maximum thermal stress of 570.63 MPa happens at the floor below model. The stress is shown to decrease as the upper part of the overlapping plates becomes. But the stress is shown to increase somewhat at the middle part of model. By applying the study result on the thermal and stress analyses of CPU cooler, this study is seen to be suitable for the aesthetic convergence.

Effect of Thermal Deformation of Optical Pick-up Base on the Optical Performance (광 픽업의 열변형이 광학적 성능에 미치는 영향)

  • Kim H.;Cho S.;Lee J.;Kang S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.05a
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    • pp.105-108
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    • 2004
  • The effect of thermal deformation of optical pick-up due to laser diode(LD) and LD driving integrated circuit on the optical performance of digital versatile disk(DVD) optical system was analyzed using the finite element analysis with initial surface residual stress conditions, and results were compared with the measured results with holographic interferometry. Ray tracing was performed using the deformed configuration of optical system.

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Thermal Behavior of Ventilated Disc Brakes Considering Contact Between Disc and Pad (디스크 브레이크와 패드의 접촉을 고려한 벤틸레이티드 디스크 브레이크의 열적거동에 관한 연구)

  • Ma, Jeong-Beom;Lee, Bong-Gu
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.23 no.3
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    • pp.259-265
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    • 2014
  • When the brakes of a vehicle are applied, large amounts of heat are generated on the surfaces of the brake discs owing to friction between the discs and the brake pads. A high temperature gradient on the disc surfaces leads to thermal deformation and severe disc abrasion. Ultimately, the thermal deformation and disc wear give rise to a thermal judder phenomenon, which has a major effect on the stability of the vehicle. To investigate and propose a solution to these problems, thermoelastic instabilities under applied thermal and mechanical loads were analyzed using the commercial finite element package ANSYS by considering the contact surfaces between the discs and pads. Direct-contact three-dimensional finite elements between the discs and pads were applied to investigate the disc friction temperature, thermal deformation, and contact stress so that the thermal judder phenomenon on the surface of the disc could be predicted.

Study about material properties of Al particles and deformation of Al alloy substrate by cold gas dynamic spray (초음속 저온분사법에 의한 알루미늄 합금 모재의 변형과 적층된 알루미늄 층의 물성에 대한 연구)

  • Lee, J.C.;Ahn, S.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2006.05a
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    • pp.145-148
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    • 2006
  • Cold gas dynamic spray is a relatively new coating process by which coatings can be produced without significant heating during the process. Cold gas dynamic spray is conducted by powder sprayed by supersonic gas jet, and generally called the kinetic spray or cold-spray. Cold-spray was developed in Russia in the early 1980s to overcome the defect of thermal spray method. Its low process temperature can minimize thermal stress and also reduce the deformation of the substrate. Most researches on cold-spray have focused on micro scale coating, but our research team tried to apply this method to macro scale deposition. The macro scale deposition causes deformation of a thin substrate which is usually convex to the deposited side. In this research, the main cause of the deformation was investigated using 6061-T6 aluminum alloy and properties of deposited aluminum layer such as coefficient of thermal expansion, Elastic modulus, hardness, electric conductivity were measured. From the result of the analysis, it was concluded that compressive residual stress was the main reason of substrate deformation while CTE had little effect.

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Effect of cold-spray deposition on deformation of aluminum alloy substrate (초음속 저온분사법에 의한 알루미늄 분말 적층에서 얇은 모재에 발생하는 변형에 대한 연구)

  • Lee Jae-Chul;Chun Doo-Man;Kim Sung-Geun;Ahn Sung-Hoon
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.99-100
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    • 2006
  • Cold gas dynamic spray or cold-spray is a deposition process, which causes deformation of a thin substrate. The deformation is usually convex to the deposited side. In this research, the main cause of the deformation was investigated using 6061-T6 aluminum alloy. The effects or anisotropic coefficient or thermal expansion (CTE) or the deposited layer by cold-spray and residual stress were studied by experiments and finite element analysis. The Hole Drilling method was applied to measure residual stress in the cold-spray layer and substrate. The data obtained by the experiments were used for the analysis of substrate deformation. From the result of the analysis, it was concluded that compressive residual stress was the main reason of substrate deformation while CTE had little effect.

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Simulation Research on the Thermal Effects in Dipolar Illuminated Lithography

  • Yao, Changcheng;Gong, Yan
    • Journal of the Optical Society of Korea
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    • v.20 no.2
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    • pp.251-256
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    • 2016
  • The prediction of thermal effects in lithography projection objective plays a significant role in the real-time dynamic compensation of thermal aberrations. For the illuminated lithography projection objective, this paper applies finite element analysis to get the temperature distribution, surface deformation and stress data. To improve the efficiency, a temperature distribution function model is proposed to use for the simulation of thermal aberrations with the help of optical analysis software CODE V. SigFit is approved integrated optomechanical analysis software with the feature of calculating OPD effects due to temperature change, and it is utilized to prove the validation of the temperature distribution function. Results show that the impact of surface deformation and stress is negligible compared with the refractive index change; astigmatisms and 4-foil aberrations dominate in the thermal aberration, about 1.7 λ and 0.45 λ. The system takes about one hour to reach thermal equilibrium and the contrast of the imaging of dense lines get worse as time goes on.

Thermal Stress Anaysis of Burning Plate by Configuration of Outdoor Gas Boiler (야외용 가스보일러의 연소판 형상에 따른 열응력 해석)

  • Lee, Suk Young
    • Journal of Energy Engineering
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    • v.24 no.4
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    • pp.48-54
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    • 2015
  • This study investigates the result of thermal stress analysis on burning plate by classes at outdoor gas boiler. In the analysis results at the steady state, the maximum stress and deformations are 666,8MPa at A type and 0.20476mm at B type respectively. The deformation becomes larger as the field goes on from the center to the outside at burning plate. As there are 8 types in the order of maximum stress and deformation, F and C type have safest among 8 types respectively. Therefore, F type becomes most excellent on strength and safety among 8 types. By using the analysis result of burning plate model at gas boiler, it is possible to design the model applied practically at the safe component parameters of boiler system.

Evaluation of Creep-Fatigue Damage of KALIMER Reactor Internals Using the Elastic Analysis Method in RCC-MR

  • Koo, Gyeong-Hoi;Bong Yoo
    • Nuclear Engineering and Technology
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    • v.33 no.6
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    • pp.566-584
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    • 2001
  • In this paper, the progressive deformation and the creep-fatigue damage for the conceptually designed reactor internals of KALIMER(Korea Advanced Liquid MEtal Reactor) are carried out by using the elastic analysis method in the RCC-MR code for normal operating conditions including the thermal load, seismic load (OBE) and dead weight. The maximum operating temperature of this reactor is 53$0^{\circ}C$ and the total service lifetime is 30 years. Thus, the time- dependent creep and stress-rupture effects become quite important in the structural design. The effects of the thermal induced membrane stress on the creep-fatigue damage are investigated with the risk of the elastic follow-up. To calculate the thermal stress, detailed thermal analyses considering conduction, convection and radiation heat transfer mechanisms are carried out with the ANSYS program. Using the results of the elastic analysis, the progressive deformation and creep-fatigue damages are calculated step by step using the RCC-MR in detail. This paper ill be a very useful guide for an actual application of the high temperature structural design of the nuclear power plant accounting for the time-dependent creep and stress-rupture effects.

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