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http://dx.doi.org/10.15207/JKCS.2020.11.8.153

A Convergent Investigation on the thermal and stress analyses of CPU Cooler  

Choi, Kye-Kwang (Department of Metal Mold Design Engineering, Kongju national University)
Cho, Jae-Ung (Division of Mechanical & Automotive Engineering, Kongju National University)
Publication Information
Journal of the Korea Convergence Society / v.11, no.8, 2020 , pp. 153-158 More about this Journal
Abstract
In this study, the thermal and stress analyses were performed by applying a temperature condition of 100℃ at CPU cooler model. The value of heat flux value is shown to be the most at the lower rod area. The upper part becomes, the smaller the heat flow rate. The highest temperature is shown at the bottom of the CPU cooler model. Overall, the upper part becomes, the smaller the temperature becomes. Based on the temperature analysis, the thermal deformation caused by expansion, the deformation becomes smaller as the upper part of the overlapping plates. The great deformation happens at the bent area of the small rod as the lower part of model and the least deformation is shown at the lowest floor of model. In addition, the maximum thermal stress of 570.63 MPa happens at the floor below model. The stress is shown to decrease as the upper part of the overlapping plates becomes. But the stress is shown to increase somewhat at the middle part of model. By applying the study result on the thermal and stress analyses of CPU cooler, this study is seen to be suitable for the aesthetic convergence.
Keywords
CPU cooler; Thermal analysis; Stress analysis; Temperature; Stress; Convergence;
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Times Cited By KSCI : 14  (Citation Analysis)
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