• Composites Research
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• v.16 no.2
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• pp.62-67
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• 2003

Interfacial properties and damage sensing for the carbon fiber/epoxy-amine terminated (AT)-polyetherimide (PEI) composite were performed using microdroplet test and electrical resistance measurements. As AT-PEI content increased, the fracture toughness of epoxy-AT-PEI matrix increased, and interfacial shear strength (IFSS) increased due to the improved fracture toughness by energy absorption mechanisms of AT-PEI phase. The microdroplet in the carbon fiber/neat epoxy composite showed brittle microfailure mode. At 15 phr AT-PEI content ductile microfailure mode appeared because of improved fracture toughness. After curing, the change in electrical resistance $\Delta\textrm{R}$) with increasing AT-PEI content increased gradually because of thermal shrinkage. Under cyclic stress, in the neat epoxy case the reaching time until same stress was faster and their slope was higher than those of 15 phr AT-PEI. The result obtained from electrical resistance measurements under curing process and reversible stress/strain was correspondence well with matrix toughness properties.

• Applied Chemistry for Engineering
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• v.34 no.3
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• pp.252-257
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• 2023

In this study, to replace phthalate-based plasticizers known as endocrine disruptors, compounds as plasticizer candidates were synthesized by using alcohols containing rings and fatty acids extracted from animal and vegetable oils, and their properties as plasticizers, including their plasticization efficiency, were evaluated. Nine compounds synthesized by esterification of fatty acids (caprylic acid, capric acid, lauric acid) and alcohols (solketal, benzyl alcohol, cyclohexanol) were identified by ¹H-NMR. The nine synthetic compounds were evaluated for their plasticity by adding them to PVC resin, and compared with the commercial plasticizers DEHP, DINCH, and ESO. According to the results, plasticization efficiency was 0.96 to 1.02 times higher than DEHP, 0.94 to 0.98 times higher than ESO, and 1.05 to 1.10 times higher than DINCH. Thermal stability was somewhat lower than that of DEHP and DINCH, but showed better results than ESO. The results of the solvent extraction test showed that both aqueous and oily solvents showed higher values than DEHP and DINCH but showed similar or superior properties to ESO.

• Journal of Korean Society of Steel Construction
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• v.18 no.5
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• pp.543-551
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• 2006

Cold-formed steel studs that are being used as load-bearing members of wall panels for steel houses have a problem with their insulation due to the heat bridging of their web. Some additional thermal insulating materials should be used. To solve this problem, the new-concept hybrid stud, which consists of a galvanized steel sheet (t = 1.0 m - 12.0 m) and a GFRP panel (t = 4.0-6.0 mm), has recently been developed. An investigation on the structural behavior and the strength capacity of this new hybrid stud has been conducted so that it can be used in load-bearing wall panels of residential buildings. This paper describes the axial compression-torsion test results of the hybrid studs under both axial compression and torsion using ATTM. The main factors of the test were the stud length, the magnitude of the initial compressive force, and the loading method of the monotonic or cyclic loading. The torsion was applied increasingly while the initial compression was kept constant to the failure of the hybrid section. The advanced analysis results obtained form the finite element procedure that considered the material properties of the high-strength galvanized steel and the GFRP were compared with the test results for verification.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• The Journal of Advanced Prosthodontics
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• v.12 no.4
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• pp.218-224
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• 2020

PURPOSE. The objectives of this study were to evaluate the fracture strength and fracture patterns of provisional crowns fabricated from different materials and techniques after receiving stress from a simulated oral condition. MATERIALS AND METHODS. A monomethacrylate-based resin (Unifast Trad) and a bis-acryl-based (Protemp 4) resin were used to fabricate provisional crowns using conventional direct technique. A milled monomethacrylate resin (Brylic Solid) and a 3D-printed bis-acrylate resin (Freeprint Temp) were chosen to fabricate provisional crowns using the CAD/CAM process. All cemented provisional crowns (n=10/group) were subjected to thermal cycling (5,000 cycles at 5°-55℃) and cyclic occlusal load (100 N at 4 Hz for 100,000 cycles). Maximum force at fracture was tested using a universal testing machine. RESULTS. Maximum force at fracture (mean ± SD, N) of each group was 657.87 ± 82.84 for Unifast Trad, 1125.94 ± 168.07 for Protemp4, 953.60 ± 58.88 for Brylic Solid, and 1004.19 ± 122.18 for Freeprint Temp. One-way ANOVA with Tamhane post hoc test showed that the fracture strength of Unifast Trad was statistically significantly lower than others (P<.01). No statistically significant difference was noted among other groups. For failure pattern analysis, Unifast Trad and Brylic Solid showed less damage than Protemp 4 and Freeprint Temp groups. CONCLUSION. Provisional crowns fabricated using the CAD/CAM process and the conventionally fabricated bis-acryl resins exhibited significant higher fracture strength compared to conventionally fabricated monomethacrylate resins after the aging regimen. Therefore, CAD/CAM milling and 3D printing of provisional restorations may be good alternatives for long term provisionalization.

• Journal of the Society of Naval Architects of Korea
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• v.45 no.6
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• pp.679-687
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• 2008

The fatigue life of ship structure under cyclic loading condition is made up of crack initiation and propagation stages. For a welding member in ship structure, the fatigue crack propagation life is more important than the fatigue crack initiation life. To calculate precisely the fatigue crack propagation life at the critical welding location, the knowledge of the residual stress sensitivity on the fatigue strength is necessary. In this study, thermo elastic-plastic analysis was conducted in order to examine the effect of residual stress on the fatigue crack propagation life. Also the fatigue crack propagation lives considering residual stress were calculated using fatigue crack growth code, AFGROW, on the basis of fracture mechanics. AFGROW is widely used for fatigue crack growth predictions under constant and variable amplitude loading. The reliability of AFGROW on the fatigue of ship structure was confirmed by the comparison of the estimated results with the fatigue propagation test results.

• Smart Structures and Systems
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• v.12 no.3_4
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• pp.415-426
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• 2013

Condition assessment and monitoring of bridges is critical for safe passenger travel, public transportation, and efficient freight. In monitoring, displacement measurement capability is important to keep track of performance of bridge, in part or as whole. One of the most important parts of a bridge is the expansion joint, which accommodates continuous cyclic thermal expansion of the whole bridge. Though expansion joint is critical for bridge performance, its inspection and monitoring has not been considered significantly because the monitoring requires long-term data using cost intensive equipment. Recently, a wireless smart sensor network (WSSN) has drawn significant attention for transportation infrastructure monitoring because of its merits in low cost, easy installation, and versatile on-board computation capability. In this paper, a rapid wireless displacement monitoring system, wireless hybrid sensor (WHS), has been developed to monitor displacement of expansion joints of bridges. The WHS has been calibrated for both static and dynamic displacement measurement in laboratory environment, and deployed on an in-service highway bridge to demonstrate rapid expansion joint monitoring. The test-bed is a continuous steel girder bridge, the Founders Bridge, in East Hartford, Connecticut. Using the WHS system, the static and dynamic displacement of the expansion joint has been measured. The short-term displacement trend in terms of temperature is calculated. With the WHS system, approximately 6% of the time has been spent for installation, and 94% of time for the measurement showing strong potential of the developed system for rapid displacement monitoring.

• Corrosion Science and Technology
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• v.20 no.5
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• pp.249-255
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• 2021

In this work, we proposed a facile method to fabricate the three-dimensional porous copper current collector (3D Cu CC) for a Si-dominant anode in a Li-ion battery (LiB). The 3D Cu CC was prepared by combining chemical etching and thermal reduction from a planar copper foil. It had a porous layer employing micro-sized Cu balls with a large surface area. In particular, it had strengthened attachment of Si-dominant active material on the CC compared to a planar 2D copper foil. Moreover, the increased contact area between a Si-dominant active material and the 3D Cu could minimize contact loss of active materials from a CC. As a result of a battery test, Si-dominant active materials on 3D Cu showed higher cyclic performance and rate-capability than those on a conventional planar copper foil. Specifically, the Si electrode employing 3D Cu exhibited an areal capacity of 0.9 mAh cm^-2 at the 300^th cycles (@ 1.0 mA cm^-2), which was 5.6 times higher than that on the 2D copper foil (0.16 mAh cm^-2).

• Geomechanics and Engineering
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• v.33 no.1
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• pp.29-40
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• 2023

Xanthan gum and starch compound biopolymer (XS), an environmentally friendly soil-binding material produced from natural resources, has been suggested as a slope protection material to enhance soil strength and erosion resistance. Insufficient wet strength and the consequent durability concerns remain, despite XS biopolymer-soil treatment showing high strength and erosion resistance in the dried state, even with a small dosage of soil mass. These concerns need to be solved to improve the field applicability and post-stability of this treatment. This study explored the utilization of an alkaline-based cation crosslinking method using calcium hydroxide and sodium hydroxide to induce non-thermal gelation, resulting in the enhancement of the wet strength and durability of biopolymer-treated soil. Laboratory experiments were conducted to assess the unconfined compressive strength and cyclic wetting-drying durability performance of the treated soil using a selected recipe based on a preliminary gel formation test. The results demonstrated that the uniformity of the gel structure and gelling time varied depending on the ratio of crosslinkers to biopolymer; consequently, the strength of the soil was affected. Subsequently, site soil treated with the recipe, which showed the best performance in indoor assessment, was implemented on the field slope at the bridge abutment via compaction and pressurized spraying methods to assess feasibility in field implementation. Moreover, the variation in surface soil hardness was monitored periodically for one year. Both slopes implemented by the two construction methods showed sufficient stability against detachment and scouring, with a higher soil hardness index than the natural slope for a year.