• The Transactions of the Korean Institute of Power Electronics
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• v.9 no.3
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• pp.203-212
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• 2004

The heat pipe for cooling power semiconductor is required no performance changing during the life cycle up to 20 years. For the long reliable performance of the heat pipe, my reasons that has possibility to generate non condensable gases we not allowed. In this research, the maximum heat transport rate and operation characteristics that are related to various geometric and thermal conditions are carried out. Also the test items, specifications and methods to guarantee the long life cycle of the heat pipe for power semiconductor cooling device are provided and the tests are performed.

• 유체기계공업학회:학술대회논문집
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• 2004.12a
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• pp.225-231
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• 2004

Scroll compressor has been used extensively for refrigeration since the early 1980's for its improved efficiency, greater reliability, smoother operation, lower noise and vibration. And also, nowadays, the scroll mechanism is used for expander even though in niche market yet. But scroll expander has not been used for high-temperature and high-pressure gas, because the continuous expansion of the gas causes a wide range of temperature distribution over the whole scroll wrap that leads to differential thermal expansion of scroll elements, which results in system vibrations, noise and efficiency losses. For the scroll expander to produce power more efficiently, all of radial and radial clearances between scroll wrap must be the same. In order to reduce differential thermal expansion in addition to improvements in thermal efficiency and specific power, we propose a scroll expander with heating structure. Heat-pipe heating structure is considered as the most effective method to heat the scroll expander at a uniform temperature. This paper includes some results of preliminary study of the scroll expander with heating structure and proposals of their systems for power generation and refrigeration.

• Journal of the Korean Society of Safety
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• v.28 no.5
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• pp.5-9
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• 2013

Recently, eco-friendly sources of energy by fuel cells that use hydrogen as an energy source has emerged as the next generation of energy to solve the problem of environmental issues and exhaustion of energy. A solid oxide fuel cell(SOFC) classified based on the type of ion transfer mediator electrolyte has actively being researched. However, the reliability according to the thermal cycle is low during the operation of the fuel cell, and deformation problem comes from the difference in thermal expansion coefficient between the electrode material, the components made of ceramic material is also brittle, which means disadvantages in terms of the strength. Therefore, in this study, considering the states of the manufacturing and operating of SOFC single cells, the stress analyses in the each of the interfacial layer between the anode, electrolyte and the cathode were performed to get the basic data for reliability assessment of SOFC. The obtained results show that von Mises stress according to the thickness direction on operating state occurred maximum stress value in the electrolyte layer. And also the stresses inside the active area on a distance of 1 ${\mu}m$ from the electrode interface were estimated. Futhermore the evaluation was done for the variation of the stress according to the stage of the operation divided into three stages of manufacturing, stack, and operating.

• Journal of Welding and Joining
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• v.17 no.1
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Journal of Applied Reliability
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• v.17 no.1
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• pp.78-82
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• 2017

Purpose: The purpose of this study is to evaluate failure characteristic and mechanism of four commercial water-repellent coatings for elevated temperature machinery applications. Method: Thermal degradation was performed for up to 64 thermal cycles. 1 cycle consists of 15 minute holding at 523K under 300rpm revolution and 15 minute-natural cooling. Contact angle was measured and microstructure of the coating layer was observed by using a scanning electron microscope. Results: Four kinds of commercial repellent coating showed hydrophobic or super-hydrophobic property implying that all coatings are suitable for room temperature application. Contact angle of three kinds of commercial coatings decreased rapidly after thermal exposure, while only one specimen having hydrophobic surface showed extremely slow degradation. Conclusion: Observed decrease in contact angle of the coatings were attributed to formation of macro-sized pores and disappearance of micro-protrusion during thermal exposure. Optimum water-repellent coating needs to be selected under the consideration of initial contact angle as sell as service temperature.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.21-30
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• 2018

Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.12
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• pp.776-781
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• 2011

The rapid increases in global energy demand and global warming need renewable energy sources such as solar thermal energy, biomass energy and waste heat. A ORC-based micro-CHP system(< 10 kWe) is one of the effective means to use renewable energy and solve energy problems because of its compactness, flexibilities and lower cost compared to other systems. The most important core components of the ORC is the expander which has a strong effect on the cycle efficiency. In the range of power output from 1 to 10 kW, the scroll expander is a good choice due to its performance and reliability. In this study, we have carried out an experimental study on an ORC equipped with oil-free scroll expander working with refrigerant R134a. We have measured power output and thermal efficiencies of the ORC and analyzed correlation between volumetric efficiencies of the expander and thermal efficiencies of the ORC.

• Journal of the Korean Society of Safety
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• v.35 no.1
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• pp.18-24
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• 2020

This research conducted an the failure analysis was performed based on the failure and operation data for Seven years using the Reliability, Availability, Maintainability, and Safety(RAMS) constructed at the operation stage after the opening of the D urban railway. therefore, the risk priority was selected for failure frequency component within the door system that showed high failure. Finally, the goal was to suggest ways to improve the door system. For this purpose, the analysis of thermal characteristics of failed components such as Door Control Unit(DCU) in the door system based on the Seven-year failure analysis data of RAMS was performed. These results were applied to the main component exchange cycle of the door unit, the mean time between failure(MTBF) and mean kilometer between failure(MKBF) values of RAMS increased by 26% in 2017-2018 when the improvement measures were taken, and the MTBF value of DCU was 300,000 hours, which was a 57% improvement in reliability. The results of this thesis identify potential enhancements in reliability and improvements in maintenance of the door system that, if implemented, would contribute to train safety and reduce instances of failure in the future.

• Journal of Welding and Joining
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• v.26 no.2
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• pp.43-49
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• 2008

Fatigue cracks due to thermal stratification or corrosion in pipelines of nuclear power plants can cause serious problems on reactor cooling system. Therefore, the development of an integrated technology including fabrication of standard specimens and their practical usage is needed to enhance the reliability of nondestructive testing. The test material was austenitic STS 304, which is used as pipelines in the Reactor Coolant System of a nuclear power plants. The best condition for fabrication of thermal fatigue cracks at the notch plate was selected using the thermal stress analysis of ANSYS. The specimen was installed from the tensile tester and underwent continuos tension loads of 51,000N. Then, after the specimen was heated to $450^{\circ}C$ for 1 minute using HF induction heater, it was cooled to $20^{\circ}C$ in 1 minute using a mixture of dry ice and water. The initial crack was generated at 17,000 cycles, 560 hours later (1cycle/2min.) and the depth of the thermal fatigue crack reached about 40% of the thickness of the specimen at 22,000 cycles. As a results of optical microscope and SEM analysis, it is confirmed that fabricated thermal fatigue cracks have the same characteristics as real fatigue cracks in nuclear power plants. The crack shape and size were identified.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2011.04a
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• pp.415-418
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• 2011

Thermal fatigue is one of the life-limiting damage mechanisms in the nuclear power plant conditions. The turbulent mixing of fluids of different temperatures induces rapid temperature changes to the pipe wall. The successive thermal transients cause varying cyclic thermal stresses. These cyclic thermal stresses cause fatigue crack nucleation and growth similar to the cyclic mechanical stresses. The aim of this study was to fulfil the need by developing an real crack manufacturing method, which would produce realistic cracks. The test material was austenitic STS 304, which is used as pipelines in the reactor coolant system of a nuclear power plants. In order to fabricate thermal fatigue crack similar to realistic crack, successive thermal transients were applied to the specimen. Thermal transient cycles were combined with heating (60sec) and cooling cycle (30sec). And, In order to identify ultrasonic characteristic, it was performed the ultrasonic reflection measuring method for the fabricated specimen. From the results of ultrasonic reflection measuring testing, it was conformed that A-scan results(average 83% of real crack depth) for the TFC reference specimen was more enhanced NDT reliability than results(average 38% of real crack depth) for the EDM notch reference specimen.