• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.206-208
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• 2006

The reliability of BGA (ball grid array) package with OSP (organic surface preservative) surface finish under thermal cycle was investigated by using SEM (scanning electron microscopy), EDS(energy dispersive spectroscopy), image tool and ball shear test. The IMCs (intermetallic compounds) were increased with increasing number of thermal cycles. However, the shear strengths of solder ball were decreased with increasing number of thermal cycles. The order of solders which had the highest shear strength as follow: Sn-3.5wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, Sn-37wt%Pb.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Journal of Welding and Joining
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• 제21권4호
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Advances in Energy Research
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• 제4권1호
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• pp.29-45
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• 2016

There has been a growing interest in the recent time for the development of solar power tower plants, which are mainly used for utility scale power generation. Combined heat and power (CHP) is an efficient and clean approach to generate electric power and useful thermal energy from a single heat source. The waste heat from the topping Brayton cycle is utilized in the bottoming HRSG cycle for driving steam turbine and also to produce process steam so that efficiency of the cycle is increased. A thermal storage system is likely to add greater reliability to such plants, providing power even during non-peak sunshine hours. This paper presents a conceptual configuration of a solar power tower combined heat and power plant with a topping air Brayton cycle. A simple downstream Rankine cycle with a heat recovery steam generator (HRSG) and a process heater have been considered for integration with the solar Brayton cycle. The conventional GT combustion chamber is replaced with a solar receiver. The combined cycle has been analyzed using energy as well as exergy methods for a range of pressure ratio across the GT block. From the thermodynamic analysis, it is found that such an integrated system would give a maximum total power (2.37 MW) at a much lower pressure ratio (5) with an overall efficiency exceeding 27%. The solar receiver and heliostats are the main components responsible for exergy destruction. However, exergetic performance of the components is found to improve at higher pressure ratio of the GT block.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.117-120
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• 2002

In this paper, several methods to predict the solder joint shape are studied. Although there are various methods to predict the solder joint shape, such as truncated sphere method, force-bal tranced analytical solution, and energy-based methods like surface evolver developed by Ken Brakke, we calculate solder joint shape of $\mu$BGA by two solder joint shape prediction methods(truncated sphere method and surface evolver) and then compare results of each method. The results in dicate that two methods can accurately predict the solder joint shape in an accurate range. After that, we calculate reliability solder joint shape under thermal cycle test by FEA program ANSYS. As a result, it could be found that optimal solder joint shape calculated by solder joint prediction method has best reliability in thermal cycle test.

• 한국산학기술학회논문지
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• 제19권9호
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• pp.261-268
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• 2018

전력수요와 부하용량이 증가 되어감에 따라 부하에 전력공급을 위한 간선으로서의 케이블은 설치 시간의 과다와 공간의 제약으로 사용이 제한적이다. 이런 문제를 해결하기 위한 간선 시스템으로 대전류를 효율적으로 공급해 줄 수 있는 버스웨이 시스템의 사용이 증가되고 있으나, 신뢰성의 검증을 위한 시험평가 방법과 그에 대한 결과 제시가 부족한 실정이다. 본 논문에서는 에폭시를 주절연으로 하는 버스웨이 시스템의 신뢰성 검증을 위해서 IEC 61439-6에서 제시된 시험항목이외에 장기 사용성과 신뢰성을 평가할 수 있는 시험항목을 선정하였다. 열 및 전기적 스트레스를 동시에 인가하여 최대한 실사용 상태를 반영한 복합가속열화시험을 실시하였으며, 50년 수명 조건을 충족하도록 열화 조건을 선정하여 버스웨이 시스템의 절연성능 확인시험을 통해 수명을 만족함을 확인하였다. 또한, 버스웨이가 설치되는 온도, 습도 및 부하전류 사용 환경에 대한 적합성 확인에 대한 신뢰성 평가 시험항목으로서 열적 과전류 시험, 침수시험, 냉충격시험, 온도 사이클 시험을 선정하여 실시하였으며, 확인 시험을 통해 시험 전후의 특성 변화와 이상 유무를 검토하였다. 이 결과들로부터 에폭시 절연형 버스웨이 시스템의 평가항목으로서 본 논문에서 제시한 시험항목이 적절하고, 그에 대한 제품의 성능도 우수함을 확인하였다.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.35-40
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• 2010

본 연구에서는 상용 고온 솔더 중 많이 쓰이고 있는 Sn-3.5Ag, Sn-0.7Cu, Sn-5.0Sb 솔더에 대한 열충격 시험, 열싸이클 시험, 고온 진동 복합 시험 신뢰성 평가를 하였다. 테스트 샘플을 제작하기 위해 Sn-3.5Ag, Sn-0.7Cu, Sn-5.0Sb 솔더볼을 ENIG 표면 처리된 BGA에 접합하였으며, 그 후 BGA샘플을 OSP 표면 처리된 PCB에 실장 하였다. 신뢰성평가 동안 저항변화를 측정하였으며 신뢰성 평가 전후 전단강도 시험을 통하여 접합강도의 변화를 평가하였다. Sn-3.5Ag의 솔더인 경우 전기저항과 접합강도의 저하가 비교 평가한 3가지 솔더 중 가장 높은 저하율을 보였으며 Sn-0.7Cu의 솔더가 신뢰성 평가 후에 비교적 높은 안정성을 나타내었다.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2003년도 추계학술대회 논문집(III)
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• pp.606-610
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• 2003

The 200 class insulation system which adopted to traction motor have excellent dielectric strength but weaken to thermal stress therefore deterioration phenomena analysis according to thermal stress is necessary. Accelerated thermal aging tests have been used to determine thermal reliability of stator coils used as traction motor in electric multiple unit. The conventional aging test is carried on according to IEC 60034-18-31 and IEEE Std. 275-1992. Variation in insulation resistance, P.I, capacitance, dielectric loss($tan{\delta}$) and partial discharge are measured during the aging cycle. Sample coils for traction motor were tested by accelerated aging test which composed of heat, vibration and moisture. Reliability and expected life were evaluated on the insulation system for traction motor.

• 마이크로전자및패키징학회지
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• 제10권2호
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• pp.19-26
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• 2003

광통신용 광학부품의 신뢰성 특성은 솔더 조인트의 열 사이클에 따른 소성(Plastic)과 크립(Creep) 변형에 가장 큰 영향을 받는다. 열 사이클에 따른 소성과 크립 변형 증가로 인해 정렬 틀어짐이 발생하며 이는 광손실 변화의 주요인이 된다. 또한, 소성과 크립 변형량이 증가 또는 계속 누적이 될 경우 솔더의 피로수명 한계로 인해 제품 불량 발생의 원인이 된다. 이러한 열적 사이클에 따른 광부품의 신뢰성을 확보하기 위해 본 논문에서는 유한요소해석법(FEM)을 적용하였다. 소성과 크립 변형의 변화량을 유한요소해석으로 계산하고 이를 크립 피로 파괴(Creep-Fatigue) 수명 예측 모델에 적용하여 그 수명을 예측하였다. 솔더와 모재와의 계면 또는 솔더 내부에서 생성되는 온도에 따른 소성과 크립 변형을 파악하기 위해 텔코디아(Telcordia)의 광부품 신뢰성 온도 사이클(-40 to 75)을 적용하였다. 승온과 냉각 속도의 변화에 따른 영향을 검토하기 위해 1/min, 10/min 및 50/min으로 변화를 주고 유지 시간을 1시간으로 고정할 경우의 결과를 비교 분석하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.79-84
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• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.