• Proceedings of the KWS Conference
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• 2006.05a
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• pp.206-208
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• 2006

The reliability of BGA (ball grid array) package with OSP (organic surface preservative) surface finish under thermal cycle was investigated by using SEM (scanning electron microscopy), EDS(energy dispersive spectroscopy), image tool and ball shear test. The IMCs (intermetallic compounds) were increased with increasing number of thermal cycles. However, the shear strengths of solder ball were decreased with increasing number of thermal cycles. The order of solders which had the highest shear strength as follow: Sn-3.5wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, Sn-37wt%Pb.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• Journal of Welding and Joining
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• v.21 no.4
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Advances in Energy Research
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• v.4 no.1
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• pp.29-45
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• 2016

There has been a growing interest in the recent time for the development of solar power tower plants, which are mainly used for utility scale power generation. Combined heat and power (CHP) is an efficient and clean approach to generate electric power and useful thermal energy from a single heat source. The waste heat from the topping Brayton cycle is utilized in the bottoming HRSG cycle for driving steam turbine and also to produce process steam so that efficiency of the cycle is increased. A thermal storage system is likely to add greater reliability to such plants, providing power even during non-peak sunshine hours. This paper presents a conceptual configuration of a solar power tower combined heat and power plant with a topping air Brayton cycle. A simple downstream Rankine cycle with a heat recovery steam generator (HRSG) and a process heater have been considered for integration with the solar Brayton cycle. The conventional GT combustion chamber is replaced with a solar receiver. The combined cycle has been analyzed using energy as well as exergy methods for a range of pressure ratio across the GT block. From the thermodynamic analysis, it is found that such an integrated system would give a maximum total power (2.37 MW) at a much lower pressure ratio (5) with an overall efficiency exceeding 27%. The solar receiver and heliostats are the main components responsible for exergy destruction. However, exergetic performance of the components is found to improve at higher pressure ratio of the GT block.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.117-120
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• 2002

In this paper, several methods to predict the solder joint shape are studied. Although there are various methods to predict the solder joint shape, such as truncated sphere method, force-bal tranced analytical solution, and energy-based methods like surface evolver developed by Ken Brakke, we calculate solder joint shape of $\mu$BGA by two solder joint shape prediction methods(truncated sphere method and surface evolver) and then compare results of each method. The results in dicate that two methods can accurately predict the solder joint shape in an accurate range. After that, we calculate reliability solder joint shape under thermal cycle test by FEA program ANSYS. As a result, it could be found that optimal solder joint shape calculated by solder joint prediction method has best reliability in thermal cycle test.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.9
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• pp.261-268
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• 2018

The use of electric cable was limited due to the installation time and large space as the increase of power demand and load quantity in side line. In order to solve these problems, the application of busway system which can supply the large current was increasing. But it was lack of methods of performance tests to evaluate the reliability and results of test for busway system. In this paper, we presented items to evaluate the reliability test for epoxy coated busway system with reference to IEC 61349-6. In addition, we proposed items to evaluate the reliability and long term life cycle test for the epoxy coated busway system. The combined acceleration deterioration test that reflects actual conditions of the survey as much as possible was conducted considering both thermal and electrical stresses. The deterioration condition was selected to satisfy fifty years life expectation and the insulation performance verification test of the busway system confirmed the long term life prediction. Furthermore, as test items for reliability assessment of compliance with the environment for the use of temperature, humidity and load current where busway system was installed, thermal overload test, water immersion test, cold shock temperature test and thermal cycle test were performed. And we examined changes in characteristics and abnormality after tests. From results, the test items presented to evaluate performance and reliability of the epoxy insulated busway system were confirmed to be appropriate in this paper, and the performance of the product was also confirmed to be excellent for reliability tests.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.35-40
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• 2010

In this study, the reliability of thermal shock, thermal cycle, and complex vibration test at high temperature were examined for 3 types of lead-free solder alloys, Sn-3.5Ag, Sn-0.7Cu and Sn-5.0Sb. For the reliability test, daisychained BGA chips with ENIG-finished Cu pad was assembled with the three lead-free solders on OSP-finished PCBs. Among the 3 types solder alloys, Sn-3.5Ag solder alloy showed the highest degradation rate of electrical resistance and joint strength. On the other hand, Sn-0.7Cu solder alloy had high stability after the reliability tests.

• Proceedings of the KSR Conference
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• 2003.10c
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• pp.606-610
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• 2003

The 200 class insulation system which adopted to traction motor have excellent dielectric strength but weaken to thermal stress therefore deterioration phenomena analysis according to thermal stress is necessary. Accelerated thermal aging tests have been used to determine thermal reliability of stator coils used as traction motor in electric multiple unit. The conventional aging test is carried on according to IEC 60034-18-31 and IEEE Std. 275-1992. Variation in insulation resistance, P.I, capacitance, dielectric loss($tan{\delta}$) and partial discharge are measured during the aging cycle. Sample coils for traction motor were tested by accelerated aging test which composed of heat, vibration and moisture. Reliability and expected life were evaluated on the insulation system for traction motor.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.19-26
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• 2003

Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.79-84
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• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.