• Computers and Concrete
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• v.7 no.1
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• pp.53-62
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• 2010

Dredged silt from reservoirs in southern Taiwan was sintered to make lightweight aggregates (LWA), which were then used to produce high-performance lightweight aggregate concrete (HPLWC). The HPLWC was manufactured using different amounts of mixing water (140, 150, and 160 $kg/m^3$) and LWA of different particle densities (700, 1100, and 1500 $kg/m^3$) at different W/b ratios (0.28, 0.32, and 0.4). Results show that the lightweight aggregates of dredged silt taken in southern Taiwan perform better than the general lightweight aggregates. In addition, the HPLWC possessed high workability with a slump of 230-270 mm, and a slump flow of 450-610 mm, high compressive strength of over 40 MPa after 28 days of curing, good strength efficiency of cement exceeding $0.1MPa/kg/m^3$, low thermal conductivity of 0.4-0.8 $kcal/mh^{\circ}C$, shrinkage of less than $4.8{\times}10^{-4}$, and high electrical resistivity of above 40 $k{\Omega}-cm$. The above findings prove that HPLWC made from dredged silt can help enhance durability of concrete and provide and an ecological alternative use of dredged silt.

• Elastomers and Composites
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• v.55 no.3
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• pp.167-175
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• 2020

Various studies have been conducted to improve silica dispersion of silica filled tire tread compounds; among them, silica wet masterbatch (WMB) technology is known to be suitable for manufacturing silica filled compounds that have high silica content and high dispersibility. Till now, the WMB study is focused on the natural rubber (NR) or emulsion styrene-butadiene rubber (ESBR) that does not have a silica-affinity functional group, and a study of NR or ESBR having a silica-affinity functional group is still not well known. Unlike the dry masterbatch technology, the WMB technology can solve the problems associated with the high Mooney viscosity when applied to silica-friendly rubber. However, a coagulant suitable for each functional group has not yet been determined. Therefore, in this study, different coagulant applied silica WMB was prepared by applying calcium chloride, sulfuric acid, acetic acid, and propionic acid by using a carboxyl group functionalized reversible addition fragmentation chain transfer ESBR. The evaluation of the WMB compounds revealed that the calcium chloride added WMB compound showed excellent silica dispersion, abrasion resistance, and rolling resistance.

• Electrical & Electronic Materials
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• v.7 no.3
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• pp.187-199
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• 1994

In order to find an effect of structural changes due to variation of addition ratio of anhydride hardener and postcuring herat-treatments upon electrical properties of epoxy composites, the dielectric properties over a frequency range from 30[Hz] to l[MHz] were investigated in the temperature range of 20-180[.deg. C]. From the dielectric properties, the a peaks related with glass-transition phenomena of epoxy network appeared near 130[.deg. C], the conduction loss in high temperature region above 150[.deg. C] due to thermal dissociation of hardener started off with the low frequency side and the .betha. peak concerned with contribution of movable unreacted terminal epoxy groups and curing agents in the glass states concurred with the high-frequency side below 20[.deg. C]. And an effect of an hydride hardener upon structural changes and of postcuring heat treatments upon structural stability in epoxy composites would be explained through the estimation of the distribution of relaxation times and the activation energy for a .alpha. peak according to the WLF equations.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.61-62
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• 2006

In this paper, it was demonstrated that organic thin- film transistors (OTFTs) were fabricated with the organic adhesion layer between an organic semiconductor and a gate insulator by vapor deposition polymerization (VDP) processing. In order to form polymeric film as an adhesion layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing. The saturated slop in the saturation region and the subthreshold nonlinearity in the triode region were c1early observed in the electrical output characteristics in our organic thin film transistors using the staggered-inverted top-contact structure. Field effect mobility, threshold voltage, and on-off current ratio in 15-nm-thick organic adhesion layer were about $0.5\;cm^2/Vs$, -1 V, and $10^6$, respectively. We also demonstrated that threshold voltage depends strongly on the delay time when a gate voltage has been applied to bias stress.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.232-233
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• 2006

In recent years the interest in organic/inorganic hybrid materials has increased at a fast rate. Nano organic-inorganic hybrid composites have shown advantages for preparing hard coating layers. Especially, nano hybrid composite has low environmental pollution. It has high transparency, hardness, toughness, thermal dissociation temperature, hydrophobicity by using nano sized inorganic material. There are many ways in which these materials may be synthesized, a typical one being the use of silica and silanes using the sol-gel process. The structure of sol-gel silica evolves as a result of these successive hydrolysis and condensation reactions and the subsequent drying and curing. The sol-gel reactions are catalyzed by acids and produce silica sol solutions. The silica sol grows until they reach a size where a gel transition occurs and a solid-like gel is formed. Colloidal silica(CS)/silane sol solutions were synthesized in variation with parameters such as different acidity and reaction time. In order to understand their physical and chemical properties, sol-gel coating films were fabricated on glass. From all sol-gel solutions, seasoning effect of sol-gel coating layer on glass was observed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.20-21
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• 2006

In this paper, we studied the influence of EVA sheet gel content on photovoltaic module durability. Depending on thermal curing temperature and time during lamination, there are dramatic changes on chemical and physical characteristics. To find the optimum PV module process condition, Glass/EVA/Back Sheet scheme was made. Gel Content, FT-IR spectrum and SEM were used for the detail analysis. From these results, $110^{\circ}C/6min$ and $130^{\circ}C/4min$ lamination condition could be suggested for the best one for durable PV module processing. The further analysis is described in the following paper.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.114-115
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• 2007

In this paper, it was demonstrated that organic thin-film transistors (OTFTs) were fabricated with the organic passivation layer by vapor deposition polymerization (VDP) processing, In order to form polymeric film as an passivation layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing, Field effect mobility, threshold voltage, and on-off current ratio with 450-nm-thick organic passivation layer were about $0.21\;cm^2/Vs$, IV, and $1\;{\times}\;10^5$, respectively.

• Advances in concrete construction
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• v.3 no.1
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• pp.55-69
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• 2015

Tailing Material (TM) and Fly Ash (FA) are obtained as waste products from the mining and thermal industries. Studies were carried out to explore the possibility of utilizing TM as a part replacement to fine aggregate and FA as a part replacement to cement, in concrete mixes. The effect of replacing fine aggregate by TM and cement by FA on the standard sized specimen for compressive strength, split tensile strength, and flexural strengths are evaluated in this study. The concrete mix of M40 grade was adopted with water cement ratio equal to 0.40. Concrete mix with 35% TM and 65% natural sand (TM35/S65) has shown superior performance in strength as against (TM0/S100, TM30/S70, TM40/S60, TM50/S50, and TM60/S40). For this composition, studies were performed to propose the optimal replacement of Ordinary Portland Cement (OPC) by FA (Replacement levels studied were 20%, 30%, 40% and 50%). Replacement level of 20% OPC by FA, has shown about 0-5% more compressive strength as against the control mix, for both 28 day and 56 days of water curing. Interestingly results of split tensile and flexural strengths for 20% OPC replaced by FA, have shown strengths equal to that of no replacement (control mix).

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.35 no.5
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• pp.153-160
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• 2019

The purpose of this study was to investigate the mechanical and durability characteristics of latex-modified concrete using ultra rapid hardening cement : four types of mechanical tests including compressive strength, modulus of elasticity, flexural strength and bond strength were performed; and seven types of durability tests including resistance of concrete to chloride ion penetration, freeze-thaw resistance, scaling resistance, coefficient of thermal expansion, cracking tendency, abrasion resistance and drying shrinkage were performed. Required material performance of each test was determined in accordance with the Korea specification for repair of concrete and pavement repairing materials. The test results satisfied the required material performances, and presented a good mechanical and durability characteristics. In particularly, the materials showed early development of compressive strength, flexural strength and bond strength at 3 and 4 hours after curing. SEM photos were also taken to investigate the micro structures of the materials after chloride ion penetration test.

• Journal of Sensor Science and Technology
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• v.31 no.6
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• pp.361-365
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• 2022

Advanced packaging demands are driven by the need for dense integration systems. Consequently, stacked packaging technology has been proposed instead of reducing the ultra-fine patterns to secure economic feasibility. This study proposed an effective packaging process technology for semiconductor devices using a 9-inch dicing die attach film (DDAF), wherein the die attach and dicing films were combined. The process involved three steps: tape lamination, dicing, and bonding. Following the grinding of a silicon wafer, the tape lamination process was conducted, and the DDAF was arranged. Subsequently, a silicon wafer attached to the DDAF was separated into dies employing a blade dicing process with a two-step cut. Thereafter, one separated die was bonded with the other die as a substrate at 130 ℃ for 2 s under a pressure of 2 kgf and the chip was hardened at 120 ℃ for 30 min under a pressure of 10 kPa to remove air bubbles within the DAF. Finally, a curing process was conducted at 175 ℃ for 2 h at atmospheric pressure. Upon completing the manufacturing processes, external inspections, cross-sectional analyses, and thermal stability evaluations were conducted to confirm the optimality of the proposed technology for application of the DDAF. In particular, the shear strength test was evaluated to obtain an average of 9,905 Pa from 17 samples. Consequently, a 3D integration packaging process using DDAF is expected to be utilized as an advanced packaging technology with high reliability.