• 제목/요약/키워드: Thermal Contact

검색결과 1,208건 처리시간 0.026초

위성 열해석을 위한 접촉열저항의 민감도 해석 (Sensitivity Analysis of Contact Resistance for Thermal Analysis of Spacecraft)

  • 한조영
    • 한국항공우주학회지
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    • 제32권7호
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    • pp.117-125
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    • 2004
  • 기 수립한 열해석 모델을 바탕으로 접촉열전도가 있는 부위의 민감도 해석을 수행함으로서 향후 기계적 접속 부위 설계 변경시의 열설계에 대한 연구를 수행했다. 해석의 편의를 위해 비교적 간단한 열해석 모텔을 선택했다. 위성 버스 전압과 접촉열저항의 크기를 다양하게 변화시켜 해석을 수행했으며, 그 결과 향후 통일한 모듈에서 기계적 접속 조건 변경시 접촉열저항을 원래의 설계원용치를 기준 값으로 해 히터의 용량을 충분히 크게 설계할 경우 성공적인 열설계가 가능하리라 여겨진다.

Effects of Thermal Contact Resistance on Film Growth Rate in a Horizontal MOCVD Reactor

  • Im Ik-Tae;Choi Nag Jung;Sugiyama Masakazu;Nakano Yoshiyaki;Shimogaki Yukihiro;Kim Byoung Ho;Kim Kwang-Sun
    • Journal of Mechanical Science and Technology
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    • 제19권6호
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    • pp.1338-1346
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    • 2005
  • Effects of thermal contact resistance between heater and susceptor, susceptor and graphite board in a MOCVD reactor on temperature distribution and film growth rate were analyzed. One-dimensional thermal resistance model considering thermal contact resistance and heat transfer area was made up at first to find the temperature drop at the surface of graphite board. This one-dimensional model predicted the temperature drop of 18K at the board surface. Temperature distribution of a reactor wall from the three-dimensional computational fluid dynamics analysis including the gap at the wafer position showed the temperature drop of 20K. Film growth rates of InP and GaAs were predicted using computational fluid dynamics technique with chemical reaction model. Temperature distribution from the three-dimensional heat transfer calculation was used as a thermal boundary condition to the film growth rate simulations. Temperature drop due to the thermal contact resistance affected to the GaAs film growth a little but not to the InP film growth.

Measurement of thermal contact resistance at Cu-Cu interface

  • Kim, Myung Su;Choi, Yeon Suk
    • 한국초전도ㆍ저온공학회논문지
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    • 제15권2호
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    • pp.48-51
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    • 2013
  • The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.

Temperature Dependent Behavior of Thermal and Electrical Contacts during Resistance Spot Welding

  • Kim, E.
    • International Journal of Korean Welding Society
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    • 제2권1호
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    • pp.1-10
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    • 2002
  • The thermal contact conductance at different temperatures and with different electrode forces and zinc coating morphology was measured by monitoring the infrared emissions from the one dimensionally simulated contact heat transfer experiments. The contact heat transfer coefficients were presented as a function of the harmonic mean temperature of the two contacting surfaces. Using these contact heat transfer coefficients and experimentally measured temperature profiles, the electrical contact resistivities both for the faying interface and electrode-workpiece interface were deduced from the numerical analyses of the one dimension simulation welding. It was found that the average value of the contact heat transfer coefficients for the material with zinc coating (coating weight from 0 g/$mm^2$to 100 g/$mm^2$) ranges from 0.05 W/$mm^2$$^{\circ}C$ to 2.0 W/$mm^2$$^{\circ}C$ in the temperature range above 5$0^{\circ}C$ harmonic mean temperature of the two contacting surfaces. The electrical contact resistivity deduced from the one dimension simulation welding and numerical analyses showed that the ratio of electrical contact resistivity at the laying interface to the electrical contact resistivity at the electrode interface is smaller than one far both bare steel and zinc coated steel.

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용량성 결합 능동 전극의 내부 잡음 분석 (A Study on Intrinsic Noise of Capacitively Coupled Active Electrode)

  • 임용규
    • 융합신호처리학회논문지
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    • 제13권1호
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    • pp.44-49
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    • 2012
  • 간접접촉 심전도 측정(Indirect-Contact ECG)은 일상생활에서의 무구속 무자각 측정에 적합한 새로운 심전도 측정 방법이다. 간접접촉 심전도 측정 에 서 관측되는 큰 배경 잡음을 줄이기 위한 기초 연구로서, 본 연구에서는 간접 접촉 심전도에서 사용되는 용량성 결합 능동 전극(Capacitively coupled active electrode)의 열잡음(Thermal Noise) 모델을 구성하였다. 실험을 통해, 용량성 결합 능동 전극만의 배경 잡음의 크기가 열잡음 모델에서 예상한 수준과 거의 일치함을 확인하였다. 면으로 된 직물의 실제의 전기적 특성을 열잡음 모델에 적용하여, 면 위에서 측정된 간접접촉 심전도의 이론적 열잡음을 계산하였다. 이 연구를 통해, op-amp의 내부 잡음(intrinsic noise)은 저항에 의한 열잡음에 비해 무시할 수 있을 정도로 작음을 알 수 있었다. 그리고 열잡음의 크기와 능동 전극의 입력 저항간의 관계를 도출할 수 있게 되어, 능동 전극의 입력 저항의 최적 값 선정을 위한 향후 연구의 기반이 되었다.

디스크 브레이크와 패드의 접촉을 고려한 벤틸레이티드 디스크 브레이크의 열적거동에 관한 연구 (Thermal Behavior of Ventilated Disc Brakes Considering Contact Between Disc and Pad)

  • 마정범;이봉구
    • 한국생산제조학회지
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    • 제23권3호
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    • pp.259-265
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    • 2014
  • When the brakes of a vehicle are applied, large amounts of heat are generated on the surfaces of the brake discs owing to friction between the discs and the brake pads. A high temperature gradient on the disc surfaces leads to thermal deformation and severe disc abrasion. Ultimately, the thermal deformation and disc wear give rise to a thermal judder phenomenon, which has a major effect on the stability of the vehicle. To investigate and propose a solution to these problems, thermoelastic instabilities under applied thermal and mechanical loads were analyzed using the commercial finite element package ANSYS by considering the contact surfaces between the discs and pads. Direct-contact three-dimensional finite elements between the discs and pads were applied to investigate the disc friction temperature, thermal deformation, and contact stress so that the thermal judder phenomenon on the surface of the disc could be predicted.

Thermal Dissociation and Conformational Lock of Superoxide Dismutase

  • Hong, J.;Moosavi-Movahedi, A.A.;Ghourchian, H.;Amani, M.;Amanlou, M.;Chilaka, F.C.
    • BMB Reports
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    • 제38권5호
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    • pp.533-538
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    • 2005
  • The kinetics of thermal dissociation of superoxide dismutase (SOD) was studied in 0.05 M Tris-HCl buffer at pH 7.4 containing $10^{-4}\;M$ EDTA. The number of conformational locks and contact areas and amino acid residues of dimers of SOD were obtained by kinetic analysis and biochemical calculation. The cleavage bonds between dimers of SOD during thermal dissociation and type of interactions between specific amino acid residues were also simulated. Two identical contact areas between two subunits were identified. Cleavage of these contact areas resulted in dissociation of the subunits, with destruction of the active centers, and thus, lost of activity. It is suggested that the contact areas interact with active centers by conformational changes involving secondary structural elements.

원통결합부의 열특성 최적설계를 위한 예측 시뮬레이션 방법 (Simulation Method for Thermal appropriate Desing of Compound Cylinder using Bondgraph Modeling)

  • 민승환;박기환;이선규
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 춘계학술대회 논문집
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    • pp.635-640
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    • 1996
  • A thermo-elastic system in the production machine has highly nonlinear dynamic characteristics. In general, the finite element method is utilized for accurate analysis. However, it requires large computing time. Thus, thermo-elastic systems are usuallymodeled as electric and fluid system using lumped para,eter. In this paper. we propose the bondgraph model and transient simulation methodology of thermo-elastic system in consideration of various boundary and joint contact conditions. Consequently, the proposed method ensures a possibility of its on-line compensation about undesirable phenomena by using real time estimate process and electronic cooling device for thermal appropriate behavior. Thermo-elastic model consisting of bush and shaft including contact condition is presented.

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원판형 LHP 증발부의 소결 금속 윅에서의 접촉 저항에 관한 연구 (A Study on the Reduction the Thermal Contact Resistances at the Interface Between a Porous Metal Wick and Solid Heating Plate for a Circular Plate LHP)

  • 조정래;최지훈;성병호;기재형;유성열;김철주
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2357-2362
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    • 2008
  • LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

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핵 연료 요소내의 접촉 열전도도 측정 (Measurement of The Thermal Contact Conductance in Nuclear Fuel Element)

  • ;윤병조
    • Nuclear Engineering and Technology
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    • 제22권1호
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    • pp.75-81
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    • 1990
  • 핵연료봉내의 온도 분포를 결정하는데 있어서 중요한 핵연료소자와 피복판 사이의 접촉 열전도도를 결정하기 위한 실험을 수행하였다. 이 실험에 사용된 측정장치는 접촉압력을 임의로 변화시켜 줄 수 있는 가압기와 열전대, 진공펌프, 핵연료소자, 봉형태의 피복관, 그리고 두 개의 히터 등으로 구성되어 있다. 접촉 열전도도는 $UO_2$ 소자와 Zircaloy-2 피복관 사이의 접촉 압력과 표면 조도를 변화시키면서 측정하였다. 그 결과 두 물체사이의 접촉압력이 증가함에 따라, 그리고 표면이 매끄러울수록 접촉 열전달계수는 증가하였다. 실험에서 얻은 값을 가지고 상관식을 만들었으며 일반적으로 사용되고 있는 상관식과 비교하였다.

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