• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.7
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• pp.117-125
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• 2004

Performing the sensitivity analysis of contact conduction on the basis of the thermal model already established, the study of thermal design is accomplished for the preparation of the future changes of mechanical interface design. A relatively simple thermal model is taken into consideration for the convenience of the analysis. A variety of the spacecraft bus voltages and the contact resistances are tried. As a consequence, when the mechanical interface condition is changed at the same module, the successful thermal design could be achieved if we design the heater to have sufficiently large power with reference to the heritage of contact resistance.

• Journal of Mechanical Science and Technology
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• v.19 no.6
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• pp.1338-1346
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• 2005

Effects of thermal contact resistance between heater and susceptor, susceptor and graphite board in a MOCVD reactor on temperature distribution and film growth rate were analyzed. One-dimensional thermal resistance model considering thermal contact resistance and heat transfer area was made up at first to find the temperature drop at the surface of graphite board. This one-dimensional model predicted the temperature drop of 18K at the board surface. Temperature distribution of a reactor wall from the three-dimensional computational fluid dynamics analysis including the gap at the wafer position showed the temperature drop of 20K. Film growth rates of InP and GaAs were predicted using computational fluid dynamics technique with chemical reaction model. Temperature distribution from the three-dimensional heat transfer calculation was used as a thermal boundary condition to the film growth rate simulations. Temperature drop due to the thermal contact resistance affected to the GaAs film growth a little but not to the InP film growth.

• Progress in Superconductivity and Cryogenics
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• v.15 no.2
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• pp.48-51
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• 2013

The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.

• International Journal of Korean Welding Society
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• v.2 no.1
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• pp.1-10
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• 2002

The thermal contact conductance at different temperatures and with different electrode forces and zinc coating morphology was measured by monitoring the infrared emissions from the one dimensionally simulated contact heat transfer experiments. The contact heat transfer coefficients were presented as a function of the harmonic mean temperature of the two contacting surfaces. Using these contact heat transfer coefficients and experimentally measured temperature profiles, the electrical contact resistivities both for the faying interface and electrode-workpiece interface were deduced from the numerical analyses of the one dimension simulation welding. It was found that the average value of the contact heat transfer coefficients for the material with zinc coating (coating weight from 0 g/$mm^2$to 100 g/$mm^2$) ranges from 0.05 W/$mm^2$$^{\circ}C$ to 2.0 W/$mm^2$$^{\circ}C$ in the temperature range above 5$0^{\circ}C$ harmonic mean temperature of the two contacting surfaces. The electrical contact resistivity deduced from the one dimension simulation welding and numerical analyses showed that the ratio of electrical contact resistivity at the laying interface to the electrical contact resistivity at the electrode interface is smaller than one far both bare steel and zinc coated steel.

• Journal of the Institute of Convergence Signal Processing
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• v.13 no.1
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• pp.44-49
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• 2012

The indirect-contact ECG measurement is a newly developed method for unconstrained and nonconscious measurement in daily Life. This study is the first step to reducing the large background noise appearing in indirect-contact ECG. This study built the thermal noise model of capacitively coupled active electrode which is used in indirect-contact ECG. The results show that the level of thermal noise estimated by the thermal noise model is much the same as that of actual background noise for the capacitively coupled active electrode alone. By applying the actual electrical properties of a sample cotton cloth to the thermal noise model, the theoretical level of thermal noise in the indirect-contact ECG was estimated. The results also show that the level of op-amp's intrinsic noise is so small that it can be negligible in comparison with thermal noise of resistors. The relationship between the level of thermal noise and the resistance of the bias resistor was derived, and it is the base for the further study how to choice the optimal resistance for the bias resistor.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.259-265
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• 2014

When the brakes of a vehicle are applied, large amounts of heat are generated on the surfaces of the brake discs owing to friction between the discs and the brake pads. A high temperature gradient on the disc surfaces leads to thermal deformation and severe disc abrasion. Ultimately, the thermal deformation and disc wear give rise to a thermal judder phenomenon, which has a major effect on the stability of the vehicle. To investigate and propose a solution to these problems, thermoelastic instabilities under applied thermal and mechanical loads were analyzed using the commercial finite element package ANSYS by considering the contact surfaces between the discs and pads. Direct-contact three-dimensional finite elements between the discs and pads were applied to investigate the disc friction temperature, thermal deformation, and contact stress so that the thermal judder phenomenon on the surface of the disc could be predicted.

• BMB Reports
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• v.38 no.5
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• pp.533-538
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• 2005

The kinetics of thermal dissociation of superoxide dismutase (SOD) was studied in 0.05 M Tris-HCl buffer at pH 7.4 containing $10^{-4}\;M$ EDTA. The number of conformational locks and contact areas and amino acid residues of dimers of SOD were obtained by kinetic analysis and biochemical calculation. The cleavage bonds between dimers of SOD during thermal dissociation and type of interactions between specific amino acid residues were also simulated. Two identical contact areas between two subunits were identified. Cleavage of these contact areas resulted in dissociation of the subunits, with destruction of the active centers, and thus, lost of activity. It is suggested that the contact areas interact with active centers by conformational changes involving secondary structural elements.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.635-640
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• 1996

A thermo-elastic system in the production machine has highly nonlinear dynamic characteristics. In general, the finite element method is utilized for accurate analysis. However, it requires large computing time. Thus, thermo-elastic systems are usuallymodeled as electric and fluid system using lumped para,eter. In this paper. we propose the bondgraph model and transient simulation methodology of thermo-elastic system in consideration of various boundary and joint contact conditions. Consequently, the proposed method ensures a possibility of its on-line compensation about undesirable phenomena by using real time estimate process and electronic cooling device for thermal appropriate behavior. Thermo-elastic model consisting of bush and shaft including contact condition is presented.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2357-2362
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• 2008

LHP is different from a conventional heat pipes in design and heat and fluid flow passages. The situations of the former is much complex than the latter. In LHPs, evaporation occurs at the contact interface between the heating plate and the porous wick, so some micro channels machined at the contact interface serve to let the vapor flow out of the evaporator. This complexity of contact geometry was known to cause a high resistance to heat flow. The present work was to study the problem of heat passage across the contact surface for LHPs and determine those values contact resistance. For two cases of contact structures, the thermal contact resistances were examined experimentally, one being obtained through mechanical contact under pressure and the other through sintered bonding. Nickel powder wick and copper plate were used for specimens. The result showed that a substantial reduction of contact resistance of an order of degree could be obtainable by sintered bonding.

• Nuclear Engineering and Technology
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• v.22 no.1
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• pp.75-81
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• 1990

Experiments to predict the thermal contact conductance between the fuel pellet and cladding have been performed, which is important to determine the temperature distibution within the fuel rod. UO$_2$and Zircaloy-2 are used in these experiments. The measuring apparatus is composed of a presser which controls the contact pressure, a thermometer with 5.5 sheathed thermocouples, a vacuum pump, pellet and cladding rods, and two heating devices, etc. The thermal contact conductances were measured with varying the contact pressure and surface roughnesses of UO$_2$and Zircaloy-2 bars. The results show that an increase in the contact pressure and a decrease of surface roughness resulted in increase of the thermal contact conductance. Finally, a fitting correlation has been established and compared with widely-used correlations.