• Title/Summary/Keyword: Thermal Conductivity at High Temperature

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Thermal transport in thorium dioxide

  • Park, Jungkyu;Farfan, Eduardo B.;Enriquez, Christian
    • Nuclear Engineering and Technology
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    • v.50 no.5
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    • pp.731-737
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    • 2018
  • In this research paper, the thermal transport in thorium dioxide is investigated by using nonequilibrium molecular dynamics. The thermal conductivity of bulk thorium dioxide was measured to be 20.8 W/m-K, confirming reported values, and the phonon mean free path was estimated to be between 7 and 8.5 nm at 300 K. It was observed that the thermal conductivity of thorium dioxide shows a strong dependency on temperature; the highest thermal conductivity was estimated to be 77.3 W/m-K at 100 K, and the lowest thermal conductivity was estimated to be 4.3 W/m-K at 1200 K. In addition, by simulating thorium dioxide structures with different lengths at different temperatures, it was identified that short wavelength phonons dominate thermal transport in thorium dioxide at high temperatures, resulting in decreased intrinsic phonon mean free paths and minimal effect of boundary scattering while long wavelength phonons dominate the thermal transport in thorium dioxide at low temperatures.

Measurement of the Shear Rate-Dependent Thermal Conductivity for Suspension with Microparticles (미립자를 포함한 현탁액의 전단율에 의존적인 열전도율 측정)

  • Lee, Sung-Hyuk;Shin, Sehyun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.8
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    • pp.1141-1151
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    • 1998
  • An effective thermal conductivity measurement for suspensions of microparticles in oil mixture is conducted in order to evaluate the shear rate-dependence of the thermal conductivity of suspensions. Measurements are made for rotating Couette flows between two concentric cylinders. The rotating outer cylinder is immersed into a constant temperature water bath while the stationary inner cylinder is subject to a uniform heat fluff. Test fluids are made to be homogeneous suspensions, in which neutrally buoyant microparticles ($d=25{\sim}300{\mu}m$) are uniformly dispersed. The present measurements show strong shear-rate dependent thermal conductivities for the suspensions, which are higher than those at zero shear rate. The shear rate dependent thermal conductivity increases with the particle size and volume concentration.4 new model for shear rate-dependent thermal conductivity of microparticle suspensions is proposed; the correlation covers from zero shear rate value to asymptotic plateau value at moderately high shear rates.

Thermo-electrical properties of randomly oriented carbon/carbon composite

  • Raunija, Thakur Sudesh Kumar;Supriya, N.
    • Carbon letters
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    • v.22
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    • pp.25-35
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    • 2017
  • The aim of the work was to investigate the thermo-electrical properties of low cost and rapidly produced randomly oriented carbon/carbon (C/C) composite. The composite body was fabricated by combining the high-pressure hot-pressing (HP) method with the low-pressure impregnation thermosetting carbonization (ITC) method. After the ITC method step selected samples were graphitized at $3000^{\circ}C$. Detailed characterization of the samples' physical properties and thermal properties, including thermal diffusivity, thermal conductivity, specific heat and coefficient of thermal expansion, was carried out. Additionally, direct current (DC) electrical conductivity in both the in-plane and through-plane directions was evaluated. The results indicated that after graphitization the specimens had excellent carbon purity (99.9 %) as compared to that after carbonization (98.1). The results further showed an increasing trend in thermal conductivity with temperature for the carbonized samples and a decreasing trend in thermal conductivity with temperature for graphitized samples. The influence of the thickness of the test specimen on the thermal conductivity was found to be negligible. Further, all of the specimens after graphitization displayed an enormous increase in electrical conductivity (from 190 to 565 and 595 to 1180 S/cm in the through-plane and in-plane directions, respectively).

Development of Thermal Performance Tester for Non-Homogeneous Insulation Pannels Installed Vertically (수직으로 설치된 비균질 평판 단열재용 성능시험장치 개발)

  • Oh, Hong Young;Song, Ki O;Jeon, Hyun Ik;Cho, Sun Young
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.28 no.4
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    • pp.153-157
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    • 2016
  • In case of metal insulation, which is produced by stacking stainless steel sheets and air layers in a multi-stack manner at a specific thickness, insulation performance will be evaluated based on thermal transmittance rather than the intrinsic physical properties of each material such as thermal conductivity. However, there is no standard for measuring thermal transmittance targeted for non-homogeneous insulation which is used in relatively high temperature conditions such as a power station. In this study, the thermal conductivity of homogeneous insulation acquired by the standardized guard hot plate method and the thermal conductivity of homogeneous insulation measured by the newly developed performance tester were compared to verify the confidence level of the tester. As a result, thermal conductivity acquired by the newly developed thermal transmittance tester was about 6% higher than the thermal conductivity measured by the existing guard hot plate method under the anticipated service temperature conditions.

Effect of Carbonization Temperature on the Thermal Conductivity and Electric Properties of Carbonized Boards (탄화온도가 탄화보드의 열전도율 및 전기적 성질에 미치는 영향)

  • Oh, Seung-Won;Park, Sang-Bum;Kim, Jong-In;Hwang, Jung-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.41 no.1
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    • pp.58-63
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    • 2013
  • This study is a basic research for practical applications of carbonized boards, which measured thermal conductivity and electrical properties of carbonized boards manufactured at different carbonization temperature ($400{\sim}1,100^{\circ}C$) using a medium density fiberboard, particleboard, plywood and wood (Fraxinus rhynchophylla). The highest value of thermal conductivity was 0.1326 m/k at carbonization temperature of $900^{\circ}C$ in the carbonized particleboard. Overall, the higher density of carbonized board, thermal conductivity was faster. As the electrical resistivity decreased with increased carbonization temperature, it was almost close to conductor after carbonization temperature of $1,000^{\circ}C$. When electricity has worked on the carbonized board by high voltage, the current and the electric power increased and surface temperature of carbonized board was high.

A Study on the High Temperature Thermal Conductivity Measurement of Nanofluid Using a Two-Phase Model (2상 모델을 이용한 나노유체의 고온 열전도도 측정 연구)

  • Park, Sang-Il;Lee, Wook-Hyun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.2
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    • pp.153-156
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    • 2010
  • The effective thermal conductivity of two-phase materials such as unbonded silica sands saturated with a nanofluid was measured at high temperature using the transient thermal probe method. The nanofluid used in this study was a water-based mixture of 0.1 vol% $Al_2O_3$ nanoparticles with a diameter of 45 nm. The convection problem for fluids was prevented with this measurement method because the fluid was confined to within very small pore spaces. Based on the prediction model for unbonded sands, the thermal conductivities of the saturating nanofluid at high temperatures could be determined with the measured effective thermal conductivities for the two-phase material. In the results, increases in the thermal conductivity ratios of the nanofluid to pure water when temperatures were varied from $30^{\circ}$ to $80^{\circ}C$ were within the range of 4.87%~5.48%.

Fabricability of Reaction-sintered SiC for Ceramic Heat Exchanger Operated in a Severe Environment (원자력 극한환경용 세라믹 열교환기 소재로서 반응소결 SiC 세라믹스 제작성)

  • Jung, Choong-Hwan;Park, Ji-Yeon
    • Journal of the Korean Ceramic Society
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    • v.48 no.1
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    • pp.52-56
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    • 2011
  • Silicon carbide (SiC) is a candidate material for heat exchangers for VHTR (Very High Temperature Gas Cooled Reactor) due to its refractory nature and high thermal conductivity. This research has focused on demonstration of physical properties and mock-up fabrication for the future heat exchange applications. It was found that the SiC-based components can be applied for process heat exchanger (PHE) and intermediate heat exchanger (IHX), which are operated at $400{\sim}1000^{\circ}C$, based on our examination for the following aspects: optimum fabrication technologies (design, machining and bonding) for compact design, thermal conductivity, corrosion resistance in sulfuric acid environment at high temperature, and simulation results on heat transferring and thermal stress distribution of heat exchanger mock-up.

The behavior of the early stage of the spark kernel growth at constant pressure surroundings (전기 점화 방식에 있어서 초기 점화핵(Spark kernel) 성장의 정압특성)

  • 김현우;정인석;조경국
    • Journal of the korean Society of Automotive Engineers
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    • v.12 no.4
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    • pp.75-82
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    • 1990
  • To study on the behavior of the early stage of the spark kernel at constant pressure condition, the expressions of the thermal properties such as compressibility factor, thermal conductivity, and electrical conductivity of the high temperature air were newly suggested. The newly suggested simple expressions of the thermal properties of the high temperature air showed good results. Under the assumption of constant pressure, one dimensional numerical analysis was executed by varying surrounding conditions and discharging current of electrical spark. Numerical results show tat high surrounding pressure suppresses the growth of the spark kernel but supplies much electrical energy into the air, on the other hand high surrounding temperature increases the growth of the spark kernel but supplies less electrical energy. Also the result shows that , in case of direct current discharge, deposited electrical energy is able to be expressed in linear function of time approximately.

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Analysis of the thermal management of a high power LED package with a heat pipe

  • Kim, Jong-Soo;Kim, Eun-Pil
    • Journal of Advanced Marine Engineering and Technology
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    • v.40 no.2
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    • pp.96-101
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    • 2016
  • The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

High functional surface treatments for rapid heating of plastic injection mold (급속가열용 플라스틱 사출금형을 위한 고기능성 표면처리)

  • Park, Hyun-Jun;Cho, Kyun-Taek;Moon, Kyoung-Il;Kim, Tae-Bum;Kim, Sang-Sub
    • Design & Manufacturing
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    • v.15 no.3
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    • pp.7-12
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    • 2021
  • Plastic injection molds used for rapid heating and cooling must minimize surface damage due to friction and maintain excellent thermal and low electrical conductivity. Accordingly, various surface treatments are being applied. The properties of Al2O3 coating and DLC coating were compared to find the optimal surface treatment method. Al2O3 coating was deposited by thermal spray method. DLC films were deposited by sputtering process in room temperature and high temperature PECVD (Plasma enhanced chemical vapor deposition) process in 723 K temperature. For the evaluation of physical properties, the electrical and thermal conductivity including surface hardness, adhesion and wear resistance were analyzed. The electrical resistance of the all coated samples was showed insulation properties of 24 MΩ/sq or more. Especially, the friction coefficient of high temp. DLC coating was the lowest at 0.134.