• 한국자동차공학회논문집
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• 제11권5호
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• pp.29-36
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• 2003

Exhaust manifolds suffer from serious temperature variation during the thermal fatigue test. The spatial distribution of temperature changes at each moment. Because transient flow can not be simulated during the long period of temperature change, the simulation can not be performed by conjugate heat transfer analysis. In this study, a new procedure for transient thermal analysis is established by decoupling fluid-solid analysis. The procedure consists of (1) transient CFD calculation (2 cycles), (2) mapping heat transfer coefficient to the inner surface of solid mesh as a boundary condition of heat conduction analysis and (3) transient heat conduction analysis in the long period (30 min). The realistic temperature change can be predicted by this procedure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.1092-1095
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• 2001

Steady state thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin with a thickness of 25${\mu}$m. It was assumed that the generated heat which is mainly by the on-state voltage drop, 9V for 12kV diode, is dissipated by way of the conduction through diodes layers to bonding wire and of the convection at the surface of passivating resin. It was predicted by the thermal analysis that the temperature rise of a pn junction of the 12kV diode can reach at the range of 16∼34$^{\circ}C$ under the given boundary conditions. The thickness and thermal conductivity(0.3∼3W/m-K) of the passivating resin did little effect to lower thermal resistance of the diode. As the length of the bonding wire increased, which means the distance of heat conduction path became longer, the thermal resistance increased considerably. The thermal analysis results imply that the generated heat of the diode is dissipated mainly by the conduction through the route of diode-dummy wafer-bonding wire, which suggests to minimize the length of the wire for the lowest thermal resistance.

• 한국응용과학기술학회지
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• 제23권3호
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• pp.238-242
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• 2006

Polyimide is a well-known organic dielectric material, which has not only high chemical and thermal stability but also good electrical insulating and mechanical properties. In this research, the electric conduction mechanism of PI Ultra-Thin Films was investigated at room temperature. At low electric field, ohmic conduction $(I{\propto}V)$ was observed and the calculated electrical conductivity was about $4.23{\times}10^{-15}{\sim}9.81{\times}10^{-15}\;S/cm$. At high electric field, nonohmic conduction $(I{\propto}V^2)$ was observed and the conduction mechanism was explained by space charge limited region effect. The dielectric constant of PI Ultra-Thin Films was about 7.0.

• 설비공학논문집
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• 제19권4호
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• pp.328-332
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• 2007

A superconducting magnetic energy storage (SMES) system has shorter response time and longer life time, and is more economical, and environment-friendly than other uninterruptible power supply (UPS). A conduction cooling system is well answer for the high temperature superconductor (HTS) SMES system. Because the conduction cooling system is simple, light and small structure. The purpose of this paper is to design and verify the effective conduction cooling system for the HTS SMES system. The analysis of heat loads in cryostat is performed. Thermal shield heat loads, temperatures of HTS coil surface and conduction Cu plate are estimated and measured.

• 비파괴검사학회지
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• 제31권6호
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• pp.665-670
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• 2011

In this paper, a new approach to detect surface cracks from a noisy thermal image in the infrared thermography is presented using an holomorphic characteristic of temperature field in a thin plate under steady-state thermal condition. The holomorphic function for 2-D heat flow field in the plate was derived from Cauchy Riemann conditions to define a contour integral that varies according to the existence and strength of a singularity in the domain of integration. The contour integral at each point of thermal image eliminated the temperature variation due to heat conduction and suppressed the noise, so that its image emphasized and highlighted the singularity such as crack. This feature of holomorphic function was also investigated numerically using a simple thermal field in the thin plate satisfying the Laplace equation. The simulation results showed that the integral image selected and detected the crack embedded artificially in the plate very well in a noisy environment.

• 한국산업정보학회논문지
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• 제23권1호
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• pp.31-41
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• 2018

이 논문에서는 대 전류, 고온 초전도 직류 리액터를 위한 전도 냉각 시스템의 구조 설계에 대해 논의하고자 한다. 초전도 자석, 보 빈, 전류 리드, 고정용 구조물 그리고 열 교환기가 포함된 전도 냉각 시스템 부품의 크기를 3D CAD 프로그램을 사용하여 계산하였다. 또한, 최적의 설계 변수를 결정하고 열적-기계적 특성을 분석하기 위해서 유한 요소법 모델을 제작하였다. 리액터 자석의 운전 전류와 인덕턴스는 각각 1,500 A 400 mH이며, 이에 따른 극저온 냉동기의 냉각 용량을 결정하기 위해 초전도 직류 리액터에서 발생하는 열 부하를 계산하였다. 또한, 대 전류가 흐르는 1 단부전도 냉각 시스템의 작동 테스트를 수행하였다. 구리 바는 40 K까지 냉각되었고 초전도 리드는 안정적으로 작동했다. 실험 결과로써, 1 단부 영역의 총 열 부하는 190 W였다. 본 연구 결과는 상용 초전도 직류 리액터의 설계 및 제조에 있어 효과적으로 활용 될 것이다.

• 터널과지하공간
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• 제9권1호
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• pp.27-35
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• 1999

아치형 공동의 열원 경계에 대한 열전도 특성은 반무한평면이나 원형공동에 대한 열전도 특성과는 다른 양상을 나타낸다. 본 연구에서는 지하 냉동저장 pilot plant 의 운영을 통하여 계측된 저장공동 주위안반내 온도분포패턴의 분석을 통하여 아치형 공동의 열원 경계를 갖는 새로운 열전도식을 유도하였다. 계측된 암반온도 분포패턴은 선형적 변화와 로그함수적 변화의 중간적인 양상을 보였다. 열전파에 미치는 열물성 변수들의 영향도 분석 및 도출된 열전도식과 현장계측에 의한 암반온도 분포양상의 비교를 통하여 암반의 열물성을 추정하였다. 추정된 암반의 열전도도와 비열은 실내시험에 의한 무결 암석의 열물성과 비교해 20~25%의 차이를 보였다. 이는 암반내의 절리와 지하수의 영향에 기인한 것으로 판단되는데, 앞으로 현지암반에 대한 이들 영향요소의 조사와 열물성의 측정 및 비교분석을 통하여 정량적인 상관관계의 규명이 이루어져야 할 것이다.

• 한국초전도ㆍ저온공학회논문지
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• 제4권2호
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• pp.73-77
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• 2002

In order to derive the detailed design of Thermal Shield Cryopanel. which plays a role to make the Tokamak Nuclear Fusion Equipment work at both static and efficient conditions the commercially available software package FLUENT Version 5.3, was utilized. This study investigated the effects of thermal sources and distributions on the temperatures of Lid. Body. Base. and EH-Port Cryopanel by the numerical technique whose grid generations cover the solid and 9as region of the panel. The physical model of the Thermal Shield Cryopanel is that the 10mm diameter of the pipe with 1mm thickness is soldered on the Stainless steel Panel with 4mm thickness. The heat fluxes to the panel are assumed to be by thermal radiation in the vacuum space and by conduction through the supporters. The inlet conditions of Helium gas are 20 atmospheric Pressures and 60K temperature. The panel shapes with cooling Pipes and the operational conditions to keep appropriate temperature distribution of Thermal Shield Cryopanel Have been found and suggested.

• 한국정밀공학회지
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• 제19권11호
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• pp.146-159
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• 2002

An efficient method to predict the convection heat transfer coefficients on the top surface of the engine piston is proposed. The method is based on the inverse method of the thermal conduction problem and uses a numerical optimization technique. In the method, the heat transfer coefficients are numerically obtained so that the difference between analyzed temperatures from the finite element method and measured temperatures is minimized. The method can be effectively used to analyze the temperature distribution of engine pistons in case when application of prescribed-temperature boundary condition is not reasonable because of insufficient number of measured temperatures. A hollow sphere problem with an analytic solution is taken as a simple example and accuracy and efficiency is demonstrated. The method is applied to a practical large liquid petroleum gas(LPG) engine piston and the heat transfer coefficients on the top surface of the piston is successfully calculated. Resulting analyzed temperature favorably coincides with measured temperature.

• 한국초전도ㆍ저온공학회논문지
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• 제5권2호
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• pp.30-35
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• 2003

The inductive superconducting fault current limiter (SFCLJ limits the fault current with its dc reactor. To fabricate the optimal dc reactor for inductive SFCL, several design and manufacturing technologies are necessary. In this paper, the manufacturing technology for dc reactor and cryogenic cooling method are described in detail. GM-cryocooler was used enlarge the critical current of dc reactor by cooling down the temperature of dc reactor about 20 K. Moreover, the results of short circuit test were described. Finally, the thermal characteristics of conduction-cooled system were discussed and then, sub-cooled nitrogen system was proposed to enhance the thermal stability of dc reactor.