• Title/Summary/Keyword: Thermal Analysis

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Application of thermoelectric module to DNA amplifying thermal cycle system (유전자(DNA)증폭 온도 사이클 시스템에 열전소자 활용을 위한 연구)

  • Cho, Jae-Seol;Jung, Se-Hun;Nam, Jae-Young;Choi, Jae-Boong;Kim, Young-Jin
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.210-215
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    • 2004
  • : A DNA analysis system based on fluorescence analysis has to have a DNA amplifying thermal cycle system. DNA amplification is executed by the temperature control. Accuracy of fluorescence analysis is influenced by the temperature control technology. For that reason, the temperature control is core technology in developing the DNA analysis system. Therefore, the objective of this paper is to develop the hardware to apply thermoelectric module to the DNA amplifying thermal cycle system. In order to verify the developed hardware for controlling the temperature of thermoelectric module, a DNA amplifying thermal cycle test was performed. From the test, the developed hardware controlled the temperature of thermoelectric module successfully. Therefore, it is expected that the developed hardware can be applied to the DNA amplifying thermal cycle system.

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Thermal decomposition and ablation analysis of solid rocket propulsion (삭마 및 열분해 반응을 고려한 고체 추진기관의 열해석)

  • Kim, Yun-Chul
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2010.05a
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    • pp.113-122
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    • 2010
  • A two-dimensional thermal response and ablation analysis code for predicting charring material ablation and shape change on solid rocket nozzle is presented. For closing the problem of thermal analysis, Arrhenius' equation and Zvyagin's ablation model are used. The moving boundary problem are solved by remeshing-rezoning method. For simulation of complicated thermal protection systems, this method is integrated with a three-dimensional finite-element thermal and structure analysis code through continuity of temperature and heat flux.

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Condensation Prevention Performance Assessment Taking Into Account Thermal Insulation Performance Degradation Due to Aging for Apartment Housing

  • Choi, Doo-Sung;Lee, Myung-Eun
    • KIEAE Journal
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    • v.15 no.6
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    • pp.11-18
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    • 2015
  • Purpose: The current study analyzed trends in thermal insulation performance with aging, and condensation characteristics caused by the former. Method: Thermal insulation and condensation prevention performance of an architecture were assessed using Temperature Difference Ration Inside, or TDRi. Subjects of this quantitative analysis in thermal insulation performance change due to aging included recently constructed apartments and aged apartments older than 40 years. Time series comparison and analysis were conducted to observed changes in the thermal insulation performance and condensation characteristics. Result: Analysis showed that wall insulation performance degraded with aging regardless of fortified insulating material usage or insulating material type, which caused increased danger of condensation. In addition, when fortified insulating material was installed on the connection between the walls, insulation performance degradation was lower compared to cases in which fortified materials were not used. In all cases from 1 to 10, the rate of thermal insulation performance degradation increased after 20 years of aging.

The effect of corner shape in the casting mould on thermal stresses distribution (金型의 모서리부 形狀이 熱應力分布에 미치는 影響)

  • 민수홍;구본권;김옥삼
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.15 no.2
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    • pp.567-574
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    • 1991
  • In this study thermal stress generated in three ingot moulds(GC25) during the solidification process of aluminum were analyzed by the two-dimensional thermo-elasto-plastic theory. In temperature analysis, all of the three models are shown steep temperature rising each case in initial stage of cooling. In thermal stress analysis, all of three models took compressible stress on inside wall of the mould, and tensible along with on out side. Model 2 take place less compressible, tensible stress then model 1. But model 3. have similar as thermal stress as model 2. The analysis will made one possible to calculate an optimum mould shape whose thermal stress gradient becomes minimum.

Evaluation of Thermal Characteristics for a Feeding Axis of Machine Tools Using Finite Element Analysis (유한 요소 해석을 활용한 공작기계 이송축 열적 특성 평가)

  • Lee, Chang Hoon;Choi, Jin Woo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.3
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    • pp.380-387
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    • 2013
  • In this study, two finite element (FE) models were developed to evaluate the thermal characteristics of a feeding axis of a CNC lathe. One was used for analysis of heat transfer to identify the temperature distribution of the feeding axis and then, the other was used for analysis of thermal deformation to evaluate its structural behavior based on the temperature distribution. The FE models were based on the test standard for the axial thermal displacement. The feeding velocity was composed of three steps: the ascending, constant, and descending velocities. Therefore, the heat generation and convection coefficient were calculated for each velocity and applied to the thermal FE model. The convection coefficient for the ball screw rotation was based on an experimental equation. The result of the analytical thermal displacement was compared with that of the experimental displacement to verify the finite element models.

Thermal Analysis using Thermal Equivalent Circuit Analysis and Finite Element Method of In-wheel Motor (In-wheel 전동기의 열 등가회로 해석 및 유한요소해법을 이용한 열해석)

  • Kim, Kyu-Seob;Lee, Byeong-Hwa;Hong, Jung-Pyo;Nam, Hyuk
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.941-942
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    • 2011
  • A thermal equivalent circuit of IPMSM considering eddy current loss of PM and core loss of rotor is proposed. This thermal equivalent model is represented by the thermal resistances and thermal capacitances. In order to determine the factor of each parameter, a heating test is processed. Additionally, the eddy current loss of PM is calculated by a transient 3D finite element analysis. Finally, this thermal equivalent model is verified by a temperature test in a 25kW 12-pole/18-slot IPMSM with varying load.

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Thermal Dissipation Characteristics of Multi-Chip LED Packages (멀티 칩 LED 패키지의 방열 특성)

  • Kim, Byung-Ho;Moon, Cheol-Hee
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.25 no.12
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    • pp.34-41
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    • 2011
  • In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

A Study on the Thermal Specific of Operational Spindle System of Machine Tool by FEM (주축의 동적거동시 FEM을 이용한 열적 특성에 관한연구.)

  • 임영철;김종관
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.10a
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    • pp.396-400
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    • 2003
  • This paper has studied thermal characteristics of machine tool to develope high speed spindle and optimum design condidering the thermal deformation. Comparing the test data of temperature measurement and structural analysis data using FEM, we verifiedthe test validity and predicted thermal deformation, influence of spindle generation of heat, and established cooling system to prevent the thermal deformation. 1) The temperature rise of spindle system depends on increasing number of rotation and shows sudden doubling increment of number of rotation over 7,000rpm. 2) Oil jacket cooling can be effective cooling method below 8,000rpm but, over 8,000rpm, it shows the decrement of cooling effect. 3) Comparing FEM analysis results and revolution test results, we can confirmn approximate temperature change consequently, it is possible to simulate temperature rise and thermal distribution on the inside of spindle system. 4) We can confirm that simulated approach by FEM analysis can be effective method in thermal-appropriate design..

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Data Analysis of KOMPSAT Thermal Test in Simulated On-orbit Environment

  • Kim, Jeong-Soo;Chang, Young-Keun
    • International Journal of Aeronautical and Space Sciences
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    • v.1 no.2
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    • pp.30-42
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    • 2000
  • On-orbit thermal environment test of KOMPSAT was performed in early 1999. An analysis of the test data are addressed in this paper. For the thermal-environmental simulation of spacecraft bus, an artificial heating through the radiator zones and onto some critical heat-dissipating electronic boxes was made by Absorbed-heat Flux Method. Test data obtained in terms of temperature history were reduced into flight heater duty cycles and converted into the total electrical power required for spacecraft thermal control. Verification result of flight heaters dedicated to the bus thermal control is presented. Additionally, an exhaustive heating-control process for maintaining the spacecraft thermally safe and for realistic simulation of the orbital-thermal environment during the test are graphically shown. Qualitative suggestions to post-test model correlation are given in consequency of the analysis.

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A Study on the Thermal Stress Analysis of a Piston in a Turbocharged Diesel Engine (터보 디젤엔진 피스톤의 열응력 해석에 관한 연구)

  • 국종영
    • Transactions of the Korean Society of Automotive Engineers
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    • v.9 no.2
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    • pp.92-98
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    • 2001
  • We determined the transfer coefficient through the analysis of three dimensional temperature distribution in comparison with the measured temperature on the piston in the turbocharged diesel engine. And we analyzed the thermal stress and the thermal deformation with that heat transfer coefficient by using finite element method. According to this results, we found that maximum tempetature range of the piston appeared at the upper part of the piston crown and that the heat transfer coefficient of the upper part of the piston is smaller than that of the lower one. It showed that the maximum thermal deformation is shown at the edge of the upper part of piston and that the maximum thermal stress was shown on the lower part of the piston crown. Finally, we defined the method of determination of a piston heat transfer analysis by using measured temperature on the piston and analyzed temperature with finite element method.

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