• Journal of computational fluids engineering
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• v.19 no.4
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• pp.37-44
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• 2014

A detailed satellite panel thermal model composed of more than thousands nodes can not be directly integrated into a spacecraft thermal model due to its node size and the limitation of commercial satellite thermal analysis programs. For the integration of the panel into the satellite thermal model, a reduced thermal model having proper accuracy is required. A thermal model reduction method was developed and validated by using a geostationary satellite panel. The temperature differences of main components between the detailed and the reduced thermal model were less than $1^{\circ}C$ in steady state analysis. Also, the dynamic responses of the detailed and the reduced thermal model show very similar trends. Thus, the developed reduction method can be applicable to actual satellite thermal design and analysis with resonable accuracy and convenience.

• Nuclear Engineering and Technology
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• v.44 no.1
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• pp.21-32
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• 2012

Fluorinated compounds mainly used in the semiconductor industry are potent greenhouse gases. Recently, thermal plasma gas scrubbers have been gradually replacing conventional burn-wet type gas scrubbers which are based on the combustion of fossil fuels because high conversion efficiency and control of byproduct generation are achievable in chemically reactive high temperature thermal plasma. Chemical equilibrium composition at high temperature and numerical analysis on a complex thermal flow in the thermal plasma decomposition system are used to predict the process of thermal decomposition of fluorinated gas. In order to increase economic feasibility of the thermal plasma decomposition process, increase of thermal efficiency of the plasma torch and enhancement of gas mixing between the thermal plasma jet and waste gas are discussed. In addition, noble thermal plasma systems to be applied in the thermal plasma gas treatment are introduced in the present paper.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.14-14
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• 2011

Graphene is known to possess excellent thermal properties, including high thermal conductivity, that make it a prime candidate material for heat management in ultra large scale integrated circuits. For device applications, the key parameters are the thermal expansion coefficient and the thermal conductivity. There has been no reliable experimental determination on the thermal expansion coefficient of graphene whereas the estimates of the thermal conductivity vary widely. In this work, we estimate the thermal expansion coefficient of graphene on silicon dioxide by measuring the temperature dependence of the Raman spectrum. The shift of the Raman peaks due to heating or cooling results from both the intrinsic temperature dependence of the Raman spectrum of graphene and the strain on the graphene film due to the thermal expansion mismatch with silicon dioxide. By carefully comparing the experimental data against theoretical calculations, it is possible to determine the thermal expansion coefficient. The thermal conductivity is measured by estimating the thermal profile of a graphene film suspended over a circular hole of the substrate.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.3
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• pp.356-364
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• 2015

The transmission performance of TSV considering the effect of electronic-thermal coupling is an new challenge in three dimension integrated circuit. This paper presents the thermal equivalent circuit (TEC) model of the TSV, and discussed the thermal equivalent parameters for TSV. Si layer is equivalent to transmission line according to its thermal characteristic. Thermal transient response (TTR) of TSV considering electronic-thermal coupling effects are proposed, iteration flow electronic-thermal coupling for TSV is analyzed. Furthermore, the influences of TTR are investigated with the non-coupling and considering coupling for TSV. Finally, the relationship among temperature, thickness of $SiO_2$, radius of via and frequency of excitation source are addressed, which are verified by the simulation.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.208-213
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• 2002

When a thermoset conductive adhesive joints are subjected to the thermal cycles, the thermal stresses are developed around the joints. Most of in-plane, hi-axial components of these residual stresses induces large tensile peel stresses and weakens adhesive joints. Also these stresses vary with thermal cycles, and result in thermal fatigue loading and debonding propagation. In this study, the thermal ratchetting effect in conductive adhesive joints are evaluated by the finite element analysis with the viscoelastic material model. In order to Investigate the relationship between thermal ratchetting and glass transition temperature, the mathematical material model has been developed experimentally by dynamic mechanical analysis. These material models are implemented to the finite element analysis with thermal loading cycles. And the stress profiles around the conductive adhesive joints are calculated. It has been observed that the thermal ratchetting occurs when the maximum temperature of thermal cycles is above the glass transition temperature. The peel and shear stress components increase as the thermal loading time increases. This will contributes to thermal fatigue fracture of the joints.

• Journal of The Korean Astronomical Society
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• v.27 no.1
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• pp.81-102
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• 1994

We have decomposed the 11-cm radio continuum emission of the W51 complex into thermal and non-thermal components. The distribution of the thermal emission has been determined by analyzing HI, CO, and IRAS $60-{\mu}m$ data. We have found a good correlation between the 11-cm thermal continuum and the 60- 11m emissions, which is used to obtain the thermal and non-thermal 11-cm continuum maps of the W51 complex. Most of the thermal continuum is emanating from the compact H II regions and their low-density ionized envelopes in W51A and W51B. All the H II regions, except G49.1-0.4 in W51B, have associated molecular clumps. The thermal radio continuum fluxes of the compact H II regions are proportional to the CO fluxes of molecular clumps. This is consistent with the previous results that the total mass of stars in an H II region is proportional to the mass of the associated molecular clump. According to our result, there are three non-thermal continuum sources in W51: G49.4-0.4 in W51A, a weak source close to G49.2-0.3 in W51B, and the shell source W51C. The non-thermal flux of G49.5-0.4 at 11-cm is $\~28 Jy$, which is $\~25\%$ of its total 11-cm flux. The radio continuum spectrum between 0.15 and 300 GHz also suggests an excess emission over thermal free-free emission. We show that the excess emission can be described as a non-thermal emission with a spectral index ${\alpha}{\simeq}-1.0 (S_v{\propto}V^a)$ attenuated by thermal free-free absorptions at low-frequencies. The non-thermal source close to G49.2-0.3 is weak $(\~9 Jy)$. The nature of the source is not known and the reality of the non-thermal emission needs to be confirmed. The non~thermal shell source W51C has a 11-cm flux of $\~130Jy$ and a spectral index ${\alpha}{\simeq}-0.26$.

• Smart Structures and Systems
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• v.15 no.2
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• pp.469-488
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• 2015

Thermal loads, especially thermal gradients, have a considerable effect on the behaviors of large-scale bridges throughout their lifecycles. Bridge design specifications provide minimal guidance regarding thermal gradients for simple bridge girders and do not consider transversal thermal gradients in wide girder cross-sections. This paper investigates the three-dimensional thermal gradients of arch bridge girders by integrating long-term field monitoring data recorded by a structural health monitoring system, with emphasis on the vertical and transversal thermal gradients of wide concrete-steel composite girders. Based on field monitoring data for one year, the time-dependent characteristics of temperature and three-dimensional thermal gradients in girder cross-sections are explored. A statistical analysis of thermal gradients is conducted, and the probability density functions of transversal and vertical thermal gradients are estimated. The extreme thermal gradients are predicted with a specific return period by employing an extreme value analysis, and the profiles of the vertical thermal gradient are established for bridge design. The transversal and vertical thermal gradients are developed to help engineers understand the thermal behaviors of concrete-steel composite girders during their service periods.

• Transactions of Materials Processing
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• v.11 no.1
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• pp.61-68
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• 2002

The thermal shock and thermal fatigue test has been carried out to analyze the thermal characteristics of tool steels for hot forging and the effects of mechanical properties on this study have been investigated. The resistance to thermal shock is first of all a matter of good toughness and ductility. Therefore, a proper hot-work tool steel should be characterized by high fracture strength and high temperature toughness. Based on these results, some critical temperature($T_{fracture}$) at which fracture occur can be measured to characterize the thermal resistance of the materials. During thermal fatigue tests, the thermal fatigue cracks occur because of the repetitive heating and cooling of the die surface and the thermal fatigue damage was evaluated by analyzing different number of cycles to failure. The results showed that the resistance to thermal shock and thermal fatigue were found to be favoured by high hot tensile strength and high hot hardness, and thermal resistance of SKD61 was superior to that of ESC, SKT4 and this was caused by higher mechanical properties of SKD61.

• KIEAE Journal
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• v.14 no.1
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• pp.75-81
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• 2014

This study aims at investigating the benefit of actively controlling humidity to improve thermal comfort and energy efficiency in climate zones other than hot-dry. For this research purpose, three thermal control strategies, which adopted different initiative degrees in humidity control, were developed - i) temperature controls, ii) temperature and humidity controls, and iii) thermal sensation controls. Performance of the developed strategies were experimentally tested in a full scale mock up of an office environment. The study revealed that air temperature was better controlled in the occupied zone under the first two strategies than the thermal sensation based strategy. On the other hand, the thermal sensation-based strategy maintained thermal sensation levels more comfortably. In addition, energy consumption was significantly reduced when humidity was actively controlled for thermal comfort. The thermal sensation-based control strategy consumed significantly less electricity than the first two strategies. From these findings, this study indicated that adoption of an active humidity control system based on thermal sensation can provide increased thermal comfort as well as energy savings for summer seasons in climatic zones other than hot-dry.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.1
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• pp.56-64
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• 2002

Machine tools are engineered to give high dimensional accuracy in machining operation. However, errors due to thermal effects degrade dimensional accuracy of machine tools considerably, and many machine tools are equipped with thermal error compensation function. In general, thermal errors can be generated in the angular directions as well as linear directions. Among them, thermal errors in the angular directions contribute a large amount of error components in the presence of offset distance as in the case of Abbe error. Because most of thermal error compensation function is based on a good correlation between temperature change and thermal deformation, angular thermal deformation is often to be the most difficult hurdle for enhancing compensation accuracy. In this regard, this paper investigates the effect of thermal bending to total thermal error and gives how to deal with thermally induced bending effects in thermal error compensation.