• Title/Summary/Keyword: Test module

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전기체 구조시험을 위한 고성능 과하중 방지 모듈 개발

  • Chae, Dong-Chul;Kim, Sung-Chan;Hwang, Gui-Chul;Sung, Kyung-Jin;Shim, Jae-Yeul;Hwang, In-Hee
    • Aerospace Engineering and Technology
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    • v.3 no.2
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    • pp.208-216
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    • 2004
  • Advanced overload protection module for full scale airframe structural test was developed by improving the existing overload protection module. When performing the full scale airframe structural test, overload can be applied to the test article due to unexpected situations such as system shutdown, test article failure, and deficiency of design strength. Therefore, the overload protection module is needed for protecting the test article in unexpected overload situations. In this paper, the function of the existing overload protection module was summarized for each component and the problems encountered when using it in structural test were analyzed in addition, the development of advanced overload protection module was described.

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The analysis of growth and electrical characteristics of micro-crack with thermal effect in PV module (PV 모듈에서 온도 영향에 의한 micro-crack 성장과 전기적 특성 분석)

  • Song, Young-Hun;Kang, Gi-Hwan;Yu, Gwon-Jong;Ahn, Hyung-Gun;Han, Deuk-Young
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1318-1319
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    • 2011
  • In this paper, we analyzed of growth and electrical characteristics of micro-cracks with thermal effect in PV module. The micro-cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because microcracks accelerated aging by thermal cycling test. according to IEC61215. Before every test, we checked output and EL image of PV module.

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Suggestion of Long-term Life Time Test for PV Module in Highly Stressed Conditions (가혹조건에서의 태양전지모듈 내구성 평가를 통한 최적의 시험조건 제안)

  • Kim, Kyung-Soo;Kang, Gi-Hwan;Yu, Gwon-Jong;Yoon, Soon-Gil
    • Journal of the Korean Solar Energy Society
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    • v.30 no.5
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    • pp.63-68
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    • 2010
  • To guarantee life time more than 20 years for manufacturer without stopping photovoltaic(PV) system, it is really important to test the module in realistic time and condition compared to outside weather. In here, we tested PV modules in highly stressed condition compared to IEC standards. In IEC 61215 and IEC 61646 standards, damp-heat, thermal cycle(TC200) and mechanical test are main test items for evaluating long-term durability of PV module in controlled temperature and humidity condition. So in this paper, we have lengthened the test time for TC200 and damp-heat test and increased the loading stress on surface of module. Through this test, we can get some clue of proper the method for measuring realistic life cycle of PV modules and suggested the minimum time for PV test method. The detail description is specified as the following paper.

Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions (Bendable 임베디드 전자모듈의 손상 메커니즘)

  • Jo, Yun-Seong;Kim, A Young;Hong, Won Sik
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.59-63
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    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

An Experimental Study on the Characteristic of Thermal Performance according to Feed Water Conditions to of Vacuum Membrane Distillation Module using PVDF Hollow Fiber (PVDF 중공사막을 이용한 진공 막 증류 모듈의 공급수 조건에 따른 열성능 특성에 관한 실험적 연구)

  • Joo, Hongjin;Kwak, Heeyoul
    • Journal of Korean Society of Water and Wastewater
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    • v.31 no.4
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    • pp.339-346
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    • 2017
  • In this study, thermal performance test of VMD module was performed, prior to the construction of the demonstration plant using the vacuum membrane distillation (VMD) module of the capacity of $400m^3/day$ and to the commercialization of the VMD module. For the thermal performance test, the experimental equipment of capacity of $2m^3/day$ was constructed. The permeate flux test and thermal performance test according to feed water conditions such as temperature and flow rate were conducted. The VMD module used in the study was manufactured by ECONITY Co., LTD with PVDF hollow fiber membrane. As a result, the Performance Ratio (PR) of the VMD module showed the maximum value of 0.904 under the condition of feed water temperature of $75^{\circ}C$ and flow rate of $8m^3/h$. PR value of the VMD module using PVDF hollow fiber membrane showed linearly increasing relationship with feed water temperature and flow rate. Also, The permeate flux of the VMD module was analyzed to have maximum value of 18.25 LMH and the salt rejection was 99.99%.

A Study on Performance Test of a Photovoltaic System Inverter using Real Time Digital Simulator (RTDS) (RTDS 시험모듈을 이용한 태양광 인버터의 성능시험에 관한 연구)

  • Kim, Eung-Sang;Kim, Seul-Ki;Jeon, Jin-Hong;Ahn, Jong-Bo
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.2
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    • pp.325-333
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    • 2007
  • A PV system inverter test module using RTDS was developed and performance test of a commercial PV inverter was carried out. The developed module consists of one RTDS hardware rack, RTDS software models representing PV array and simple distribution system, and two power amplifiers that was specifically designed for generating power corresponding to signals from RTDS. Performance test results verified effectiveness and reliability of the test module. It is expected that the developed test module may help PV inverter manufacturers improve ana test their systems in the developing stage.

Performance Change of Crystalline Photovoltaic Module in Modified Test Sequence (복합 환경시험 순서에 따른 태양전지모듈의 특성 변화)

  • Kim, Kyung-Soo;Kang, Gi-Hwan;Yu, Gwon-Jong;Yoon, Soon-Gil
    • 한국태양에너지학회:학술대회논문집
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    • 2011.04a
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    • pp.23-24
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    • 2011
  • In this paper, I performed the IEC test in crystalline photovoltaic module described in test standard. And sometimes I changed the test sequence and impact factors for testing modules. Comparing the current test trees in IEC 61215, some ideas are suggested in proper test sequence to guarantee the long-term durability for 25 years.. The detail discussion will be shown in the following paper.

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Voltage source multilevel module converter valve test circuit research (전압원 멀티레벨 컨버터 밸브 시험회로 연구)

  • Yuan, Zhen;Lee, Jinhee;Jung, Teagsun;Baek, Seungtaek
    • Proceedings of the KIPE Conference
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    • 2014.07a
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    • pp.79-80
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    • 2014
  • Voltage source multilevel module converter attracts more and more attention recently. The core component of the voltage source multilevel module converter is the valve based on IGBT. So the test circuit for the valve is very important, reliable test method can guarantee the converter valve design meet the operation requirement. This paper analyzes the valve voltage and current stress during the operation, and according to IEC standard test requirement, object, condition, introduces a kind of test circuit. Finally, through the simulation model, to verify the test circuit can provide the proper test condition for the voltage source multilevel module converter valve.

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An Evaluation Measure of Software Module and Its Application to Allocation of Test Times of Modules (소프트웨어의 모듈평가척도와 모듈테스트 시간할당에의 응용)

  • Lee Chang-Hun;Kim Geon-Hyeong
    • Journal of the military operations research society of Korea
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    • v.16 no.1
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    • pp.130-141
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    • 1990
  • This paper presents an allocation model of test times of software modules. An evaluation measure of modules which is based on the data flow path between modules is used at test phase. An evaluation measure is expressed by the possible path number of data flow for each module, which can be interpreted as an importance of individual module. Three criteria : module test time, module reliability, and system reliability is considered in this model. Multi-objective programming, hence, is used to solve this model.

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HALT of High Power Amplifier Module Used in Radar (레이더용 고출력 증폭기 모듈의 HALT)

  • Hwang, Soon-Mi;Kim, Chul-Hee;Lee, Kwan-Hun
    • Journal of Applied Reliability
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    • v.14 no.2
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    • pp.97-102
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    • 2014
  • Radar is an object-detection system that uses radio waves to determine the range, altitude, direction, or speed of objects. High power amplifier Module is the most critical part of the high-power radar transmitter systems. It can be used to detect aircraft, ships, spacecraft, guided missiles, motor vehicles, weather formations, and terrain. Research related to radar has been conducted in various fields according to improvement of the communication technology. But only performance-originated technology development has been dashed; study concerning environment duality and safety concerning reliability are still insufficient. In general, radar module is exposed to the outside, on the means of moving or fixed in a certain place. It should be guaranteed sufficient immunity for a variety of environmental stresses that can occur in the outdoor. HALT is a great process used for quickly finding failure mechanisms in a hardware design and product. By applying various kinds and extreme level of stresses, we can find the operating limits of products. In thesis, we conducted HALT test of the high power amplifier modules which used in military and automotive radar. After the test, we analyzed environmental weaknesses of high power amplifier modules using conventional construction data.