• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• 한국압력기기공학회 논문집
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• 제5권1호
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• pp.25-31
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• 2009

Steam Generator(SG) tube is an important component of Nuclear Power Plant(NPP), which comprises of the pressure boundary of primary system. The integrity of SG tube has been confirmed by the eddy current test every outage. In Korea, Bobbin probe and MRPC probe have been generally used for the eddy current test. Meanwhile the usage of Array probe has gradually increased in U.S., Japan and other countries. In this study, we investigated the defect detection capability of the Array probe through its preliminary application to SG tube inspection. The Array probe has the equivalent capability in the defect detection and sizing as the conventional methods. Thus it is desirable that the Array probe is generally applied to SG tube inspection in the domestic NPPs.

• Progress in Superconductivity
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• 제4권1호
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• pp.74-79
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• 2002

High-speed probe made to test single flux quantum(SFQ) circuits was comprised of semi-rigid coaxial cables and microstrip lines. The impedance was set at 50 $\Omega$to carry high-speed signals without much loss. To do performance test of high-speed probe, we have attempted to fabricate a test chip which has a coplanar waveguide(CPW) structure. Electromagnetic simulation was done to optimize the dimension of CPW so that the CPW structure has an impedance of 50$\Omega$, matching in impedance with the probe. We also used the simulation to investigate the effect of the width of signal line and the gap between signal line and ground plane to the characteristics of CPW structure. We fabricated the CPW structure with a gold film deposited on Si wafer whose resistivity was above $1.5\times$10$_4$$\Omega$.cm. The magnitudes of S／sub 21／ of CPW at 6 ㎓ in simulations and in the actual measurements done with a network analyzer were: -0.1 ㏈ and -0.33 ㏈ (type A),-0.2 ㏈ and -0.48 ㏈ (type B), respectively. Using the test chip, we have successfully tested the performance of high-speed probe made for SFQ circuits. The probe showed the good performance overthe bandwidth of 10 ㎓.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1718-1723
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• 2007

The Probe Card is a test component which is to classify the good semiconductor chips before the packaging. The yield of semiconductor product can be better from analysis of probe test information. Recently the technology of the probe card needs narrow width and large amount of probe tip. In this research, the probe tip based on the MEMS(micro electro mechanical system) technology was designed and fabricated to improve the reliability of the test and to meet 2-dimensional Array of tip. The mechanical and electrical properties of proposed tip were evaluated and it has over 100,000 of repetition times in the condition of 5gf, $20{\mu}m$ Over Drive.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권5호
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• pp.641-649
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• 2016

In this paper, a novel time-domain measurement technique on a high parallelism probe card with protection resistors installed is proposed. The measured signal amplitude decreases when the measurement is performed by Needle Auto Calibration (NAC) probing on a high parallelism probe card with installed resistors. Therefore, the original signals must be carefully reconstructed, and the compensation coefficient, which is related to the number of channel branches and the value of protection resistors, must be introduced. The accuracy of the reconstructed signals is analyzed based on the varying number of channel branches and various protection resistances. The results demonstrate that the proposed technique is appropriate for evaluating the overall signal performance of probe cards with Automatic Test Equipment (ATE), which enhances the efficiency of probe card performance test dramatically.

• 한국산학기술학회논문지
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• 제19권10호
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• pp.324-329
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• 2018

본 논문은 테스트 프로브의 플런저 접점 위치와 구조에 따른 신호 전달 특성 변화를 분석하였다. 플런저 접점 위치는 실제 동작 상황을 고려하였으며, 플런저 내부 접점과 바렐 입구 접점으로 나누어 테스트 프로브의 고주파 성능 변화를 조사하였다. 또한 테스트 프로브는 더블, 싱글, 아웃스프링의 3 가지 구조로 나누고 구조 차이에 따른 신호 전달 특성 변화를 분석하였다. 고주파 전자기 해석 툴 HFSS를 사용하여 삽입손실과 반사손실을 계산하고, Q3D 시뮬레이션을 이용하여 테스트 프로브의 임피던스를 분석한다. 접점 위치에 따른 계산 결과, 바렐 입구 접점의 삽입손실이 플런저 내부 접점보다 감소하였다. 이를 통해 테스트 프로브의 접점 위치에 따라 테스트 프로브의 고주파 성능이 달라질 수 있음을 확인하였다. 구조에 따른 신호 전달 특성의 비교 분석에서는 아웃스프링 프로브가 보다 우수한 삽입손실과 반사손실 주파수 특성을 보여주었다. 테스트 프로브 구조별로 특성 임피던스를 계산하였으며 더블 프로브와 싱글 프로브는 $30.8{\Omega}$으로 동일한 결과를 보여주었다. 반면에 아웃스프링 프로브는 $47.1{\Omega}$의 결과가 나타났다. 아웃스프링 프로브의 특성 임피던스가 $50{\Omega}$에 보다 근접하여 높은 신호 전달 특성을 보인 것으로 분석된다. 아웃스프링 프로브가 높은 삽입손실과 반사손실 특성을 보여 고속 동작 제품의 성능 검사에 적합한 것으로 예상한다.

• 한국전기전자재료학회논문지
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• 제20권9호
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• 대한전자공학회논문지SD
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• 제48권1호
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• pp.1-6
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• 2011

본 논문에서는 미세피치 프로브 카드 제작을 위한 S 모양의 일체형 외팔보 프로브 형성방법에 대하여 기술하였다. 마세 피치 프로브를 위하여 Deep RIE etching을 이용하여 실리콘 트렌치 안에 일체형 프로브 빔과 탑을 형성하는 방법을 사용하였고, 피라미드 팁의 형성을 위하여 KOH 및 TMAH 습식식각을 이용하였으며, 습식식각시 방향성을 가지는 실리콘 웨이퍼에서도 휘어진 형태의 프로브 빔을 형성할 수 있는 건식 식각 및 습식식각 방법을 제시하였다. 따라서 제작된 외팔보 형태의 프로브는 디렘(DRAM), 플레시 메모리 (Flash memory) 용 프로브 카드 제작에 사용될 뿐만 아니라 RF 소자용 프로브 카드, 아이씨 테스트 소켓 (IC test socket)용 프로브 탐침에도 사용 될 것이다.

• 한국해양공학회지
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• 제36권1호
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• pp.1-10
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• 2022

Recently, as the offshore structures are operated in the deep-sea oil fields, interest in the analysis of relative wave elevation around platforms is increased. In this study, it is examined how the analysis results differ depending on the characteristics of the wave probe when interpreting the relative wave elevation in the model test. First, by conducting the wave probe comparison experiment in the two-dimensional wave tank, it is confirmed how the measured values differ according to the type of wave probe for the same physical phenomenon. Two types of wave probe are selected, the resistance type and the capacitance type, and the causes of the difference in measured values is studied. After that, the model test of the semi-submersible platform is conducted to investigate the relative wave elevation. Relative wave elevation is measured with the wave probes used in the wave probe comparison experiment and analyzed to estimate the asymmetric factor and the extreme upwell. The results between the two types of wave probes are compared, and qualitative study for the cause of the difference is conducted by photographing the physical phenomenon using a high-speed camera. Through the above study, it is confirmed that the capacitance type wave probe shows a larger measured value than the resistance type under the breaking-wave condition, and the same results are obtained for the asymmetric factor and the extreme upwell. These results is thought to be due to the difference in the measurement principle between wave probes, which is whether or not they measured water bubbles. This implies that the model test should be conducted using appropriate wave probes by considering the physical phenomenon to be analyzed.

• 한국지반공학회지:지반
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• 제3권4호
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• pp.31-40
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• 1987

얕은 지반의 현장탐사와 다짐도의 측정등에 적합한 나선탐사시험을 개발하여 그 시기결과를 표준 관입시험, 도추관입시험, 현장밀도시험 등 기존의 현장시험결과와 비교, 분석하였다. 나선탐사설험은 다른 현장시광에 비하여 경제적이며 1인이 쉽게 시험할 수 있는 장점이 있다. 흙의 물성치는 택 사기를 지반에 관입시키는데 필요한 토오크로 나타내며 본 연구결과, 표준관입시험 및 원유관입시 험의 결과와 잘 일치하고 표준관입시험과의 상관관계는 흙의 종류에 따른 유관성이 낮으나 도유관 입시험과의 경우, 유관성이 높다. 또한 나선탐사시험은 상대다짐또와 다짐지반의 현장밀도의 측정 에도 정도가 높다. 한펀 지반의 평균정립(D50)이 증가함에 따라 나선탐사시험의 역포전비는 감소하는 특성을 보인다.