• 제어로봇시스템학회:학술대회논문집
• /
• 1997.10a
• /
• pp.77-80
• /
• 1997

In this paper presented is a temperature controller for a semiconductor test handler. Using ARMAX model and least square method, the chamber model for the design of a controller is identified through experiment. With the identified model an LQG/LTR controller is designed. Experiment with a real test handler demonstrated good performance in that its overshoot is small and response time is fast.

• 제어로봇시스템학회:학술대회논문집
• /
• 1997.10a
• /
• pp.73-76
• /
• 1997

The temperature control system for semiconductor test handler is designed. We controlled the temperature of chamber using 3-wire RTD sensor and MVME EMbedded controller. VxWorks that is a real-time operating system is used and heater is controlled by PWM. Temperature fluctuation of chamber is decreased within 0.3.deg. C, which is about one-half of that of commercial controller.

• The Transactions of the Korean Institute of Electrical Engineers A
• /
• v.48 no.4
• /
• pp.395-401
• /
• 1999

In this paper, a temperature controller for a semiconductor test handler is proposed. First, a handware system for identification and control is established using RTD sensors, an A/D converter, solid state relays, a heater, and a computer system. Second, using ARMAX model and least square method, a chamber model for the design of a controller is identified through experiments. The identified model is verified to describe the real plant very well in the sense that it shows very similar input-output responses to those of the real system. With the identified model an LQG controller is designed. Frequency response of the designed controller shows that it has 15 dB of gainmargin and (-50˚, +50˚) of phase margin. Experiment with a real test handler demonstrates a good performance in the sense that its overshoot and steady state error are smaller and response time is faster, compared with those of a conventional PID controller.

• Journal of Digital Convergence
• /
• v.15 no.7
• /
• pp.223-229
• /
• 2017

Europe, the US and Japan have acquired test results on impact coefficient for a long time and applied it to equipment design to secure safety of structures. However, Korean enterprises use the impact factor held by advanced business to design equipment as it is difficult for them to obtain it through tests. In this paper, NX/NASTRAN, was used to perform static load analysis and impact load analysis of a PCB Handler, semiconductor test equipment, and the result was employed to study how to calculate the impact coefficient with the finite element analysis. The calculation method was applied to the JIS(Japanese Industrial Standard), and the impact coefficient of the PCB handler was calculated as 1.27 for the sudden start or stop. The impact coefficient generated by the analysis is expected to make a great contribution to the industry as it can be used to improve the equipment structure and develop on existing equipment in the future.

• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.32A no.3
• /
• pp.411-417
• /
• 1995

Packet switching is an important aspect of ISDN. In the TDX-10 switching system, which is being developed as an ISDN exchange in Korea, the packet switching function is implemented on the basis of Case B scenario of X.31. After implementing the packet switching function the performance test must be executed to check whether the design objectives of performance are satisfied or not. However, it is not easy to set up test environment for performance measurement under full load conditions. This paper presents the design of the traffic generator which enables us to do performance test of the TDX-10 packet handler under full load conditions. To generate packet traffic we change only software programs without any change of the hardware system of the packet handler.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.15 no.10
• /
• pp.5906-5911
• /
• 2014

Currently, there are many processes of package assembly and inspections of real fields that examine whether a manufactured semiconductor can be operated regularly and can endure low humidity or high temperatures. As the inspection equipment of a semiconductor test handler picker has been used at the inspection process, these inspection equipment frames were modelled in 3D and these models were analyzed using 3 kinds of fatigue loadings. As the analysis result, maximum deformation occurred at the midparts of the frames at cases 1 and 2. Among the cases of nonuniform fatigue loads, the 'SAE bracket history' with the severest change in load became the most unstable but the 'Sample history' became the most stable. Fatigue analysis result can be used effectively with the design of an inspecting equipment frame of a semiconductor test handler picker to examine the prevention and durability against damage.

• Journal of Institute of Control, Robotics and Systems
• /
• v.13 no.11
• /
• pp.1112-1118
• /
• 2007

We propose a new-focusing method for test handlers of compact camera module (CCM), The MMD (max-min difference) method is applied to calculate the focus value quickly considering the noisy output of CCM. Also, the fuzzy search method is applied to find the maximum focus value effectively. We design a fuzzy processor to control the lens position by focus values and brightness values, which improves the focusing performance in the sense of speed and processor memory. The proposed method is implemented by computer program and installed at the CCM test handler machines. The simulation results are presented to verify the usefulness of the proposed method.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.10
• /
• pp.2606-2615
• /
• 1994

Sorting time is one of the most important issues for auto IC test handling systems. In actual system, because of too much path, reducing the computing time for finding a sorting path is the key way to enhancing the system performance. The exhaustive path search technique can not be used for real systems. This paper proposes heuristic sorting algorithm to find the minimal sorting time. The suggested algorithm is basically based on the best-first search technique and multi-level search technique. The results are close to the optimal solutions and computing time is greately reduced also. Therefore the proposed algorthm can be effectively used for real-time sorting process in auto IC test handling systems.

• Journal of the Semiconductor & Display Technology
• /
• v.7 no.4
• /
• pp.23-28
• /
• 2008

A high speed automated pitch variation unit (HAPU) related to semiconductor category sorting movement of the test handler system was developed. In the design process, 'DMADOV' step of 6-Sigma method has been applied. The design result for the desirable pitch variation was a 3:1 reduction rack-pinion and a linkage which are operated by servomotors. The realization and reliability of the mechanism was obtained at the design stage by FEM analysis, and by robust design using Taguchi orthogonal array against weight and deformation. Finally, the validity of the high speed variation mechanism was confirmed via inspection using a high speed camera while performing pitch variation.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.15 no.8
• /
• pp.4815-4820
• /
• 2014

As semiconductor chips are on a small scale, large content and high integratation, it is essential to develop the device of pick and place at the system of the semiconductor test handler to ensure its high precision and durability. In this study, inspection equipment frame model of a semiconductor test handler picker was investigated by vibration analysis with the property of the natural frequency and harmonic response. As 3 kinds of analysis case models, the device of pick and place was located at the left side (Case 1), the center (Case 2) and the right side (Case 3) of the upper guideline. The range of natural frequencies until the 6th order on this frame model ranges from 80Hz to 500Hz. As the analysis of the harmonic response when the frame is resonant, Case 2 showed the maximum equivalent stress of 52.802 MPa more than Cases 1 or 3. Case 2 was the most intensive among the three cases. Using the analysis result of this study, the design of the frame model, which can be applied to the safe working environment of the system is believed to be possible.