• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2007년도 춘계학술대회B
• /
• pp.2449-2452
• /
• 2007

Hot spots on thin wafers of IC packages are becoming important issues in thermal and electrical engineering fields. To investigate these hot spots, we developed a Diode Temperature Sensor Array (DTSA) that consists of an array of 32 ${\times}$32 diodes (1,024 diodes) in a 8 mm ${\times}$ 8 mm surface area. To know specifically the hot spot temperature which is affected by the chip thickness and a generated power, we made the DTSA chips, which have 21.5 ${\mu}m$, 31 ${\mu}m$, 42 ${\mu}m$, 100 ${\mu}m$, 200 ${\mu}m$, and 400 ${\mu}m$ thickness using the CMP process. And we conducted the experiment using various heater power conditions (0.2 W, 0.3 W, 0.4 W, 0.5 W). In order to validate experimental results, we performed a numerical simulation. Errors between experimental results and numerical data are less than 4%. Finally, we proposed a correlation for the hot spot temperature as a function of the generated power and the wafer thickness based on the results of the experiment. This correlation can give an easy estimate of the hot spot temperature for flip chip packaging when the wafer thickness and the generated power are given.

• 대한전자공학회논문지SD
• /
• 제45권12호
• /
• pp.8-14
• /
• 2008

본 논문에서는 $8{\times}8$ CNT 센서 어레이를 CMOS 공정 후 처리를 통하여 센서회로가 제작된 CMOS 칩에 집적시켜 측정장비 없이도 자체적으로 감지결과를 출력할 수 있는 센서 칩의 기본적인 플랫폼을 설계 제작한 결과를 보고한다. 센서 소자로는 알루미늄 패드 사이에 연결된 CNT network을 사용하였으며 생화학적 반응에 의하여 전기전도도가 변화하는 것을 감지한다. 표준 CMOS 공정의 감지회로는 CNT network의 저항 값 변동에 의해 ring oscillator의 주파수가 변동하는 것을 감지하는 방식을 사용한다. 제작된 CMOS 센서 칩을 활용하여 이를 대표적인 생화학물질인 glutamate을 검출하는데 실험적으로 적용하여 농도에 따른 출력결과 값을 얻는데 성공한다. 본 연구를 통하여 본 센서 칩 플랫폼을 이용한 상용화의 가능성을 확인하며, 추가적으로 개발이 필요한 기술에 대해 파악한다.

• International Journal of Aeronautical and Space Sciences
• /
• 제17권1호
• /
• pp.37-44
• /
• 2016

Optical fiber temperature sensing systems have incomparable advantages over traditional electrical-cable-based monitoring systems. However, the fiber optic interrogators and sensors have often been rejected as a temperature monitoring technology in real-world industrial applications because of high cost and over-specification. This study proposes a multiplexed fiber optic temperature monitoring sensor system using an economical Optical Time-Domain Reflectometer (OTDR) and Hard-Polymer-Clad Fiber (HPCF). HPCF is a special optical fiber in which a hard polymer cladding made of fluoroacrylate acts as a protective coating for an inner silica core. An OTDR is an optical loss measurement system that provides optical loss and event distance measurement in real time. A temperature sensor array with the five sensor nodes at 10-m interval was economically and quickly made by locally stripping HPCF clad through photo-thermal and photo-chemical processes using a continuous/pulse hybrid-mode laser. The exposed cores created backscattering signals in the OTDR attenuation trace. It was demonstrated that the backscattering peaks were independently sensitive to temperature variation. Since the 1.5-mm-long exposed core showed a 5-m-wide backscattering peak, the OTDR with a spatial resolution of 40 mm allows for making a sensor node at every 5 m for independent multiplexing. The performance of the sensor node included an operating range of up to $120^{\circ}C$, a resolution of $0.59^{\circ}C$, and a temperature sensitivity of $-0.00967dB/^{\circ}C$. Temperature monitoring errors in the environment tests stood at $0.76^{\circ}C$ and $0.36^{\circ}C$ under the temperature variation of the unstrapped fiber region and the vibration of the sensor node. The small sensitivities to the environment and the economic feasibility of the highly multiplexed HPCF temperature monitoring sensor system will be important advantages for use as system-integrated temperature sensors.

• 센서학회지
• /
• 제27권5호
• /
• pp.311-316
• /
• 2018

An antenna-coupled bolometer-type terahertz sensor was designed, fabricated, evaluated, and utilized to obtain terahertz transmission images. The sensor consists of a thin film bowtie antenna that resonates accordingly in response to an incident terahertz beam, a heater that converts the applied current in the antenna into heat, and a microbolometer that converts the rise in temperature into a change in resistance. The device is fabricated by a bulk micromachining process on a 4-inch silicon wafer. The fabricated sensor chip has a size of $2{\times}2mm$ and an active area of $0.1{\times}0.1mm^2$. The temperature coefficient of resistance (TCR) of the bolometer film (VOx) is 2.0%, which is acceptable for bolometer applications. The output sensor signal is proportional to the power of the incident terahertz beam. Transmission images were obtained with a 2-axis scanning imaging system that contained the sensor. The small active area of the sensor will enable the development of highly sensitive focal plane array sensors in terahertz imaging cameras in the future.

• 조명전기설비학회논문지
• /
• 제27권8호
• /
• pp.75-82
• /
• 2013

We propose a fiber grating sensor system for condition monitoring of large scale wind turbine blades. For the feasibility test of the proposed sensor system, a down-scaled wind turbine has been constructed and experimented. Fiber grating sensors were attached on a blade surface for distributed strain and temperature measurements. An optical rotary joint was used to transmit optical signals between the FBG sensor array and the signal processing unit. Instead of broadband light source, we used a wavelength-swept fiber laser to obtain high output power density. A spectrometer demodulation is used to alleviate the nonlinear wavelength tuning problem of the laser source. With the proposed sensor system we could measure dynamic strain and temperature profiles at multi-positions of rotating wind turbine blades.

• 센서학회지
• /
• 제27권5호
• /
• pp.300-305
• /
• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Journal of information and communication convergence engineering
• /
• 제7권3호
• /
• pp.281-285
• /
• 2009

Mobile robot has various sensors for describing the external world. The ultrasonic sensor widely applied to the most mobile robot to detect the obstacle and environment owing to low cost, its easy to use. However, ultrasonic sensor has major problems: the uncertainty information of sensor, false readings caused by specular reflection, multi path effect, low angular resolution and sensitivity to changes in temperature and humidity. This paper describes a sensor system for map building of mobile robot. It was made of low cost PSD (Position Sensitive Detector) sensor array and high speed RISC MPU. PSD sensor is cost effective and light weighting but its output signal has many noises. We propose heuristic S/W filter to effectively remove these noises. The developed map building sensor system was equipped on a mobile robot and was compared with ultrasonic sensor through field test.

• 한국정보통신학회논문지
• /
• 제4권3호
• /
• pp.705-711
• /
• 2000

반도체 제조공정과 미세가공 기술을 이용하여 $300^{\circ}C$의 동작온도에서 약 60 mW의 전력소모를 갖는 산화물 반도체 박막 가스센서 어레이를 제조하였다. 멤브레인의 우수한 열적 절연은 $0.1\mum\; 두께의\; Si_3N_4와\; 1\mum$ 두께의 PSG의 이중 층에 의한 것으로, 각각 LPCVD(저압화학 기상증착)와 APCVD(대기압 화학 기상증착)에 의해 제조되었다. 센서 어레이의 4가지 산화물 반도체 박막 감지물질로는 1 wt.% Pd가 도핑된 $SnO_2,\; 6 we.% A1_2O_3$가 도핑된 ZnO, $WO_3$, ZnO를 이용하였으며,4가지 감지물질의 베이스라인 저항은 $300^{\circ}C$ 에서 3일 동안의 에이징을 거친 후 안정됨을 보였다. 제조된 초소형 산화물 반도체 박막 가스센서 어레이는 여러 가지 가스의 노출 시 유용한 저항 변화를 나타내었으며 감도는 감지 물질에 강하게 의존함을 알 수 있었다.

• 한국군사과학기술학회지
• /
• 제7권2호
• /
• pp.81-87
• /
• 2004

Semiconductor thick film gas sensors based on tin oxide are fabricated and their gas response characteristics are examined for four simulant gases of chemical warfare agent (CWA)s. The sensing materials are prepared in three different sets. 1) The Pt or Pd $(1,\;2,\;3\;wt.\%)$ as catalyst is impregnated in the base material of $SnO_2$ by impregnation method.2) $Al_2O_3\;(0,\;4,\;12,\;20\;wt.\%),\;In_2O_3\;(1,\;2,\;3\;wt.\%),\;WO_3\;(1,\;2,\;3\;wt.\%),\;TiO_2\;(3,\;5,\;10\;wt.\%)$ or $SiO_2\;(3,\;5,\;10\;wt.\%)$ is added to $SnO_2$ by physical ball milling process. 3) ZnO $(1,\;2,\;3,\;4,\;5\;wt.\%)$ or $ZrO_2\;(1,\;3,\;5\;wt.\%)$ is added to $SnO_2$ by co-precipitation method. Surface morphology, particle size, and specific surface area of fabricated sensing films are performed by the SEM, XRD and BET respectively. Response characteristics are examined for simulant gases with temperature in the range 200 to $400^{\circ}C$, with different gas concentrations. These sensors have high sensitivities more than $50\%$ at 500ppb concentration for test gases and also have shown good repetition tests. Four sensing materials are selected with good sensitivity and stability and are fabricated as a sensor array A sensor array Identities among the four simulant gases through the principal component analysis (PCA). High sensitivity is acquired by using the semiconductor thick film gas sensors and four CWA gases are classified by using a sensor array through PCA.

• 한국정보통신학회논문지
• /
• 제6권2호
• /
• pp.315-322
• /
• 2002

반도체 제조공정과 미세가공 기술을 이용하여 30$0^{\circ}C$의 동작온도에서 약 60㎽의 전력소모를 갖는 산화물 반도체 박막 가스센서 어레이를 제조하였다. 멤브레인의 우수한 열적 절연은 0.1$\mu\textrm{m}$ 두께의 Si$_3$N$_4$와 1$\mu\textrm{m}$ 두께의 PSG의 이중 층에 의한 것으로, 각각 LPCVD(저압화학 기상증착)와 APCVD(대기압 화학 기상증착)에 의해 제조되었다. 센서 어레이의 4가지 산화물 반도체 박막 감지물질로는 1wt.%Pd가 도핑된 SnO$_2$, 6wt.% $Al_2$O$_3$가 도핑된 ZnO, WO$_3$, ZnO를 이용하였으며, 제조된 초소형 산화물 반도체 박막 가스센서 어레이는 여러 가지 가스의 노출시 유용한 저항 변화를 나타내었고 감도는 감지 물질에 강하게 의존함을 알 수 있었다. 센서 소자의 공정 수율을 증진시키기 위하여 히터 부위를 함몰하는 공정 방법을 취하였으며, 그 결과 월등한 수율 개선을 도모할 수 있었다.