• Transactions on Electrical and Electronic Materials
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• 제9권4호
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• pp.143-146
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• 2008

In this study the thermal impact characteristics by forest fire are extensively investigated using temperature controlled ovens. The test conditions for thermal impact damage are simulated according to the characteristics of natural forest fire. The test pieces are suspension porcelain insulators made by KRI in 2005 for transmission lines. In the thermal impact cycle tests with $300\;^{\circ}C$ thermal impact gradient (-70 to $230\;^{\circ}C$), cycling in 10 minute periods, no critical failures occurred in the test samples even with long cycle times. But in tests with thermal impact gradient from room temperature to $200-600\;^{\circ}C$, cycling in 10 to 30 minute periods, there were critical failures of the porcelain insulators according to the thermal impact gradient and quenching method. In the case of thermal impact by forest fire, it was found of that duration time is more important than the cycling time, and the initiation temperature of porcelain insulator failures is about $300\;^{\circ}C$, in the case of water quenching, many cracks and fracture of the porcelain occurred. It was found that the thermal impact failure is closely related to the displacement in the cement by thermal stress as confirmed by simulation. It was estimated that the initiation displacement by the thermal impact of $300\;^{\circ}C$ is about 0.1 %. Above 1% displacement, it is expected that the most porcelain insulators would fail.

• 대한기계학회논문집A
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• 제35권7호
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• pp.799-804
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• 2011

본 논문에서는 칩저항을 실장하는 솔더에 대한 온도사이클 시험을 수행하고, 그 결과로부터 고장 예지 실현을 위한 열하중에서의 솔더실장의 고장메커니즘을 연구하였다. 시험 중 솔더의 고장을 모니터링하기 위하여 실장된 칩저항 양단간의 저항 변화를 데이터 측정기로 실시간 관찰하였다. 관찰 데이터로부터 솔더의 크랙 진전 중과 크랙 진전 완료 시점의 고장 메커니즘을 제시하였다. 제시된 고장 메커니즘을 유한요소법으로 검증하여 솔더의 크랙이 진전 중에는 저온조건에서 크랙이 열리고 저항이 증가하며, 크랙의 진전이 완료된 후에는 고온조건에서 크랙이 열리고 저항이 증가하는 조건으로 바뀜을 보였다. 이런 결과에 기반하여 온도 사이클에서 저항측정을 통해 칩저항 실장 솔더의 고장예지가 가능함을 제시하였다.

• 패션비즈니스
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• 제26권6호
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• pp.105-115
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• 2022

Wearing a mask is still advised since COVID-19 continues to spread. However, masks may also irritate the skin and cause mask acne, often known as "maskne", which is a type of acne mechanica caused by friction between the skin and clothing. Therefore, there is a need to develop an effective maskne cosmetic. In this study, we made the maskne cosmetics containing humulus lupulus extract and copper tripeptide-1 and investigated its stability and safety. To measure stability, a centrifugation test and heat-cool cycling were done, and changes in viscosity and pH were measured for 8 weeks. The Cumulative Irritation Test (CIT, WKIRB-202111-HR-096) was performed and positive reactions were determined by the ICDRG criteria. The results indicated that the samples were stable after centrifugation, temperature cycling, viscosity, and pH tests. In addition, cosmetic safety test results revealed that maskne cosmetics containing humulus lupulus extract and copper tripeptide-1 did not cause any skin responses. These findings indicate that prepared maskne cosmetics' stability and safety were comparable to those of currently available commercial cosmetics.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.115-118
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• 2003

This research aims to measure mechanical tensile properties of CFRP composites for cryogenic tank material. Through the cryogenic chamber, tensile tests are peformed under cryogenic temperature for graphite/epoxy fabric specimen aged at $-150^{\circ}C$ for 30hrs with load and graphite/epoxy unidirectional specimen 3-cycled from RT to $-100^{\circ}C$ with load. For graphite/epoxy fabric specimen, tensile modulus showed to increase after aging at cryogenic temperature(CT) while to decrease after aging at room temperature(RT) and tensile strength is more decreased after CT-aged than at RT-aged. For graphite/epoxy unidirectional specimen, tensile modulus was almost not changed after 3-cycling but strength showed the trend of decrease as increase the number of cycling.

• 대한금속재료학회지
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• 제49권12호
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• pp.945-949
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• 2011

The cycling characteristics of $MgH_2$ made by hydriding chemical vapor deposition method have been investigated. The particle size of $MgH_2$ made by HCVD was about $1{\mu}m$. The cycling experiment was performed by measuring hydrogen quantity absorbed at 673 K and under 35 atm of hydrogen pressure for 30 min. Up to 3 cycles the hydrogen storage capacity increased, but from 4 to 6 cycles the hydrogen storage capacity decreased rapidly. During this cycling test the particle size increased gradually from $1{\mu}m$ to $6{\mu}m$. This increase was due to sintering by the high reaction temperature and the heat of reaction during hydrogen absorption. From 7 to 30 cycles, the hydrogen storage capacity was maintained at 5.8 wt%. Even after 30 cycles, the plateau pressure was constant.

• 한국안전학회지
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• 제4권1호
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• pp.25-39
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• 1989

Cyclic temperature creep tests were carried out an AS 7075 alloy specimens were subjected to a constant load and stepwise temperature cycles in which temperature was fluctuated between 30$0^{\circ}C$ and 25$0^{\circ}C$ with three different cycle ratios. The highest frequency of cycling was 1 cycle per 10 hr and the lowest one was 1 cycle per 12 hr. From the creep experimental results with the above conditions the creep strain under cyclic temperature can be predicted easily by introd ucing the equivalent steady temperature because defined by Eq.(16), but the rupture life is 1.1 time than those of constant temperature because of effect of temperature history at tertiary creep range. Besides thlis result, the results of the creep test under cyclic temperature conditions are respectively compayiea with calculated rupture lives using the life fraction law and Eq.(18). The agreement between the obseried rupture times and calculated ones is fairly good. So creep rupture lives can be respectively predicted using life fraction law and Eq.(18).

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• 전기학회논문지
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• 제57권7호
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• pp.1229-1234
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• 2008

In this work, ultra high-voltage (17 - 50 kV AC), reliable 80 pF mica capacitors for partial discharge system application were investigated. Mica was used as the dielectric of the capacitors. Using the conservative design rule, over 3 individual $50\;{\mu}m$ thick mica sheets with a size of 30mm{\times}35mm were used with lead foils to form a parallel capacitor element and 20 mica sheets were interleaved with lead foils to form a series stack of parallel capacitor element to meet the requirements of the capacitors. The dimensions of the fabricated 80 pF capacitors for 17 kV AC and 50 kV AC were $90\;mm{\times}90\;mm$ and $95\;mm{\times}180\;mm$, respectively. The high-frequency characteristics of the capacitance (C) and dissipation factor (D) of the developed capacitors were measured using a capacitance meter. The developed capacitors exhibited C of 79.5 - 87.5 pF, had D of 0.001% over the frequency ranges of 150 kHz to 50 MHz, had a self-resonant frequency of 65 MHz, and showed results comparable to those measured for the capacitors prepared recently by $Adwel^{Tm}$. The developed capacitors also showed excellent characteristics for thermal shock test and temperature cycling test.

• 마이크로전자및패키징학회지
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• 제17권3호
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• pp.27-32
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• 2010

Cu pillar 범프와 Sn 패드로 구성된 플립칩 접속부를 형성한 후, Sn 패드의 높이에 따른 Cu pillar 플립칩 접속부의 열 싸이클링 및 고온유지 신뢰성을 분석하였다. Cu pillar 플립칩 접속부를 구성하는 Sn 패드의 높이가 5 ${\mu}m$에서 30 ${\mu}m$로 증가함에 따라 접속저항이 31.7 $m{\Omega}$에서 13.8 $m{\Omega}$로 감소하였다. $-45^{\circ}C{\sim}125^{\circ}C$ 범위의 열 싸이클을 1000회 인가한 후에도 Cu pillar 플립칩 접속부의 접속저항의 증가가 12% 이하로 유지되었으며, 열 싸이클링 시험전과 거의 유사한 파괴 전단력을 나타내었다. $125^{\circ}C$에서 1000 시간 유지시에도 Cu pillar 플립칩 접속부의 접속저항의 증가가 20% 이하로 유지되었다.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.37-45
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• 2008

본 논문에서는 유기 기판 위에 $100{\mu}m$ 피치를 갖는 플립칩 구조인 Cu(60 um)/SnAg(20 um) 더블 범프 플립칩 어셈블리를 구현하여 이의 리플로우, 고온 유지 신뢰성, 열주기 신뢰성, Electromigration 신뢰성을 평가하였다. 먼저, 리플로우의 경우 횟수와 온도에 상관없이 범프 접속 저항의 변화는 거의 나타나지 않음을 알 수 있었다. 125도 고온 유지 시험에서는 2000시간까지 접속 저항 변화가 관찰되지 않았던 반면, 150도에서는 Kirkendall void의 형성으로 인한 접속 저항의 증가가 관찰되었다 또한 Electromigration 시험에서는 600시간까지 불량이 발생하지 않았는데 이는 Al금속 배선에서 유발되는 높은 전류 밀도가 Cu 칼럼의 높은 두께로 인해 솔더 영역에서는 낮아지기 때문으로 해석되었다. 열주기 시험의 경우, 400 cycle 이후부터 접속 저항의 증가가 발견되었으며, 이는 열주기 시험 동안 실리콘 칩과 Cu 칼럼 사이에 작용하는 압축 변형에 의해 그 사이에 있는 Al 및 Ti 층이 바깥쪽으로 밀려나감으로 인해 발생하는 것으로 확인되었다.