• Journal of Korean Society for Quality Management
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• v.51 no.4
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• pp.735-749
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• 2023

Purpose: The purpose of this study is to derive solutions and prevent similar cases from occurring by analyzing the causes of cracks found in temperature cycling tests of rocket motor. Methods: By combining the results of the current state confirmation test, non-destructive test, domestic and foreign rocket motor comparison test, cutting test, and adhesion test according to the number of times to apply mold release agent, a Cause and Effect Diagram analysis was performed to derive the cause of cracks. Results: Through this study, 26 factors that could cause cracking in rocket motors during temperature cycling tests were identified. Through various additional test results, a total of five causes were identified, including chemical and structural design of the joint between the propellant and stress relief insert, omission of procedure in the manufacturing procedures, natural aging due to temperature, and load accumulation due to temperature changes. The fundamental cause was confirmed to be insufficient consideration of the release properties of the propellant and stress relief insert. Conclusion: During the design process, it was confirmed that this could be solved by structurally or chemically designing the insert so that it does not combine with the propellant, or by applying a mold release agent during the manufacturing process.

• The Bulletin of The Korean Astronomical Society
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• v.36 no.2
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• pp.156-156
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• 2011

VPH (Volume Phase Hologram) grating is one of the transmission gratings and is known as its remarkable efficiency (>90%). It has two different densities of gelatins causing interference patterns. The VPH grating is favored in many astronomical instruments these days and also IGRINS, which is up coming near infrared high-resolution spectroscope expected to see the first light next year, uses the VPH grating as its cross-disperser. The infrared astronomical instruments operate at cryogenic temperature (~100K) in order to cut down thermal noise and the optical components of IGIRNS will be operated at 130K. The VPH grating is sandwiched in between fused silica or glass and glued together using optical adhesive. IGRINS is expected to go through 50 times of thermal cycling in 10 years including the performance test and this research is to check whether the physical characteristic such as the adhesion or dichromatic gelatin does not break and change from the several cryogenic thermal cycling. The two identical test gratings provided from Kaiser Optical System, Inc. are used in this test. One VPH grating is cooled down to 100K for 2 hours with maximum dT/dt = 5 and warmed up to the room temperature and another grating is kept stored in the room temperature and used as a control sample. In order to check the change, we inspected the grating with eyes and checked its efficiency and transmission at the room temperature every 10 cycling. From the 40 times of cryogenic temperature cool down cycling, the VPH grating showed no signs of change within the error compared to the control sample. We concluded the VPH grating is durable through several cryogenic thermal cycling.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.351-354
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• 2000

AC impedance of LiM $n_2$ $O_4$ and LiM $g_{0.1}$M $n_{1.9}$ $O_4$ samples have been studied at various temperature with charge-discharge test. AC impedance of LiM $n_2$ $O_4$ measured at -2$0^{\circ}C$, room temperature and 5$0^{\circ}C$ revealed that initial impedance before charge-discharge test was gradually decreased and become small by becoming law temperature. It indicates that the Li ion diffusion and the transfer resistance of the cathode are related to the temperature of cycling. Impedance at high temperature was suddenly increased because Mn dissolution and decomposition of electrolyte had been increased during cycling, compared to impedance at low temperature. Therefore, charge-discharge capacity was suddenly decreased at high but was slowly at low. In LiM $g_{0.1}$M $n_{1.9}$ $O_4$, impedance and capacity were stability at room temperature than there at 5$0^{\circ}C$, too. Initial impedance at 5$0^{\circ}C$ before charge-discharge test was small and impedance was suddenly increased during cycling than that at room temperature.ure.ure.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.43-49
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• 2016

Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.12
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• pp.1856-1863
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• 2004

In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

• Journal of the Korean Ceramic Society
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• v.54 no.4
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• pp.314-322
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• 2017

This study investigates changes in the mechanical behavior, such as changes in indentation load-displacement curve, wear resistance and contact fatigue resistance of thermal barrier coatings (TBCs) by thermal cycling test and thermal shock test. Relatively dense and porous TBCs on nickel-based bondcoat/superalloy are prepared; the highest temperature applied during thermal durability test is $1350^{\circ}C$. The results indicate that the porous TBCs have relatively longer lifetime during thermal cycling and thermal shock tests, while denser TBCs have relatively higher wear and contact fatigue resistance. The mechanical behavior is influenced by sintering of the TBCs by exposure to high temperature during tests.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.5
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• pp.443-449
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• 2007

The structural and thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ electrode during cycling process was studied. The sample was prepared by simple combustion method. Although there were irreversible changes on the initial cycle, O3 stacking for $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ structure was retained during the first and subsequent cycling process. Impedance of the test cell was decreased after the first charge-discharge process, which would be of benefit to intercalation and deintercalation of lithium ion on subsequent cycling. As expected, cycling test for 75 times increased impedance of the cell a little, instead, thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ was improved. Moreover, based on DSC analysis, the initial exothermic peak was shifted to high temperature range and the amount of heat was also decreased after cycling test, which displayed that thermal stability was not deteriorated during cycling.

• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.25-30
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• 2011

In this paper, we analyzed the electrical characteristics with Micro-cracks in Photovoltaic module. Micro cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. And The solar cells have to with stand the stress under out door operation in the finished module. Here the mechanical stress is induced by temperature changes and mechanical loads from wind and snow. So, we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because micro-cracks accelerated aging by thermal cycling test, according to IEC61215. Before every test, we checked output and EL image of PV module. As the result of first step, we detected little power loss(0.9%). But after thermal cycling test increased power loss about 3.2%.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.38-42
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• 2002

An apparatus was developed to repetitively apply a $-196^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen ($LN_2$) 400 times. Ply-by-ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at $120^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies fellowed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5%.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2003.05a
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• pp.151-155
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• 2003

An apparatus was developed to repetitively apply a -196 $^{\circ}C$ thermal load to coupon-sized mechanical test specimens. Using this device, IM7/5250-4 (carbon / bismaleimide) cross-ply and quasi-isotropic laminates were submerged in liquid nitrogen (L$N_2$) 400 times. Ply-by-Ply micro-crack density, laminate modulus, and laminate strength were measured as a function of thermal cycles. Quasi-isotropic samples of IM7/977-3 (carbon / epoxy) composite were also manually cycled between liquid nitrogen and an oven set at 120 $^{\circ}C$ for 130 cycles to determine whether including elevated temperature in the thermal cycle significantly altered the degree or location of micro-cracking. In response to thermal cycling, both materials micro-cracked extensively in the surface plies followed by sparse cracking of the inner plies. The tensile modulus of the IM7/5250-4 specimens was unaffected by thermal cycling, but the tensile strength of two of the lay-ups decreased by as much as 8.5 %.