• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.5
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• pp.669-683
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• 1999

Heat dissipation in the domestic switching room has been gradually increased. Therefore, numerical study on the cooling characteristics of the telecommunication system in a switching room for three kinds of the air supply and return flow system was investigated to develop effective flow system. As a result, the cooling performance of the under floor air supply and overhead return flow system was the best.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1385-1390
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• 2009

In this study the purpose is development of passive cooling system for telecommunication cabinet used by latent heat material. This cooling system is not required for electronic power. It was tested for the performance of the telecommunication combined latent heat material with $48^{\circ}C$ of phase changed temperature and heat pipe. At $45^{\circ}C$ of outside temperature, when heater power was 1,000 W and 1,500 W, the inside temperature of the cabinet was $55^{\circ}C$ and $62^{\circ}C$. This system was showed better performance than the other systems.

• Proceedings of the SAREK Conference
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• 2005.11a
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• pp.323-328
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• 2005

The objective of this study is to analyze the cooling performance of an air- cooling system for telecommunication equipment. Temperature variation and capacity were measured in an actual unit for telecommunication equipment. In addition, the cooling performance was measured by installing a silicon rubber heater as a heat source in a cabinet. The standard thermal load for telecommunication equipment was approximately 293 W, and the maximum temperature of the heated surface was $64.5^{\circ}C$. The average and maximum temperatures of the heated surface were proportional to the inlet air temperature. When the heat load increased from 293 W to 400 W, the maximum temperature of the heated surface was higher than $64.5^{\circ}C$ even though the inlet air temperature decreased from 25 to $11^{\circ}C$.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.489-494
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• 2006

Electronic and telecommunication industries are constantly trying to develop compact components having high power density. Therefore, a proper heat dissipation method is very important to allow reliable operation of the telecommunication equipment. In this study, a hybrid refrigeration system for a telecommunication equipment room was designed to save energy consumption and improve reliability of the compressor In addition, the performance of the hybrid refrigeration system was measured with a variation of outdoor load. The designed hybrid refrigeration system for the telecommunication equipment shelter saved the energy approximately 50%e at the mode switch temperature of $8.3^{\circ}C$.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.10
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• pp.710-717
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• 2007

Electric and telecommunication industries are constantly striving towards miniaturization of electronic devices. Miniaturization of chips creates extra space on PCBs that can be populated with additional components, which decreases the heat transfer surface area and generates very high heat flux. Even though an air-cooling technology for telecommunication equipment has been developed in accordance with rapid growth in electrical industry, it is confronted with the limitation of cooling capacity due to the rapid increase of heat density. In this study, liquid-cooling heat exchangers with MPCM slurries were designed and tested by varying geometry and operating conditions. The liquid-cooling heat exchangers with 4-paths showed higher cooling performance than the others. The cooling performance of liquid cooling heat exchanger with MPCM slurries was more enhanced than that of the air cooling system. It's performance was also slightly superior to that of the water cooling system at the inlet temperature of $19^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.7
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• pp.2356-2366
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• 1996

High-power electronic chips have been advanced to such an extent that the heat dissipation capability of a system design has become one of the primary limiting factors. Therefore, thermal design must be considered in the early stage of the electronic system development. In present paper, the results of an experimental study on the forced convection cooling are presented to evaluate cooling performance of an electronic cabinet which in generally used for telecommunication system. Temperatures and thermal resistances are applied to compare the heat transfer characteristics for various locations of a fan unit as well as various configuration of non-uniform powering modules. As a result, the optimal configuration of a fan unit and powering configuration is suggested for the effective thermal design of telecommunication system.

• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.31 no.4
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• pp.367-375
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• 2007

The purpose of this study is to investigate the cooling performance of Heat Pipe Heat Exchanger(HPHE) for an electronic telecommunication system by adequate convection condition. Heat generation rates of electronic components, the temperature distributions of HPHE and surrounding air are analyzed experimentally and numerically. In order to perform the heat transfer analysis for the thermal design of telecommunication system, a program is developed. The program is useful to a user who is not familiar with an electronic telecommunication system. The simulation results showed that the HPHE were able to achieve a cooling capacity of up to 230W at the maximum temperature difference of $17.4^{\circ}C$. To verify the results from the numerical simulation, an experiment was conducted under the same condition as the numerical simulation, and their results were compared.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.11
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• pp.874-880
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• 2006

The power density and heat dissipation rate per unit area of the telecommunication equipment have been increased with the technology development in the footprint of telecommunication hardware. A proper heat dissipation method from the PCB module is very important to allow reliable operation of its electronic component. In this study, a hybrid air-conditioner for the telecommunication equipment room was designed to save energy and obtain system reliability. For high outdoor temperatures, the hybrid system operates in the vapor compression cycle, while, for low outdoor temperatures, the hybrid system works in the secondary fluid cooling cycle with no operation of the compressor. The performance of the hybrid air-conditioner was measured by varying outdoor and indoor temperatures. The hybrid air-conditioner yielded 50% energy saving compared with the conventional refrigeration system when the mode switch temperature was $8.3^{\circ}C$.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1499-1505
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• 2003

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices. So, in this paper, characteristics on oscillating heat pipe according to operating conditions(environment temperature, charging ratio of working fluid, inclination) based on experimental study was investigated. From the experimental results, $25^{\circ}C$environment temperature), R-141b(working fluid)40%(charging ratio) was best performace at others of inclination angle and The top heating mode of OCHP performed 80% efficiency of the bottom heating mode.