• 제목/요약/키워드: Technology trend

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A Scaling Trend of Variation-Tolerant SRAM Circuit Design in Deeper Nanometer Era

  • Yamauchi, Hiroyuki
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제9권1호
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    • pp.37-50
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    • 2009
  • Evaluation results about area scaling capabilities of various SRAM margin-assist techniques for random $V_T$ variability issues are described. Various efforts to address these issues by not only the cell topology changes from 6T to 8T and 10T but also incorporating multiple voltage-supply for the cell terminal biasing and timing sequence controls of read and write are comprehensively compared in light of an impact on the required area overhead for each design solution given by ever increasing $V_T$ variation (${\sigma}_{VT}$). Two different scenarios which hinge upon the EOT (Effective Oxide Thickness) scaling trend of being pessimistic and optimistic, are assumed to compare the area scaling trends among various SRAM solutions for 32 nm process node and beyond. As a result, it has been shown that 6T SRAM will be allowed long reign even in 15 nm node if ${\sigma}_{VT}$ can be suppressed to < 70 mV thanks to EOT scaling for LSTP (Low Standby Power) process.

천연 식품첨가물 연구개발 동향분석 (Analysis of research trend in natural food additives)

  • 이현희;정재연;박정민
    • 식품과학과 산업
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    • 제49권4호
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    • pp.82-93
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    • 2016
  • Although the development of food technology is relatively fast, it's application is very broad. So, it is necessary that quantitative analysis method can be introduced in analysing of research trends and implication of research themes. Most countries do not classify in food additives as synthesis or natural. However, the use of natural food additives should be recommended by considering about health safety. In this regard, quantitative analysis based on bibliographic information of patents and papers is vital to analyse the trend of research on natural food additives. The data regarding with natural food additives was assigned patents and published papers in the world from 1996 to March 2016 and Thomson Innovation, analysis program was provided by Thomson reuters.

Wire Bonding Technology for Recent Trend Packaging

  • Chung, J.Y.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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    • pp.47-75
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    • 2000
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Recent Trend in Japanese Packaging Technology

  • Denda, Sei-ichi
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2000년도 2nd Korea-Japan Advanceed Semiconductor Packaging Technology Seminar
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    • pp.1-6
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    • 2000
  • PDF