• 한국산업융합학회 논문집
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• 제27권3호
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• pp.619-627
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• 2024

By analyzing the structure of the currently used Lead Tab tape structure, the outermost layer, low-temperature fusion functionalized olefin, was composed of pp base. To determine whether this could be used as the outermost layer of tab tape, the adhesive strength to metal foils such as copper and aluminum was measured and the adhesive strength was compared with commercially available functionalized olefin. When chlorine was grafted onto PP among the PP used in the composition, the average adhesive strength was similar to that of commercially available LT200T and superior to RE140R and LE320V. The maximum adhesive strength exceeded that of LE200T. When it comes to solvents, xylene has been shown to be better than any other. Physical methods such as substitution of other monomers, switching of additives or let-down hardly changed the adhesion of grafted PP, and the selection of PP is an important factor in preparing functional polymers.

• 한국표면공학회지
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• 제27권3호
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• pp.158-165
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• 1994

Cu-Cr alloy thin film requires good quality of etching be used for TAB technology. The etched cross sec-tion was clean enough when the etching was performed in 0.1M $FeCl_3$ solution at $50^{\circ}C$. The etching rate was increased with the amount of $KMnO_4$. For enhanced profile of cross section and rate, the spray etchning was found to be superior compared to the immersion etching. A series of experiments were performed to improve the uniformity of the current distribution in electrodeposition onto the substrate with lithographic patterns. Copper was electrodeposited from quiescent-solution, paddle-agitated-solution, and air-bubbled-solution to in-vestigate the effect of the fluid flow. The thickness profile of the specimen measured by profilmetry has the non uniformity at feature scale in quiescent-solution, because of the longitudinal vortex roll caused by the natural convection. However, uniform thickness profile was achieved in paddle-agitated or air bubbled solu-tion.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 춘계학술대회 논문집
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• pp.31-31
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• 2015

본 연구는, TAB(Tape Automated Bonding)접속이나 Flip Chip 접속에 의한 패캐징을 실현시키기 위해, 실리콘 웨이퍼 표면에 구리 필러 및 주석 합금을 전기 도금법으로 형성하는 전기 접점용 범프에 관한 것이다. 본 연구에서는, 균일 범프 두께, 범프 표면의 균일화, 범프 내의 보이드 발생 문제 해결, 균일한 합금 조성 및 도금 속도의 고속화를 위해, Cu 도금액 및 Sn-Ag 도금액의 첨가제에 의한 표면 형상의 제어를 중심으로 그 성능에 대해 보고한다.

• 한국표면공학회지
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• 제26권3호
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• pp.149-157
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• 1993

In the study of TAB(Tape Automated Bonding)technologies, Cu-Cr sputtered seed layer has been used to improve the adhesion between Polyimide and Cu film and electrical properties. But the Cu electrodeposit on Cu-Cr film had poor adhesion or powder-like form due to the surface Cr oxides on the Cu-Cr film. By means of activating the Cu-Cr film with the oxalic acid and phosphoric acid, the Cu film with the improved adhesion could be coated on the Cu-Cr sputtered film in CuSO4 solution. The etching rate was compared with increasing the Cr content of the sputtered Cu-Cr film, and anodic polarization curve in FeCl3 solution was investigated. With increasing the Cr content, the etching rate was reduced. The clean etching cross section could be obtained with increasing the concentration of FeCl3 solution. But above the 13 w/o Cr content, Cu-Cr sputtered film could not bed etched cleanly only with FeCl3 solution and additives were needed.