Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 27 Issue 3
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- Pages.158-165
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- 1994
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
Cu Electroplating on Patterned Substrate and Etching Properties of Cu-Cr Film for Manufacturing TAB Tape
TAB 테이프 제조를 위한 구리 도금 및 에칭에 관한 연구
- Kim, N. S. (Dept. of Metall. Eng., Seoul National University) ;
- Kang, T. (Dept. of Metall. Eng., Seoul National University) ;
- Yun, I. P. (Dept. of Metall. Eng., Yonsei University) ;
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Park, Y. S.
(Dept. of Metall. Eng., Yonsei University)
- Published : 1994.06.01
Abstract
Cu-Cr alloy thin film requires good quality of etching be used for TAB technology. The etched cross sec-tion was clean enough when the etching was performed in 0.1M
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