• 제목/요약/키워드: TSV

검색결과 220건 처리시간 0.022초

실리콘-화합물 융합 반도체 소자 기술동향 (Technical Trend of Fusion Semiconductor Devices Composed of Silicon and Compound Materials)

  • 이상흥;장성재;임종원;백용순
    • 전자통신동향분석
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    • 제32권6호
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    • pp.8-16
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    • 2017
  • In this paper, we review studies attempting to triumph over the limitation of Si-based semiconductor technologies through a heterogeneous integration of high mobility compound semiconductors on a Si substrate, and the co-integration of electronic and/or optical devices. Many studies have been conducted on the heterogeneous integration of various materials to overcome the Si semiconductor performance and obtain multi-purpose functional devices. On the other hand, many research groups have invented device fusion technologies of electrical and optical devices on a Si substrate. They have co-integrated Si-based CMOS and InGaAs-based optical devices, and Ge-based electrical and optical devices. In addition, chip and wafer bonding techniques through TSV and TOV have been introduced for the co-integration of electrical and optical devices. Such intensive studies will continue to overcome the device-scaling limitation and short-channel effects of a MOS transistor that Si devices have faced using a heterogeneous integration of Si and a high mobility compound semiconductor on the same chip and/or wafer.

Atmospheric Plasma Treatment on Copper for Organic Cleaning in Copper Electroplating Process: Towards Microelectronic Packaging Industry

  • Hong, Sei-Hwan;Choi, Woo-Young;Park, Jae-Hyun;Hong, Sang-Jeen
    • Transactions on Electrical and Electronic Materials
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    • 제10권3호
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    • pp.71-74
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    • 2009
  • Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

겨울철 온도 및 습도변화에 따른 온열쾌적감에 관한 연구 (A Study of Thermal Comfort by Winter Temperature Humidity Change)

  • 김세환;이성;김동규
    • 설비공학논문집
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    • 제19권11호
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    • pp.803-809
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    • 2007
  • To those who spend most time within a room, comfortable indoor environment is a very critical element to job performance and health. The comfort technology, which is for enhancing comfort in human living, relates with various factors to ensure human activities efficient, comfortable, safe and satisfactory. Experiments were performed in environmental chamber. Experimental conditions were combinations from three temperatures of 18, 22 and 26C, and two relative humidity levels of 45 and 60%. Air-flow was controlled to 0.1m/s through the experiment. Four male and four female university students participated in the experiments. They had normal blood pressure and their body temperature was under $37^{\circ}C$. From the experiments for evaluating thermal sensation to the air-heating conditions, relationships among TSV, CSV, $SET^*$, PMV were analyzed. Results can be summarized as followings; Thermal neutrality $SET^*$ of man and female was $24.8^{\circ}C$. In air-heating condition, $SET^*$ values for thermal comfort zone were $23.0{\sim}26.5^{\circ}C$. These values were higher than the values from ASHRAE.

Characteristics of Thermal Comfort in Environment Chamber for Winter

  • Kim, Kyung-Hoon;Park, Jong-Il;Song, Yong-Gil
    • International Journal of Air-Conditioning and Refrigeration
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    • 제8권1호
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    • pp.73-83
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    • 2000
  • The purpose of this study is to analyze and characterize the correlation of the thermal comfort sensation with physiological responses for men in winter indoor environment. A number of experiments were conducted under twenty different environmental conditions with college male students. Clinical information on each participant was reported in terms of electrocardiogram (ECG), electroencephalogram (EEG) and self-centered evaluation. The comfort zone in winter is found, throughout the study, at Standard New Effective Temperature (SET$T^+$) of 25.2$^{\circ}C$, Predicted Mean Vote (PMV) between 0.27 and 0.62, and Thermal Sensation Vote (TSV) in the range of -0.76 and 0.36. The largest difference in skin temperature is measured at the calf area with respect to air temperature changes. Skin sensitivity to environment temperature is explained as calf, head, chest and abdomen in descending order. Change in heat rate is analyzed to be in parallel with that of SET$T^+$.

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Yield Enhancement Techniques for 3D Memories by Redundancy Sharing among All Layers

  • Lee, Joo-Hwan;Park, Ki-Hyun;Kang, Sung-Ho
    • ETRI Journal
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    • 제34권3호
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    • pp.388-398
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    • 2012
  • Three-dimensional (3D) memories using through-silicon vias (TSVs) will likely be the first commercial applications of 3D integrated circuit technology. A 3D memory yield can be enhanced by vertical redundancy sharing strategies. The methods used to select memory dies to form 3D memories have a great effect on the 3D memory yield. Since previous die-selection methods share redundancies only between neighboring memory dies, the opportunity to achieve significant yield enhancement is limited. In this paper, a novel die-selection method is proposed for multilayer 3D memories that shares redundancies among all of the memory dies by using additional TSVs. The proposed method uses three selection conditions to form a good multi-layer 3D memory. Furthermore, the proposed method considers memory fault characteristics, newly detected faults after bonding, and multiple memory blocks in each memory die. Simulation results show that the proposed method can significantly improve the multilayer 3D memory yield in a variety of situations. The TSV overhead for the proposed method is almost the same as that for the previous methods.

바닥 복사 난방시 바닥온도와 거주자 자세 변화에 따른 인체 반응에 관한 연구 (The Study of Human Response for Floor Surface Temperature and Resident's Posture Change)

  • 김동규;김세환
    • 설비공학논문집
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    • 제24권12호
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    • pp.846-851
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    • 2012
  • The radiant floor heating system is traditional heating system in korea. Radiant floor heating is small in vertical temperature difference, air stream and radiant heat distribution is uniform. And radiant floor heating system provide thermal comfort conditions to the a resident. This study was undertaken to evaluate the physiological-subjective responses of the resident's posture change such as sitting and standing. The experimental investigations were carried out in climate chamber, and subjects were 4 college-age students in good health. The physiological response was skin temperature and subjective response was undertaken survey of TSV and CSV. The results were summarized as follows; The comfortable temperature range of plantar surface was $35.1{\sim}38.9^{\circ}C$ and buttock surface was $37.8{\sim}39.3^{\circ}C$.

3차원 구조 DRAM의 캐시 기반 재구성형 가속기 (A Cache-based Reconfigurable Accelerator in Die-stacked DRAM)

  • 김용주
    • 정보처리학회논문지:컴퓨터 및 통신 시스템
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    • 제4권2호
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    • pp.41-46
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    • 2015
  • 컴퓨터 사용 환경이 모바일 시장 및 소형 전자기기 시장 등으로 다양해짐에 따라 저전력 고성능 시스템에 대한 요구도 커지고 있다. 3차원 die-stacking 기술은 한정된 공간에서 DRAM의 집적도과 접근 속도를 높여 차세대 공정방식으로 많은 연구가 되고 있다. 이 논문에서는 3차원 구조의 DRAM 로직층에 재구성형 가속기를 구현하여 저전력 고성능 시스템을 구성하는 방법을 제안한다. 또한 재구성형 가속기의 지역 메모리로 캐시를 적용하고 활용하는 방법에 대해서 논의한다. DRAM의 로직층에 재구성형 가속기를 구현할 경우 위치적인 특성으로 데이터 전송 및 관리에 필요한 비용이 줄어들어 성능을 크게 향상시킬 수 있다. 제안된 시스템에서는 최대 24.8의 스피드업을 기록하였다.

에어컨 장시간 운전시 온열쾌적감 평가에 관한 연구 (The Analysis for Thermal Comfort Evaluation during long time operating Air Conditioner)

  • 김동규;박종일;김세환
    • KIEAE Journal
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    • 제7권5호
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    • pp.59-64
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    • 2007
  • Using air conditioner has been increased in home or office buildings in summer. Also various problems related to air conditioning such as disease induction happened by using air conditioner excessively and operating long. Active operation control is needed for occupant's health when air conditioner operates long. We should think ahead to acquire thermal comfort of occupants which represents psychological and physiological reaction for this operation. Research has been progressed to observe activity of autonomic nervous system by trying to quantitate change of thermal comfort. In this study, questions of the subject and change of body's autonomic nervous system were chosen to evaluate thermal comfort during operation of air conditioner for a long time. Electrocardiogram and questions of the subject which is the progress of changing TSV and CSV by occupants indoor were measured when room air conditioner is operated for a long time, and an air-conditioned adaptability of human body was evaluated by acquiring the change rate of autonomic nervous system through analyzing HRV. As a result of the evaluation, change rate of body's autonomic nervous system corresponded to votes of the subject's question generally, but was distinguished from analysis result of warm-cold sensation in a low temperature area.

3D Measurement of TSVs Using Low Numerical Aperture White-Light Scanning Interferometry

  • Jo, Taeyong;Kim, Seongryong;Pahk, Heuijae
    • Journal of the Optical Society of Korea
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    • 제17권4호
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    • pp.317-322
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    • 2013
  • We have proposed and demonstrated a low numerical aperture technique to measure the depth of through silicon vias (TSVs) using white-light scanning interferometry. The high aspect ratio hole like TSV's was considered to be impossible to measure using conventional optical methods due to low visibility at the bottom of the hole. We assumed that the limitation of the measurement was caused by reflection attenuation in TSVs. A novel interference theory which takes the structural reflection attenuation into consideration was proposed and simulated. As a result, we figured out that the low visibility in the interference signal was caused by the unbalanced light intensity between the object and the reference mirror. Unbalanced light can be balanced using an aperture at the illumination optics. As a result of simulation and experiment, we figured out that the interference signal can be enhanced using the proposed technique. With the proposed optics, the depth of TSVs having an aspect ratio of 11.2 was measured in 5 seconds. The proposed method is expected to be an alternative method for 3-D inspection of TSVs.

Environmental Modeling and Thermal Comfort in Buildings in Hot and Humid Tropical Climates

  • Muhammad Awaluddin Hamdy;Baharuddin Hamzah;Ria Wikantari;Rosady Mulyadi
    • Architectural research
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    • 제25권4호
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    • pp.73-84
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    • 2023
  • Indoor thermal conditions greatly affect the health and comfort of humans who occupy the space in it. The purpose of this research is to analyze the influence of water and vegetation elements as a microclimate modifier in buildings to obtain thermal comfort through the study of thermal environment models. This research covers two objects, namely public buildings and housing in Makassar City, South Sulawesi Prov-ince - Indonesia. Quantitative methods through field surveys and measurements based on thermal and personal variables. Data analysis based on ASHRAE 55 2020 standard. The data was processed with a parametric statistical approach and then simulated with the Computational Fluid Dynamics (CFD) simulation method to find a thermal prediction model. The model was made by increasing the ventilation area by 2.0 m2, adding 10% vegetation with shade plant characteristics, moving water features in the form of fountains and increasing the pool area by 15% to obtain PMV + 0.23, PPD + 8%, TSV-1 - +0, Ta_25.7℃, and relative humidity 63.5 - 66%. The evaluation shows that the operating temperature can analyze the visitor's comfort temperature range of >80% and comply with the ASHRAE 55-2020 standard. It is concluded that water elements and indoor vegetation can be microclimate modifiers in buildings to create desired comfort conditions and adaptive con-trols in buildings such as the arrangement of water elements and vegetation and ventilation systems to provide passive cooling effects in buildings.