• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1237-1241
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• 2003

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

• 디자인학연구
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• 제16권3호
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• pp.151-160
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• 2003

21세기의 정보화 시대에는 국가간, 지역간 무역의 장벽이 사라지고 다변화하는 무한경쟁시대로 변모하게 될 것이다. 포장산업은 판매부터 폭넓은 시장에서 모든 계층의 소비자 욕구를 충족시키는 기업위주의 마케팅 활동이 가능하였다. 따라서 이 시대에 요구되는 술 포장디자인은 시장구조가 양적, 질적으로 다양해지면서 제품이미지를 계획적으로 통제, 운영하지 않으면 자사 브랜드의 시장력이 저하될 수 밖에 없는 현실이다. 이제 술 포장디자인은 물질적, 생산지 1차 기능의 충족을 위한 수단으로만 존재하는 것이아니라 인간의 만족과 정서적 풍요로움을 가능하게 해줄 수 있어야만 한다. 그러한 가치 형성의 배경은 여러 가지 다각적 측면으로 분석되어진다. 술 포장디자인 그 시대의 기초와 취미 소비자의 질서가 가장 적절하게 표현되는 대중문화를 선동하는 사회적, 문화적 파급효과에 이르고 있다. 그리한 변화에 따라 소비자의 의식구조, 라이프 스타일 변화 시장 구조 계층을 변화시켰으며 술 시장의 세분화를 더욱 더 촉진 시켰다고 할 수 있다. 이에 본 논문은 세분화된 소비계층의 중심인 술 포장디자인의 커뮤니케이션 할 수 있는 효율성을 도모하고 술 소비자의 계층구조에 대한 이론적 고찰을 하고자한다. 또한 술 포장디자인의 전략의 특성을 파악하고, 술 포장디자인이라는 매개체를 통하여 상호유기성 통하여 보다 효율적인 소비자 커뮤니케이션에 접근토록 하는 새로운 전략적 방안을 제시하고자 한다.

• 한국정밀공학회지
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• 제17권12호
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• pp.88-93
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• 2000

The reduction of the cushion material such as Expanded Polystyrene (EPS) is one of the urgent tasks of the package design process in home electrical appliances considering environmental protection. EPS reduction often causes the structural damage of products, which must be protected in the environment of transportation. CAE simulation can help the efficient package design with low material cost. The mechanical drop simulation of packaged product was performed with commercial FEM code and Taguchi approach was used partially to determine the dominant design parameters. As results of this study, about 20% reduction of EPS was accomplished in the monitor package design.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2004년도 전력전자학술대회 논문집(1)
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• pp.321-324
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• 2004

This paper presents a package IC containing some components of DC/DC converter block for mobile phone's sub OLED(Organic Light Emitting Display). Package IC contains a load switch, a control IC, a diode, a switch for on/off operation, and a switch for changing output voltage. It operates with switching frequency of 100kHz, within the range of input voltage, $3.2V\~5.5V$. Duty ratio can be changed up to $93\%$, and maximum power efficiency is $85\%$. This package IC is loaded onto three model of 1.2W mobile phone's sub-OLED.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1565-1568
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• 2003

The backward extrusion process is one of the commonly used metal forming processes. In this paper. a battery case which has the rectangular section, is analyzed using a 3D metal forming package(MSC.Superforge). This pacakge uses the finite volume analysis method. It is shown that the MSC.Superforge package using finite volume method provides result very close to those obtained from a finite element analysis package(MSC.Superform). However, the simulation time using the finite volume method was almost 10 % of the simulation time consumed by the other package using finite element method. Moreover, the finite volume method used in MSC.Superforge can eliminate the remeshing problems that make the simulating a metal forming process with severe deformation, such as the extrusion process, so difficult.

• 대한의용생체공학회:학술대회논문집
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• 대한의용생체공학회 1993년도 춘계학술대회
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• pp.66-69
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• 1993

We have developed a software package for the analysis of electric field distribution in human body. It includes the graphical finite element mesh generator, linear system of equations solver using sparse matrix and vector technique, and post-processor for the display of the results. This software package can be used in various research areas of biomedical engineering where we inject current or apply voltage to human body. The software package was developed on Macintosh II computer and the size of the model is only limited by the main memory.

• 한국산학기술학회논문지
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• 제7권6호
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• pp.1134-1141
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• 2006

자바는 실행 플랫폼에 독립적이고 모바일 분야(J2ME)로부터 엔터프라이즈 환경(J2EE)에 이르는 다양하고도 일관된 솔루션을 제공하여 이기종 분산 애플리케이션 환경을 위해 적합한 개발 도구로 평가받고 있다. 본 연구에서는 자바 애플리케이션을 개발할 때 필요로 하는 접근제어 모듈을 자바 패키지 형태로 구현하여 제공함으로써 애플리케이션의 개발 기간을 단축시키고 시스템 관리자들이 보다 편리하게 접근제어 관리를 할 수 있도록 하였다. 구현된 모듈은 역할기반 접근제어(RBAC) 모델을 기초로 하고 자바 패키지 및 접근제어 관리도구를 포함한다.

• 대한공간정보학회지
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• 제1권2호
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• pp.167-175
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• 1993

본 연구에서는 교통모형의 기술적인 단점을 보완하기 위하여 교통모형과 지리정보시스템을 결합하는데 있어서 교통모형의 입력자료를 지리정보시스템의 위상구조에서 추출하여 교통모형의 단점을 극복해 보는데 있다. 또한, 그래픽 기능을 이용하여 교통모형의 결과치를 화면상에서 직접 보여줌으로서 의사결정과정에 효율적으로 대처할 수 있을 것으로 보인다. 이 시스템은 특정도시나 지역에 쓰여질 수 있고, 하드웨어 발달에 따른 컴퓨터 사용시간 및 자료 입력시의 오류의 절감과 지리정보시스템의 교통에로의 응용을 가능케 할 것이며, 여행자 정보시스템(ATIS: Advanced Traveler Information Systems)에 활용할 수 있는 주행안내시스템(Route Guidence System) 또는 차량항법시스템(Vehicle Navigation System)의 기초적 자료 및 시스템 개발에 기여할 것이다.

• 동아시아식생활학회지
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• 제6권3호
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• pp.335-344
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• 1996

This study was to investigate consumer recognition on food label of food package. The results of this study were as follows: 1. when shopping for food, the items considered the most were taste of family, food safety, nutrition and price, respectively. 2. 95.5% of respondents confirmed of the food label of food package when shopping for food. The items confirmed the most on food label were expiration date, manufacture date, manufacturer, food additives and nutrition, respectively. 3. 85.3% of respondents did not satisfy on the food label of food label of food package. 43.6% of respondents demanded food additives more detailed. 28.2% of respondents demanded nutrition information more detailed. 28.2% of respondents demanded food function more detailed. 4. The food which respondents satisfied on food label most were snack '||'&'||' cookies, nuddle, spices, can '||'&'||' bottled food, instant food, processed meat foo, frozen food and imported food, respectively. 5. The group with the most hphrases falling in the top rank was nutrition/calories. The phrases in the nutrition/calories group scored in the top rank were 3 "positive" nutritional characteristics(addition of vitamins, addition of DHA, high dietary fiber) and 5 "nagative" nutritional characteristics(no sugar, low sugar, low calories, low salt and low cholesterol). The group with the most phrases falling in the third rank was ingredient. The phrases in the ingredient scored in the third rank were add of food additives. 6. 55.5% of respondents did not know Recommended Daily Allowance(RDA) information and 61.9% of respondents did not understand the nutrition declaration(content) of food package but 65.7% of resspondents understood the nutrition claim of food package. From these result, respondents were more affected by nutrition claim than by nutrition declaration on food package when shopping for food.ood.